Pith. sign in

REVIEW 3 major objections 6 minor 52 references

Conjugate Heat Transfer Effects on Bubble Growth During Flow Boiling Heat Transfer in Microchannels

T0 review · 3 major / 6 minor · reviewed 2026-08-12 · deepseek-v4-flash

Challenge this review Re-run · record.json Download PDF Read on arXiv ↗ Review JSON

Pith's one-line read Under a fixed base heat flux, a thicker bottom wall makes a growing bubble expand faster in a microchannel, because conduction along the solid spreads heat upstream and raises the superheat.

desk verdict Solid, incremental numerical sweep of conjugate heat transfer in microchannel boiling; the main trend is already in Lin et al., and the causal mechanism is over-stated, but the data are worth refereeing. read the letter →

arxiv 2411.15745 v1 pith:47UJUQMN submitted 2024-11-24 physics.flu-dyn

Odumuyiwa A. Odumosu , Hongying Li , Tianyou Wang , Zhizhao Che This is my paper · ORCID
classification physics.flu-dyn
keywords conjugateheattransferflowboilingmicrochannelbubblegrowthwallthicknessthermaldiffusivityvolume-of-fluidsink
verification ladder T0 review T1 audit T2 compute T3 formal

The pith

A machine-rendered reading of the paper's core claim, the machinery that carries it, and where it could break.

The reading

This paper asks whether the solid wall of a microchannel heat sink does more than just confine the boiling flow. By simulating a square microchannel with a base heat flux, it claims that the wall's own conduction sets the temperature field that a vapor bubble experiences, so the same heat flux produces different bubble growth for different wall thicknesses and materials. The reported trend is that thicker bottom walls grow bubbles faster: the wall spreads heat along the channel direction, the upstream solid-fluid interface becomes hotter and more superheated, and vaporization accelerates. A high-thermal-diffusivity material such as copper does the same in miniature: it diffuses heat from the source to the interface quickly, giving the largest bubble and the highest heat-transfer performance. If accepted, the study implies that conjugate heat transfer is a first-order control in microchannel boiling, not a correction.

What carries the argument

The central object is the conjugate heat-transfer coupling at the solid-fluid interface, where temperature and heat flux are matched between the two regions, together with a volume-of-fluid interface treatment with a phase-change model for evaporation. The load-bearing mechanism is axial heat conduction along the bottom wall: because the solid's conductivity exceeds the liquid's, a thicker wall spreads the base heat flux along the channel, raising the upstream interface temperature and superheat, which accelerates bubble growth.

What would settle it

Conduct the same simulations with a fixed-temperature bottom boundary or with heat removal from the top wall: if thicker walls no longer accelerate bubble growth, the axial-conduction mechanism is refuted.

Watch

Extended reading notes

Core claim

Under a fixed heat flux applied to the bottom base of the microchannel, the paper finds that increasing the bottom wall thickness from 20 to 160 micrometers increases the bubble growth rate, and that among silicon, aluminum, copper, and magnesium, copper gives the fastest growth and the highest Nusselt number (a dimensionless measure of convective heat transfer). The mechanism is axial conduction in the solid: because the solid conducts heat much better than the liquid, a thicker wall redistributes the applied heat along the channel, raising the upstream wall temperature, so the liquid-vapor interface ahead of the bubble is more superheated. That extra superheat drives faster evaporation, the bubble expands more, and the larger bubble perturbs the flow more strongly, further enhancing convection between wall and fluid. The conclusion is that the solid wall thickness and material are active parameters in flow-boiling performance even when the applied heat flux is identical.

Load-bearing premise

The load-bearing premise is that the heat sink is driven by a constant heat flux applied only to the bottom base, with the top and side walls adiabatic; if the wall is instead held at a fixed temperature, a thicker wall might be a thermal resistance rather than a heat spreader, reversing the trend.

Editorial extensions

If this is right

  • Microchannel flow-boiling models that ignore conduction in the solid wall will underpredict bubble growth in thick-walled heat sinks driven by constant base heat flux.
  • For a fixed heat flux, increasing the bottom wall thickness from 20 to 160 micrometers is predicted to increase both the bubble growth rate and the average Nusselt number at the heated wall.
  • Wall material selection matters independently of the applied flux: copper, with the highest thermal diffusivity among the tested materials, yields the fastest bubble growth and the highest Nusselt number.
  • The axial-conduction mechanism implies that upstream wall temperature, rather than only the local heat flux, determines the boiling intensity at a given location.
  • Heat-sink design can therefore exploit thick, high-diffusivity walls as deliberate heat spreaders to improve two-phase cooling under constant-flux conditions.

