Typed states for the displayed outbound observations.
Source: paper_references, paper_reference_links, observed 2026-08-14T04:37:22.558176Z
Paper Citation Record · LEDGER
High Thermal Conductivity of Back-End-of-Line Compatible Diamond Films
As of 15 August 2026, this Paper Citation Record lists 1 of 1 outbound references and 0 inbound Pith citation observations for arXiv:2608.08534.
A citation records a reference. It does not transfer a finding from one paper to another.
Coverage vector
One-hop event checks from named stored sources.
Source: scholarly_work_events, retraction_status_cache, observed 2026-08-15T06:32:42.880941+00:00
Pith citing papers itemized under the disclosed page cap.
Source: paper_references, paper_reference_links
A source-named dated measurement, never combined with another source.
Source: cited_works
Reference resolution
1 of 1 outbound references displayed
- verified exact0
- verified fuzzy0
- unresolved0
- parse uncertain0
- malformed identifier1
- metadata mismatch0
External citation measurements
No source-named external measurement is stored.
Outbound references
Observation 9ba42413-4896-4daf-9677-0ccaac7514cc · outbound
This paper cites Thermal management materials for 3D-stacked integrated circuits,.
High Thermal Conductivity of Back-End-of-Line Compatible Diamond Films Thermal management materials for 3D-stacked integrated circuits,
Reference 1
- Resolution
- malformed identifier
- raw_fallback, observed 2026-08-14T04:37:22.650467Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-15T06:32:42.880941+00:00.
Pith citing papers
No inbound Pith citation observations are available.