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Characterisation of analogue Monolithic Active Pixel Sensor test structures implemented in a 65 nm CMOS imaging process

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arxiv 2403.08952 v1 pith:3EQY2K63 submitted 2024-03-13 physics.ins-det

Gianluca Aglieri Rinella , Giacomo Alocco , Matias Antonelli , Roberto Baccomi , Stefania Maria Beole , Mihail Bogdan Blidaru , Bent Benedikt Buttwill , Eric Buschmann
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This is my paper · ORCID
classification physics.ins-det
keywords pixelanalogueprocessactivecmoslevelsmonolithicresults
verification ladder T0 review T1 audit T2 compute T3 formal
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abstract

Analogue test structures were fabricated using the Tower Partners Semiconductor Co. CMOS 65 nm ISC process. The purpose was to characterise and qualify this process and to optimise the sensor for the next generation of Monolithic Active Pixels Sensors for high-energy physics. The technology was explored in several variants which differed by: doping levels, pixel geometries and pixel pitches (10-25 $\mu$m). These variants have been tested following exposure to varying levels of irradiation up to 3 MGy and $10^{16}$ 1 MeV n$_\text{eq}$ cm$^{-2}$. Here the results from prototypes that feature direct analogue output of a 4$\times$4 pixel matrix are reported, allowing the systematic and detailed study of charge collection properties. Measurements were taken both using $^{55}$Fe X-ray sources and in beam tests using minimum ionizing particles. The results not only demonstrate the feasibility of using this technology for particle detection but also serve as a reference for future applications and optimisations.

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  1. Characterisation of analogue MAPS produced in the 65 nm TPSCo process

    physics.ins-det 2024-11 conditional novelty 5.0 of 10

    CE-65v2 MAPS test structures in 65 nm TPSCo show about 5% gain uniformity, around 1.5 to 2 micrometer spatial resolution at low thresholds, and over 99% efficiency up to roughly 180 electron seed threshold for the Mod...

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