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Paper Citation Record · LEDGER

MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures

As of 6 August 2026, this Paper Citation Record lists 0 of 0 outbound references and 2 inbound Pith citation observations for arXiv:2410.09188.

A citation records a reference. It does not transfer a finding from one paper to another.

pith.paper-citation-record.v1
2410.09188 v4

Coverage vector

measured 0 of 0 reference resolution

Typed states for the displayed outbound observations.

Source: paper_references, paper_reference_links

measured 2 of 2 standing notices

One-hop event checks from named stored sources.

Source: scholarly_work_events, retraction_status_cache, observed 2026-08-05T06:32:48.257954+00:00

measured 2 of 2 inbound itemization

Pith citing papers itemized under the disclosed page cap.

Source: paper_references, paper_reference_links, observed 2026-08-05T23:22:35.742381Z

measured 0 of 1 external citation measurements

A source-named dated measurement, never combined with another source.

Source: arxiv_reference, observed 2026-05-11T15:47:24.147863Z

Reference resolution

0 of 0 outbound references displayed

  • verified exact0
  • verified fuzzy0
  • unresolved0
  • parse uncertain0
  • malformed identifier0
  • metadata mismatch0

External citation measurements

No source-named external measurement is stored.

Outbound references

No outbound reference observations are available for this paper version.

Pith citing papers

Observation 1ff8a171-9348-453f-a048-4fb0b0a6e292 · inbound

A 20-Year Retrospective on Power and Thermal Modeling and Management cites this paper.

A 20-Year Retrospective on Power and Thermal Modeling and Management MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures

Reference 17

Resolution
unresolved
no resolver link, observed 2026-08-05T23:22:35.742381Z

Source-reported events for the cited work

Unavailable: canonical work link unavailable.

source=arxiv_source observed=2026-08-05T23:22:35.742381Z digest=sha256:09b07ef60c56d0fc10b680bcd147619955d50871d353b4bef448a846b6eb9846

Observation 43bd10e2-8a4f-4c09-bc2d-638beef07e7a · inbound

Transient Multiscale Workflow for Thermal Analysis of 3DHI Chip Stack cites this paper.

Transient Multiscale Workflow for Thermal Analysis of 3DHI Chip Stack MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures

Reference 10

Resolution
verified exact
arxiv_id, observed 2026-05-11T15:47:24.279384Z

Source-reported events for the cited work

No event found in the named queried sources as of 2026-08-05T06:32:48.257954+00:00.

source=pdf_text observed=2026-05-09T19:11:46.643488Z digest=sha256:b471492dd6fd4a024792e2e126c6f99bf6eabd3ebdd2806c2856eb54d1acefb2