Typed states for the displayed outbound observations.
Source: paper_references, paper_reference_links
Paper Citation Record · LEDGER
Thermal Implications of Non-Uniform Power in BSPDN-Enabled 2.5D/3D Chiplet-based Systems-in-Package using Nanosheet Technology
As of 6 August 2026, this Paper Citation Record lists 0 of 0 outbound references and 1 inbound Pith citation observation for arXiv:2508.02284.
A citation records a reference. It does not transfer a finding from one paper to another.
Coverage vector
One-hop event checks from named stored sources.
Source: scholarly_work_events, retraction_status_cache, observed 2026-08-06T06:34:29.942622+00:00
Pith citing papers itemized under the disclosed page cap.
Source: paper_references, paper_reference_links, observed 2026-08-02T18:42:41.855287Z
A source-named dated measurement, never combined with another source.
Source: cited_works
Reference resolution
0 of 0 outbound references displayed
- verified exact0
- verified fuzzy0
- unresolved0
- parse uncertain0
- malformed identifier0
- metadata mismatch0
External citation measurements
No source-named external measurement is stored.
Outbound references
No outbound reference observations are available for this paper version.
Pith citing papers
Observation c4576b0c-2a3e-4d01-9d87-93b00fec33f0 · inbound
Full-Scale GPU-Accelerated Transient EM-Thermal-Mechanical Co-Simulation for Early-Stage Design of Advanced Packages cites this paper.
Full-Scale GPU-Accelerated Transient EM-Thermal-Mechanical Co-Simulation for Early-Stage Design of Advanced Packages Thermal Implications of Non-Uniform Power in BSPDN-Enabled 2.5D/3D Chiplet-based Systems-in-Package using Nanosheet Technology
Reference 4
- Resolution
- unresolved
- no resolver link, observed 2026-08-02T18:42:41.855287Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.