FSA-Heat, a frequency-spatial dual-domain network, predicts 2.5D IC temperature and gradient maps with over 99% lower RMSE and 4.23x faster inference than a GCN-based baseline on HotSpot data.
Architecture, chip, and package codesign flow for interposer-based 2.5-D chiplet integration enabling heterogeneous IP reuse,
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A Novel Frequency-Spatial Domain Aware Network for Fast Thermal Prediction in 2.5D ICs
FSA-Heat, a frequency-spatial dual-domain network, predicts 2.5D IC temperature and gradient maps with over 99% lower RMSE and 4.23x faster inference than a GCN-based baseline on HotSpot data.