ChatSVA achieves 96.12% functional pass rate and 82.5% coverage in SVA generation on 24 RTL designs, delivering 33 percentage point gains and 11x better coverage than prior state-of-the-art.
Efficient ML-Based Transient Thermal Prediction for 3D- ICs,
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The paper reviews multiscale thermal modeling techniques for 3D ICs, unifying scales from device to system while stressing thermal boundary resistance and validation needs.
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ChatSVA: Bridging SVA Generation for Hardware Verification via Task-Specific LLMs
ChatSVA achieves 96.12% functional pass rate and 82.5% coverage in SVA generation on 24 RTL designs, delivering 33 percentage point gains and 11x better coverage than prior state-of-the-art.
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A Review of Multiscale Thermal Modeling in Heterogeneous 3D ICs
The paper reviews multiscale thermal modeling techniques for 3D ICs, unifying scales from device to system while stressing thermal boundary resistance and validation needs.