Reading between the lines

Editorial extensions of the paper, not claims the author makes directly.

  • The reported thickening benefit is tied to the constant-flux, insulated-top boundary condition; under a fixed wall temperature or top-side cooling, a thicker wall may instead act as a thermal resistance, possibly reversing the trend. The paper does not test this.
  • The mechanism suggests a design lever the paper does not explore: varying wall thickness along the channel, or using graded materials, to place the strongest superheat where nucleation is desired.
  • The single-bubble, half-channel symmetric setup leaves open whether the mechanism survives in dense bubble trains or with multiple nucleation sites, where neighboring bubbles compete for the same axial heat.
  • A direct extension would be to change the ratio of wall thickness to channel height, since the effect should scale with how much cross-sectional area is available for axial conduction.
Share X Bluesky LinkedIn Reddit HN

Editorial analysis

A structured set of objections, weighed in public.

Desk editor's note, referee report, and a circularity audit.

Referee Report

3 major / 6 minor

Summary. This paper reports numerical simulations of conjugate heat transfer during flow boiling of a single vapor bubble in a 200 µm square microchannel. Using the OpenFOAM multiRegionPhaseChangeFlow solver with a VOF interface-capturing method, the authors vary the bottom wall thickness (20–160 µm) and solid material (silicon, aluminum, copper, magnesium) while maintaining a constant heat flux at the bottom base wall. They report that thicker bottom walls and higher-thermal-diffusivity materials produce faster bubble growth, higher bubble acceleration, and larger Nusselt numbers. The mechanism proposed is that axial heat conduction in the solid wall redistributes heat upstream, raising the upstream wall temperature and hence the superheat experienced by the bubble when it enters the heated region.

Significance. If the proposed mechanism is correct, the paper offers a concrete design guideline: under constant-heat-flux conditions, thicker and more thermally diffusive walls can enhance boiling heat transfer by axial spreading of heat. The manuscript includes a mesh independence study and a validation of bubble equivalent diameter against one experimental dataset. The parametric sweeps over wall thickness and material are systematic, and the reported trends are internally consistent. However, the phenomenon itself has been partially reported in prior conjugate heat transfer studies (Refs. 43–45), and the new contribution lies mainly in the thickness-sweep evidence and the upstream-temperature explanation. The paper does not provide code or data, but the simulation setup is reproducible from the description. The main weakness is that the causal mechanism is asserted rather than quantitatively isolated from competing effects, notably thermal capacitance.

major comments (3)
  1. [Section III.B and Section IV] The statement that faster bubble growth with thicker walls is 'because of the heat conduction in the solid wall along the channel direction' is not uniquely supported by the presented data. Increasing Hb simultaneously increases the axial conduction cross-section and the thermal capacitance of the wall. During the growth interval (t ≈ 3.4–5 ms), the bubble locally cools the wall, and a thicker wall would cool more slowly because of its larger heat capacity, which can raise the interface temperature independently of axial conduction. The steady-state profiles at t = 2 ms in Figure 8(a) do demonstrate an axial-conduction effect on upstream temperature, but the paper does not quantify the relative contributions of axial conduction and thermal capacitance during the transient growth phase. A control simulation with anisotropic solid conductivity (e.g., zero in-plane conductivity) or an energy-budget decomposition is needed to support the causal claim as stated.
  2. [Section III.C] The material comparison attributes the bubble-growth trend to thermal diffusivity, but thermal diffusivity is not varied independently of thermal conductivity and volumetric heat capacity. For the four materials considered, the ordering is consistent with thermal diffusivity, but the same trends could also arise from differences in thermal capacitance or from a combination of parameters. A scaling analysis or additional simulations that vary thermal diffusivity while holding other properties fixed would be required to establish the claimed mechanism.
  3. [Section II.D] The validation against the experimental data of Mukherjee et al. covers a single condition, and no quantitative error metric or uncertainty quantification is reported for the other configurations. The authors should state the deviation between the simulated and experimental bubble diameters in Figure 3 and acknowledge that the thickness and material sweeps are not directly validated. In addition, the conclusions should note that the reported trend is tied to the constant-heat-flux, adiabatic-top/side boundary condition; under fixed-temperature or heat-loss boundary conditions, a thicker wall might act as a thermal resistance rather than a heat spreader.
minor comments (6)
  1. [Abstract] The phrase 'bubble growth is non-uniform' is ambiguous; the authors mean 'dependent on wall thickness and material,' not spatially non-uniform. Rephrasing would improve clarity.
  2. [Section II.A] The model name 'Hardt and Wandra' should be 'Hardt and Wondra' to match Reference 48.
  3. [Equations (10)–(12)] The average Nusselt number uses an overbar on h in Equation (10), while Equation (11) defines hbottom without an overbar. This notation should be reconciled.
  4. [Section II.B] The initial bubble description '1.1Dh length, 0.8Dh axial diameter' is confusing; 'axial diameter' is not a standard term, and the intended geometry should be clarified.
  5. [Figures 8–10 and 12–13] The legends in these figures appear garbled in the manuscript text (e.g., entries like 'Hb /s32/s61/s32/s50/...'). These should be replaced with readable labels such as 'Hb = 20 μm'.
  6. [Section IV] The conclusions do not mention the limitation of the pre-seeded bubble or the absence of a non-conjugate baseline. A brief statement of these limitations would help readers assess the scope of the claims.

