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Radiation hard pixel sensors using high-resistive wafers in a 150 nm CMOS processing line

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arxiv 1702.04953 v2 pith:E4FSCDON submitted 2017-02-16 physics.ins-det hep-ex

classification physics.ins-dethep-ex
keywords sensorspixelcmostechnologywellbeforecharacterizedefficiency
verification ladder T0 review T1 audit T2 compute T3 formal
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abstract

Pixel sensors using 8" CMOS processing technology have been designed and characterized offering the benefits of industrial sensor fabrication, including large wafers, high throughput and yield, as well as low cost. The pixel sensors are produced using a 150 nm CMOS technology offered by LFoundry in Avezzano. The technology provides multiple metal and polysilicon layers, as well as metal-insulator-metal capacitors that can be employed for AC-coupling and redistribution layers. Several prototypes were fabricated and are characterized with minimum ionizing particles before and after irradiation to fluences up to 1.1 $\times$ 10$^{15}$ n$_{\rm eq}$ cm$^{-2}$. The CMOS-fabricated sensors perform equally well as standard pixel sensors in terms of noise and hit detection efficiency. AC-coupled sensors even reach 100% hit efficiency in a 3.2 GeV electron beam before irradiation.

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