A two-layer 3D SiN photonic interposer achieves a fully connected 12-node network with 150 intralayer crossings (69.7% reduction) and 45.8% lower average waveguide loss than planar routing, below the 153-crossing planar lower bound.
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Scalable 3D silicon nitride photonic interposer for high-density optical interconnects
A two-layer 3D SiN photonic interposer achieves a fully connected 12-node network with 150 intralayer crossings (69.7% reduction) and 45.8% lower average waveguide loss than planar routing, below the 153-crossing planar lower bound.