Circularity Check

0 steps flagged · score 0.0 of 10

No significant circularity: the bubble-growth trends are direct simulation outputs, and the axial-conduction mechanism is an interpretation, not an imposed fit.

full rationale

The paper's central empirical claim—thicker bottom walls yield faster bubble growth at fixed heat flux (Figs. 7–10)—is generated by the OpenFOAM multiRegionPhaseChangeFlow solver, with no parameters fitted to the target bubble-growth curves. The model is validated against external experimental data from Mukherjee et al. (Ref. 50, Fig. 3), and the mesh-independence study is reported. The Nusselt number is a diagnostic computed from local heat flux and interface temperature (Eqs. 10–12), not a fitted output. The statement "As the bottom wall thickness increases, the bubble growth rate increases because of the heat conduction in the solid wall along the channel direction" is a causal interpretation of simulated temperature profiles in Fig. 8, not a definitional or fitted identity. The same simulations are used to support the mechanism, which may raise a scientific concern about a possible confound with thermal capacitance, but that is not circularity under the defined patterns. Self-citations (Refs. 39, 51, 52) appear only as background on wavy channels and convection enhancement, and no uniqueness theorem or ansatz is imported from them. There is therefore no quoteable step in the derivation chain that reduces to its own inputs, and the circularity score is 0.

Assumptions & free parameters 1 free parameters · 6 assumptions · 0 invented entities

The central claim rests on standard conservation equations plus several domain assumptions. No parameters are fitted to the target result; the main simulation conditions (heat flux, inlet velocity, initial bubble shape) are prescribed. The most consequential assumptions are the pre-seeded bubble and the adiabatic boundary conditions that make axial wall conduction the dominant mechanism.

free parameters (1)
  • Initial bubble size and shape = Length 1.1 Dh, diameter 0.8 Dh, spherical caps
    Chosen by hand in Section II.B; not fitted to the validation data. It sets the initial condition for the growth dynamics and could affect quantitative growth rates, though the paper's central trends are across wall thickness and material.
assumptions (6)
  • standard math Conservation equations for mass, momentum, energy, and VOF phase fraction describe the two-phase flow
    Equations (1)-(4) in Section II.A; standard continuum model for incompressible two-phase flow.
  • domain assumption Constant thermophysical properties for water vapor and liquid at saturation
    Table II; constant values assumed; surface tension held constant because temperature variation is small near Tsat.
  • domain assumption The solid wall obeys transient heat conduction with constant properties and no thermal contact resistance
    Equation (9); solid modeled only by conduction, coupled to fluid through temperature and heat flux continuity at the interface.
  • domain assumption Boundary conditions: constant heat flux at the bottom base, adiabatic elsewhere, symmetry planes
    Section II.B; these conditions define the conjugate problem and are required for the axial heat spreading mechanism.
  • ad hoc to paper A vapor bubble is pre-seeded rather than nucleated from the wall
    Section II.B; the initial bubble is a cylinder with spherical caps; nucleation, contact line dynamics, and bubble interactions are not modeled.
  • domain assumption The Hardt-Wondra phase change model accurately represents evaporation at the interface
    Section II.A; phase change source terms are computed with this model, which was developed for microscale phase change.

how reviews work

0 comments
Cite this review

Pith. "Pith review of Conjugate Heat Transfer Effects on Bubble Growth During Flow Boiling Heat Transfer in Microchannels." pith.science (2026). https://pith.science/paper/47UJUQMN

@misc{pith2026241115745,
  author       = {Pith},
  title        = {Pith review of: Conjugate Heat Transfer Effects on Bubble Growth During Flow Boiling Heat Transfer in Microchannels},
  year         = {2026},
  howpublished = {\url{https://pith.science/paper/47UJUQMN}},
  note         = {Machine review of arXiv:2411.15745}
}
read the original abstract

