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Communication Characterization of AI Workloads for Large-scale Multi-chiplet Accelerators
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Next-generation artificial intelligence (AI) workloads are posing challenges of scalability and robustness in terms of execution time due to their intrinsic evolving data-intensive characteristics. In this paper, we aim to analyse the potential bottlenecks caused due to data movement characteristics of AI workloads on scale-out accelerator architectures composed of multiple chiplets. Our methodology captures the unicast and multicast communication traffic of a set of AI workloads and assesses aspects such as the time spent in such communications and the amount of multicast messages as a function of the number of employed chiplets. Our studies reveal that some AI workloads are potentially vulnerable to the dominant effects of communication, especially multicast traffic, which can become a performance bottleneck and limit their scalability. Workload profiling insights suggest to architect a flexible interconnect solution at chiplet level in order to improve the performance, efficiency and scalability of next-generation AI accelerators.
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MCMComm: Hardware-Software Co-Optimization for End-to-End Communication in Multi-Chip-Modules
MCMComm combines congestion-aware analytical modeling, diagonal links, on-package data redistribution, and GA/MIQP scheduling to reduce energy-delay product of chiplet-based AI accelerators by up to 2.7x in model-base...
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