ProForm is a thermoforming-based method that mounts surface-mount components with conductive tape and a plastic layer instead of solder, enabling reversible assembly and component reuse across rigid, flexible, and paper substrates.
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ProForm: Solder-Free Circuit Assembly Using Thermoforming
ProForm is a thermoforming-based method that mounts surface-mount components with conductive tape and a plastic layer instead of solder, enabling reversible assembly and component reuse across rigid, flexible, and paper substrates.