Flow boiling in microchannel heat sinks is an efficient way to dissipate high heat flux by utilizing the large surface-to-volume ratio and high latent heat. Previous studies of boiling heat transfer in microchannels mainly consider the fluid flow in channels only, but often neglect the conjugate effects of the heat conduction in the solid wall, which becomes important for microchannels because of the comparable sizes of the flow channel and the solid wall. In the present study, the effects of conjugate heat transfer on bubble growth during flow boiling in microchannels are examined by numerical simulation. The results indicate that the bubble growth is non-uniform for different bottom wall thicknesses or different solid materials even with the same heat flux at the wall. As the bottom wall thickness increases, the bubble growth rate increases because of the heat conduction in the solid wall along the channel direction. The increased bubble size also increases the perturbation to the flow field, and enhances the thermal convection between the fluid and the wall. For different solid materials, the high-thermal-diffusivity material possesses a higher heat transfer performance because of the quick diffusion of thermal energy from the heat source to the solid-fluid interface.

Figures

Figures reproduced from arXiv: 2411.15745 by the authors.

Figure 1
Figure 1. FIG. 1. Simulation setup for the conjugate heat transfer of flow boiling in a microchannel. (a) Full geometry of the channel. [PITH_FULL_IMAGE:figures/full_fig_p003_1.png] view at source ↗
Figure 2
Figure 2. FIG. 2. Mesh independence study: (a) dimensionless bubble volume [PITH_FULL_IMAGE:figures/full_fig_p005_2.png] view at source ↗
Figure 3
Figure 3. FIG. 3. Validation of the model by comparing the bubble equivalent diameter, [PITH_FULL_IMAGE:figures/full_fig_p005_3.png] view at source ↗
Figures from the paper (10 more)
Figure 4
Figure 4. Figure 4: FIG. 4. Time evolution of the flow boiling conjugate heat transfer in a typical microchannel: (a) bubble shapes and temperature [PITH_FULL_IMAGE:figures/full_fig_p006_4.png]
Figure 5
Figure 5. Figure 5: FIG. 5. Time variation of the dimensionless bubble positions (the rear [PITH_FULL_IMAGE:figures/full_fig_p007_5.png]
Figure 6
Figure 6. Figure 6: FIG. 6. Time variation of the temperature profiles at the solid-fluid interface of the heated bottom wall ( [PITH_FULL_IMAGE:figures/full_fig_p007_6.png]
Figure 7
Figure 7. Figure 7: FIG. 7. Flow boiling in silicon microchannels with different bottom wall thicknesses: (a, b) bubble shapes and temperature [PITH_FULL_IMAGE:figures/full_fig_p008_7.png]
Figure 8
Figure 8. Figure 8: FIG. 8. Temperature distribution for different bottom wall thicknesses at the solid-fluid interface of the heated bottom wall [PITH_FULL_IMAGE:figures/full_fig_p008_8.png]
Figure 9
Figure 9. Figure 9: FIG. 9. Nusselt number [PITH_FULL_IMAGE:figures/full_fig_p009_9.png]
Figure 10
Figure 10. Figure 10: FIG. 10. (a) Dimensionless bubble volume [PITH_FULL_IMAGE:figures/full_fig_p009_10.png]
Figure 11
Figure 11. Figure 11: FIG. 11. Flow boiling heat transfer in microchannels with different bottom solid materials, e.g., copper, silicon, aluminum, [PITH_FULL_IMAGE:figures/full_fig_p010_11.png]
Figure 12
Figure 12. Figure 12: FIG. 12. (a) Dimensionless bubble volume [PITH_FULL_IMAGE:figures/full_fig_p010_12.png]
Figure 13
Figure 13. Figure 13: FIG. 13. Nusselt number [PITH_FULL_IMAGE:figures/full_fig_p011_13.png]

Discussion (0). Continue with ORCID to comment.

Reference graph

Works this paper leans on

52 extracted references · 27 canonical work pages

  1. [1]

    author author I. A. \ Ghani , author N. A. C. \ Sidik , \ and\ author N. Kamaruzaman ,\ title title Hydrothermal performance of microchannel heat sink: The effect of channel design , \ 10.1016/j.ijheatmasstransfer.2016.11.031 journal journal International Journal of Heat and Mass Transfer \ volume 107 ,\ pages 21--44 ( year 2017 ) NoStop

    work page doi:10.1016/j.ijheatmasstransfer.2016.11.031 2016

  2. [2]

    author author K. C. \ Leong , author J. Y. \ Ho , \ and\ author K. K. \ Wong ,\ title title A critical review of pool and flow boiling heat transfer of dielectric fluids on enhanced surfaces , \ 10.1016/j.applthermaleng.2016.10.138 journal journal Applied Thermal Engineering \ volume 112 ,\ pages 999--1019 ( year 2017 ) NoStop

    work page doi:10.1016/j.applthermaleng.2016.10.138 2016

  3. [3]

    author author W. M. A. A. \ Japar , author N. A. C. \ Sidik , author R. Saidur , author Y. Asako , \ and\ author S. Nurul Akmal Yusof ,\ title title A review of passive methods in microchannel heat sink application through advanced geometric structure and nanofluids: Current advancements and challenges , \ 10.1515/ntrev-2020-0094 journal journal Nanotechn...

