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Corrigendum to “Systematically engineered thermal metastructure for rapid heat dissipation/diffusion by considering the thermal eigenvalue” [Appl. Therm. Eng. 159 (2019) 113487]

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Correction Crossref 1 open · 1 total · 0 disputed
DOI
10.1016/j.applthermaleng.2019.03.058
Notice DOI
10.1016/j.applthermaleng.2019.114690
Event date
2019-11-26
Machine twin
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01One-hop citing occurrences

Correction Open
Large-Scale Topology Optimisation of Time-dependent Thermal Conduction Using Space-Time Finite Elements and a Parallel Space-Time Multigrid Preconditioner

ref [46] · 2508.09589 · notice #8633 · dispute

Raw extraction · citation context

Langelaar, Reducing time and memory requirements in topology optimization of transient problems, International Journal for Numerical Methods in Engineering 125 (2024) e7461. doi:10.1002/nme.7461. [46] J. Hyun, S. Wang, Systematically engineered thermal metastructure for rapid heat dissipation /diffusion by considering the thermal eigen- value, Applied Thermal Engineering 157 (2019) 113487. doi:https://doi.org/10.1016/j.applthermaleng.2019.03.058. [47] J. Hyun, H. A. Kim, Level-set topology optimization for e ffective control of transient conductive heat response using eigenvalue, Interna- tional Journal of Heat and Mass Transfer 176 (2021) 121374. doi:10.1016/j.ijheatmasstransfer.2021.121374. [48] S. Onodera, T. Yamada, A topology optimization method for managing transient thermal and vibration e ffects with eigenvalues and steady-

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