Thermal-crystal plasticity simulations combined with dynamic mode decomposition show that thermal stress responses under cyclic loading can be compactly represented as superpositions of frequency-dependent temporal modes.
Stored energy density solution for TSV-Cu structure deformation under thermal cyclic loading based on PINN
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Frequency-dependent stress response under thermal cycle: A thermal-crystal plasticity and dynamic mode decomposition study
Thermal-crystal plasticity simulations combined with dynamic mode decomposition show that thermal stress responses under cyclic loading can be compactly represented as superpositions of frequency-dependent temporal modes.