Pith. sign in

REVIEW

Large Transverse Thermopower in Shape-Engineered Tilted Leg Thermopile

Not yet reviewed by Pith; the record is open.

This paper has not been read by Pith yet. Machine review is queued; the pith claim, tier, and objections will appear here once it completes.

SPECIMEN: schema-true, not a live event

T0 review · schema-true

One-sentence machine reading of the paper's core claim.

pith:XXXXXXXX · record.json · timestamp

arxiv 2401.11178 v1 pith:GEOGUTTA submitted 2024-01-20 physics.app-ph

classification physics.app-ph
keywords voltagedeviceoutputtransversedevicesdirectionfurtheradditional
verification ladder T0 review T1 audit T2 compute T3 formal

Signed reviews

No signed human review yet.

0 comments
read the original abstract

We demonstrate that a novel device design, where a shape-engineered tilted-leg thermopile structure is employed, significantly enhances the output voltage in the transverse direction. Owing to the shape engineering of the leg geometry, an additional temperature gradient develops along the long direction of the leg, which is perpendicular to the direction of the applied temperature gradient, thereby generating an additional Seebeck voltage V_SE that adds to the Anomalous Nernst effect (ANE) voltage V_ANE. We further show that a simple adjustment of electrode position within the device can further increase V_SE. The tilted leg device with electrode adjustment demonstrates a 990% enhanced transverse output voltage compared to that of conventional rectangular leg thermopile-structured devices, wherein only the ANE occurs. This combined output voltage from both the Seebeck effect and ANE is equivalent to the value that surpasses the state-of-the-art ANE materials and devices currently available. The numerical analysis shows the tendencies of the electrical and thermal outputs of the tilted-leg device, which guides a way to further improve the output voltage. Our study paves the way to develop highly efficient transverse TE devices that can overcome intrinsic materials challenges by utilizing the degree of freedom of device design.

Discussion (0). Continue with ORCID to comment.

Pith tools