    work page doi:10.1515/ntrev-2020-0094

  4. [4]

    Municchi , author I

    author author F. Municchi , author I. El Mellas , author O. K. \ Matar , \ and\ author M. Magnini ,\ title title Conjugate heat transfer effects on flow boiling in microchannels , \ 10.1016/j.ijheatmasstransfer.2022.123166 journal journal International Journal of Heat and Mass Transfer \ volume 195 ,\ pages 123166 ( year 2022 ) NoStop

    work page arXiv 2022

  5. [5]

    author author N. A. C. \ Sidik , author M. N. A. W. \ Muhamad , author W. M. A. A. \ Japar , \ and\ author Z. A. \ Rasid ,\ title title An overview of passive techniques for heat transfer augmentation in microchannel heat sink , \ 10.1016/j.icheatmasstransfer.2017.08.009 journal journal International Communications in Heat and Mass Transfer \ volume 88 ,\...

    work page doi:10.1016/j.icheatmasstransfer.2017.08.009

  6. [6]

    Jain \ and\ author S

    author author S. Jain \ and\ author S. Gedupudi ,\ title title On the prediction of pressure fluctuations and pressure drop caused by confined bubble growth during flow boiling in a rectangular mini/micro-channel , \ 10.1080/01457632.2019.1670456 journal journal Heat Transfer Engineering \ volume 41 ,\ pages 1763--1783 ( year 2020 ) NoStop

    work page arXiv

  7. [7]

    \ Chen , author Y

    author author H.-X. \ Chen , author Y. Sun , author H.-Y. \ Xiao , \ and\ author X.-D. \ Wang ,\ title title Bubble dynamics and heat transfer characteristics on a micropillar-structured surface with different nucleation site positions , \ 10.1007/s10973-020-09301-x journal journal Journal of Thermal Analysis and Calorimetry \ volume 141 ,\ pages 447--464...

    work page doi:10.1007/s10973-020-09301-x

  8. [8]

    author author E. M. \ Fayyadh , author M. M. \ Mahmoud , author K. Sefiane , \ and\ author T. G. \ Karayiannis ,\ title title Flow boiling heat transfer of R134a in multi microchannels , \ 10.1016/j.ijheatmasstransfer.2017.03.057 journal journal International Journal of Heat and Mass Transfer \ volume 110 ,\ pages 422--436 ( year 2017 ) NoStop

    work page doi:10.1016/j.ijheatmasstransfer.2017.03.057 2017

Show all 52 references
  1. [9]

    author author S. V. \ Garimella ,\ title title Advances in mesoscale thermal management technologies for microelectronics , \ 10.1016/j.mejo.2005.07.017 journal journal Microelectronics Journal \ volume 37 ,\ pages 1165--1185 ( year 2006 ) NoStop

    2005 doi

  2. [10]

    author author T. G. \ Karayiannis \ and\ author M. M. \ Mahmoud ,\ title title Flow boiling in microchannels: Fundamentals and applications , \ 10.1016/j.applthermaleng.2016.08.063 journal journal Applied Thermal Engineering \ volume 115 ,\ pages 1372--1397 ( year 2017 ) NoStop

    2016 doi

  3. [11]

    Liu , author W

    author author Q. Liu , author W. Wang , author B. Palm , author C. Wang , \ and\ author X. Jiang ,\ title title On the dynamics and heat transfer of bubble train in micro-channel flow boiling , \ 10.1016/j.icheatmasstransfer.2017.07.002 journal journal International Communicat...

    doi

  4. [12]

    Magnini \ and\ author J

    author author M. Magnini \ and\ author J. R. \ Thome ,\ title title An updated three-zone heat transfer model for slug flow boiling in microchannels , \ 10.1016/j.ijmultiphaseflow.2017.01.015 journal journal International Journal of Multiphase Flow \ volume 91 ,\ pages 296--31...

