A homogenization-based transient thermal analysis workflow is demonstrated for 3D heterogeneous integrated chip stacks using layout file inputs to generate effective property maps.
An extension of the Hill–Mandel principle for transient heat conduction in hetero- geneous media with heat generation incorporating finite RVE ther- mal inertia effects
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Transient Multiscale Workflow for Thermal Analysis of 3DHI Chip Stack
A homogenization-based transient thermal analysis workflow is demonstrated for 3D heterogeneous integrated chip stacks using layout file inputs to generate effective property maps.