Numerical comparison of dual-network, REV-scale, and pore-resolved models shows homogenization-based effective parameters best match reference results for local thermal non-equilibrium when interfacial resistance is high.
Kapitza Resistance,
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The paper reviews multiscale thermal modeling techniques for 3D ICs, unifying scales from device to system while stressing thermal boundary resistance and validation needs.
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Local Thermal Non-Equilibrium Models in Porous Media: A Comparative Study of Conduction Effects
Numerical comparison of dual-network, REV-scale, and pore-resolved models shows homogenization-based effective parameters best match reference results for local thermal non-equilibrium when interfacial resistance is high.
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A Review of Multiscale Thermal Modeling in Heterogeneous 3D ICs
The paper reviews multiscale thermal modeling techniques for 3D ICs, unifying scales from device to system while stressing thermal boundary resistance and validation needs.