A position paper suggesting that 3D integration can be exploited for side-channel shielding, split fabrication, circuit camouflage, and secure processing-in-memory, without measured results.
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Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges
A position paper suggesting that 3D integration can be exploited for side-channel shielding, split fabrication, circuit camouflage, and secure processing-in-memory, without measured results.