Thermal bonding of two Borofloat glass wafers around a 50-nm silicon nitride core yields low-confinement waveguides with ~60% fiber-chip transmission and ~0.6–1 dB/cm effective propagation loss.
Planar waveguides with less than 0.1 db/m propagation loss fabricated with wafer bonding
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Low-confinement silicon nitride waveguides manufactured via direct glass bonding
Thermal bonding of two Borofloat glass wafers around a 50-nm silicon nitride core yields low-confinement waveguides with ~60% fiber-chip transmission and ~0.6–1 dB/cm effective propagation loss.