    2017 doi

  5. [13]

    Magnini \ and\ author J

    author author M. Magnini \ and\ author J. R. \ Thome ,\ title title Computational study of saturated flow boiling within a microchannel in the slug flow regime , \ 10.1115/1.4031234 journal journal Journal of Heat Transfer \ volume 138 ,\ pages 021502 ( year 2016 ) NoStop

    doi

  6. [14]

    author author Y. K. \ Prajapati , author M. Pathak , \ and\ author M. K. \ Khan ,\ title title Numerical investigation of subcooled flow boiling in segmented finned microchannels , \ 10.1016/j.icheatmasstransfer.2017.06.009 journal journal International Communications in Heat ...

    2017 doi

  7. [15]

    author author A. M. \ Jacobi \ and\ author J. R. \ Thome ,\ title title Heat transfer model for evaporation of elongated bubble flows in microchannels , \ 10.1115/1.1517274 journal journal Journal of Heat Transfer \ volume 124 ,\ pages 1131--1136 ( year 2002 ) NoStop

    doi

  8. [16]

    Baldassari \ and\ author M

    author author C. Baldassari \ and\ author M. Marengo ,\ title title Flow boiling in microchannels and microgravity , \ 10.1016/j.pecs.2012.10.001 journal journal Progress in Energy and Combustion Science \ volume 39 ,\ pages 1--36 ( year 2013 ) NoStop

    2012 doi

  9. [17]

    author author S. S. \ Bertsch , author E. A. \ Groll , \ and\ author S. V. \ Garimella ,\ title title Review and comparative analysis of studies on saturated flow boiling in small channels , \ 10.1080/15567260802317357 journal journal Nanoscale and Microscale Thermophysical En...

    doi

  10. [18]

    author author S. V. \ Garimella \ and\ author C. B. \ Sobhan ,\ title title Transport in microchannels - a critical review , \ 10.1615/AnnualRevHeatTransfer.v13.30 journal journal Annual Review of Heat Transfer \ volume 13 ,\ pages 1--50 ( year 2003 ) NoStop

    doi

  11. [19]

    author author S. T. \ Kadam , author I. Hassan , author R. Kumar , \ and\ author M. A. \ Rahman ,\ title title Bubble dynamics in microchannel: An overview of the state-of-the-art , \ 10.1007/s11012-020-01300-4 journal journal Meccanica \ volume 56 ,\ pages 481--513 ( year 202...

    doi

  12. [20]

    author author M. M. \ Nahar , author B. Ma , author K. Guye , author Q. H. \ Chau , author J. Padilla , author M. Iyengar , \ and\ author D. Agonafer ,\ title title Microscale evaporative cooling technologies for high heat flux microelectronics devices: Background and recent a...

  13. [21]

    author author J. R. \ Thome ,\ title title Boiling in microchannels: a review of experiment and theory , \ 10.1016/j.ijheatfluidflow.2003.11.005 journal journal International Journal of Heat and Fluid Flow \ volume 25 ,\ pages 128--139 ( year 2004 ) NoStop

    2003 doi

  14. [22]

    Bigham \ and\ author S

    author author S. Bigham \ and\ author S. Moghaddam ,\ title title Microscale study of mechanisms of heat transfer during flow boiling in a microchannel , \ 10.1016/j.ijheatmasstransfer.2015.04.034 journal journal International Journal of Heat and Mass Transfer \ volume 88 ,\ p...

    2015 doi

  15. [23]

    Gedupudi , author Y

    author author S. Gedupudi , author Y. Q. \ Zu , author T. G. \ Karayiannis , author D. B. R. \ Kenning , \ and\ author Y. Y. \ Yan ,\ title title Confined bubble growth during flow boiling in a mini/micro-channel of rectangular cross-section part I : Experiments and 1- D model...

    doi

  16. [24]

    Halon , author Z

    author author S. Halon , author Z. Krolicki , author R. Revellin , \ and\ author B. Zajaczkowski ,\ title title Heat transfer characteristics of flow boiling in a micro channel array with various inlet geometries , \ 10.1016/j.ijheatmasstransfer.2022.122549 journal journal Int...

  17. [25]

    Huh , author C

    author author C. Huh , author C. W. \ Choi , \ and\ author M. H. \ Kim ,\ title title Elongated bubble behavior during flow boiling in a microchannel , \ 10.1007/BF03177438 journal journal Journal of Mechanical Science and Technology \ volume 21 ,\ pages 1819--1827 ( year 2007...

    doi

  18. [26]

    Kumar , author G

    author author R. Kumar , author G. Singh , \ and\ author D. Mikielewicz ,\ title title Effect of asymmetric fluid flow distribution on flow boiling in a microchannel heat sink - an experimental investigation , \ 10.1016/j.applthermaleng.2022.118710 journal journal Applied Ther...

