A processability map linking Kerr self-focusing depth to separation stress and surface roughness is demonstrated for femtosecond-laser slicing of 4H-SiC wafers.
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2026 1verdicts
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Self-Focusing Control for Depth-Precise Wafer Slicing of 4H-SiC in Femtosecond Laser Processing
A processability map linking Kerr self-focusing depth to separation stress and surface roughness is demonstrated for femtosecond-laser slicing of 4H-SiC wafers.