The paper reviews multiscale thermal modeling techniques for 3D ICs, unifying scales from device to system while stressing thermal boundary resistance and validation needs.
A Novel through Mold Plate (TMP) for Signal and Thermal Integrity Improvement of High Bandwidth Memory (HBM),
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A Review of Multiscale Thermal Modeling in Heterogeneous 3D ICs
The paper reviews multiscale thermal modeling techniques for 3D ICs, unifying scales from device to system while stressing thermal boundary resistance and validation needs.