  19. [27]

    Rui , author F

    author author Z. Rui , author F. Zhao , author H. Sun , author L. Sun , \ and\ author H. Peng ,\ title title Experimental research on flow boiling thermal-hydraulic characteristics in novel microchannels , \ 10.1016/j.expthermflusci.2022.110755 journal journal Experimental The...

  20. [28]

    Tang , author Y

    author author J. Tang , author Y. Liu , author B. Huang , \ and\ author D. Xu ,\ title title Enhanced heat transfer coefficient of flow boiling in microchannels through expansion areas , \ 10.1016/j.ijthermalsci.2022.107573 journal journal International Journal of Thermal Scie...

    2022

  21. [29]

    Wang , author K

    author author Y. Wang , author K. Sefiane , author Z.-g. \ Wang , \ and\ author S. Harmand ,\ title title Analysis of two-phase pressure drop fluctuations during micro-channel flow boiling , \ 10.1016/j.ijheatmasstransfer.2013.11.012 journal journal International Journal of He...

    doi

  22. [30]

    Zhang , author L

    author author J. Zhang , author L. Lei , author F. Liang , author H. Li , author B. Sund\' e n , \ and\ author Z. Wu ,\ title title An improved method to visualize two regions of interest synchronously in microfluidics , \ 10.1016/j.flowmeasinst.2020.101715 journal journal Flo...

  23. [31]

    Zhang , author J

    author author Y. Zhang , author J. Wang , author W. Liu , \ and\ author Z. Liu ,\ title title Heat transfer and pressure drop characteristics of R134a flow boiling in the parallel/tandem microchannel heat sinks , \ 10.1016/j.enconman.2017.06.067 journal journal Energy Conversi...

    doi

  24. [32]

    Zhou , author B

    author author S. Zhou , author B. Shu , author Z. Yu , author Y. Huang , \ and\ author Y. Zhang ,\ title title Experimental study and mechanism analysis of the flow boiling and heat transfer characteristics in microchannels with different surface wettability , \ 10.3390/mi1208...

    doi

  25. [33]

    Lorenzini \ and\ author Y

    author author D. Lorenzini \ and\ author Y. K. \ Joshi ,\ title title Computational fluid dynamics modeling of flow boiling in microchannels with nonuniform heat flux , \ 10.1115/1.4037343 journal journal Journal of Heat Transfer \ volume 140 ,\ pages 011501 ( year 2018 ) NoStop

    doi

  26. [34]

    Ferrari , author M

    author author A. Ferrari , author M. Magnini , \ and\ author J. R. \ Thome ,\ title title Numerical analysis of slug flow boiling in square microchannels , \ 10.1016/j.ijheatmasstransfer.2018.03.012 journal journal International Journal of Heat and Mass Transfer \ volume 123 ,...

    2018 doi

  27. [35]

    Luo , author W

    author author Y. Luo , author W. Li , author K. Zhou , author K. Sheng , author S. Shao , author Z. Zhang , author J. Du , \ and\ author W. J. \ Minkowycz ,\ title title Three-dimensional numerical simulation of saturated annular flow boiling in a narrow rectangular microchann...

  28. [36]

    Magnini \ and\ author O

    author author M. Magnini \ and\ author O. K. \ Matar ,\ title title Numerical study of the impact of the channel shape on microchannel boiling heat transfer , \ 10.1016/j.ijheatmasstransfer.2020.119322 journal journal International Journal of Heat and Mass Transfer \ volume 15...

    2020

  29. [37]

    Siddique , author A

    author author A. Siddique , author A. Gb , author A. Agrawal , author S. K. \ Saha , \ and\ author A. Sharma ,\ title title Study of bubble growth and microchannel flow boiling heat transfer characteristics using dynamic contact angle model , \ 10.1016/j.tsep.2020.100743 journ...

  30. [38]

    Tian , author K

    author author Z. Tian , author K. Li , author Y. Zhang , author Z. Huang , author S. Xu , \ and\ author W. Gao ,\ title title Numerical simulation of microchannel flow boiling and critical heat flux under rolling motion , \ 10.1016/j.ijrefrig.2022.08.025 journal journal Intern...

    doi

  31. [39]

    author author O. A. \ Odumosu , author H. Xu , author T. Wang , \ and\ author Z. Che ,\ title title Growth of elongated vapor bubbles during flow boiling heat transfer in wavy microchannels , \ 10.1016/j.applthermaleng.2023.119987 journal journal Applied Thermal Engineering \ ...

