Splitting a chip into two stacked 3D tiers and obfuscating the vertical connections protects against both IP theft and targeted hardware-Trojan insertion with moderate PPA overhead.
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A Modern Approach to IP Protection and Trojan Prevention: Split Manufacturing for 3D ICs and Obfuscation of Vertical Interconnects
Splitting a chip into two stacked 3D tiers and obfuscating the vertical connections protects against both IP theft and targeted hardware-Trojan insertion with moderate PPA overhead.