EUV scatterometry measured a copper interconnect dishing depth of 1.60 +/- 0.05 nm, and Fisher information analysis predicts optimal sensitivity near 14 nm wavelength at specific incidence angles.
Raymond, Overview of scatterometry applications in high volume silicon manufacturing, AIP Conference Proceedings 788, 394--402 (2005)
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Coherent EUV scatterometry of 2D periodic structure profiles with mathematically optimal experimental design
EUV scatterometry measured a copper interconnect dishing depth of 1.60 +/- 0.05 nm, and Fisher information analysis predicts optimal sensitivity near 14 nm wavelength at specific incidence angles.