    2023

  32. [40]

    Guo , author C.-Y

    author author Y. Guo , author C.-Y. \ Zhu , author L. Gong , \ and\ author Z.-B. \ Zhang ,\ title title Numerical simulation of flow boiling heat transfer in microchannel with surface roughness , \ 10.1016/j.ijheatmasstransfer.2022.123830 journal journal International Journal ...

  33. [41]

    Zhang , author G

    author author Z. Zhang , author G. Zhang , author M. Wei , author Y. Zhang , \ and\ author M. Tian ,\ title title Numerical simulation of boiling behavior in vertical microchannels , \ 10.1063/5.0167304 journal journal Physics of Fluids \ volume 35 ,\ pages 092011 ( year 2023 ) NoStop

    doi

  34. [42]

    author author A. H. \ Rajkotwala , author L. L. \ Boer , author E. A. J. F. \ Peters , author C. W. M. \ van der Geld , author J. G. M. \ Kuerten , author J. A. M. \ Kuipers , \ and\ author M. W. \ Baltussen ,\ title title A numerical study of flow boiling in a microchannel us...

    doi

  35. [43]

    Tiwari \ and\ author M

    author author N. Tiwari \ and\ author M. K. \ Moharana ,\ title title Conjugate heat transfer analysis of liquid-vapor two phase flow in a microtube: A numerical investigation , \ 10.1016/j.ijheatmasstransfer.2019.07.077 journal journal International Journal of Heat and Mass T...

    2019 doi

  36. [44]

    Lin , author J

    author author Y. Lin , author J. Li , author Y. Luo , author W. Li , author X. Luo , author S. Kabelac , author Y. Cao , \ and\ author W. J. \ Minkowycz ,\ title title Conjugate heat transfer analysis of bubble growth during flow boiling in a rectangular microchannel , \ 10.10...

  37. [45]

    Vontas , author N

    author author K. Vontas , author N. Mich\' e , author M. Marengo , \ and\ author A. Georgoulas ,\ title title A numerical investigation of the solid surface material influence on flow boiling within microchannels , \ 10.1016/j.applthermaleng.2022.119006 journal journal Applied...

  38. [46]

    Scheufler \ and\ author J

    author author H. Scheufler \ and\ author J. Roenby ,\ title title Twophaseflow: a framework for developing two phase flow solvers in openfoam , \ 10.51560/ofj.v3.80 journal journal OpenFOAM Journal \ volume 3 ,\ pages 200--224 ( year 2023 ) NoStop

    doi

  39. [47]

    author author J. U. \ Brackbill , author D. B. \ Kothe , \ and\ author C. Zemach ,\ title title A continuum method for modeling surface tension , \ 10.1016/0021-9991(92)90240-y journal journal Journal of Computational Physics \ volume 100 ,\ pages 335--354 ( year 1992 ) NoStop

    doi

  40. [48]

    Hardt \ and\ author F

    author author S. Hardt \ and\ author F. Wondra ,\ title title Evaporation model for interfacial flows based on a continuum-field representation of the source terms , \ 10.1016/j.jcp.2008.02.020 journal journal Journal of Computational Physics \ volume 227 ,\ pages 5871--5895 (...

    2008 doi

  41. [49]

    Szczukiewicz , author N

    author author S. Szczukiewicz , author N. Borhani , \ and\ author J. R. \ Thome ,\ title title Two-phase heat transfer and high-speed visualization of refrigerant flows in 100 100 m ^2 silicon multi-microchannels , \ 10.1016/j.ijrefrig.2012.11.014 journal journal International...

    doi

  42. [50]

    Mukherjee , author S

    author author A. Mukherjee , author S. G. \ Kandlikar , \ and\ author Z. J. \ Edel ,\ title title Numerical study of bubble growth and wall heat transfer during flow boiling in a microchannel , \ 10.1016/j.ijheatmasstransfer.2011.01.030 journal journal International Journal of...

    doi

  43. [51]

    Che , author T

    author author Z. Che , author T. N. \ Wong , \ and\ author N.-T. \ Nguyen ,\ title title Heat transfer enhancement by recirculating flow within liquid plugs in microchannels , \ 10.1016/j.ijheatmasstransfer.2011.11.050 journal journal International Journal of Heat and Mass Tra...

    2011 doi

  44. [52]

    Che , author T

    author author Z. Che , author T. N. \ Wong , author N.-T. \ Nguyen , \ and\ author C. Yang ,\ title title Three dimensional features of convective heat transfer in droplet-based microchannel heat sinks , \ j.ijheatmasstransfer.2015.03.030 journal journal International Journal ...

    2015

Pith tools

Reviewed August 12, 2026 · model on record in the stance chip above.