A coupled Kirchhoff-Love plate and Reynolds lubrication finite element model for wafer-to-wafer bonding is derived and implemented in FEniCSx, reproducing experimental probe-displacement histories.
The remarkable bending properties of perforated plates.Journal of the Mechanics and Physics of Solids, 154:104514, 2021
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Wafer-to-Wafer Bonding: Part: I -- The Coupled Physics Problem and the 2D Finite Element Implementation
A coupled Kirchhoff-Love plate and Reynolds lubrication finite element model for wafer-to-wafer bonding is derived and implemented in FEniCSx, reproducing experimental probe-displacement histories.