Typed states for the displayed outbound observations.
Source: paper_references, paper_reference_links
Paper Citation Record · LEDGER
3D-Integrated Superconducting qubits: CMOS-Compatible, Wafer-Scale Processing for Flip-Chip Architectures
As of 8 August 2026, this Paper Citation Record lists 0 of 0 outbound references and 2 inbound Pith citation observations for arXiv:2505.04337.
A citation records a reference. It does not transfer a finding from one paper to another.
Coverage vector
One-hop event checks from named stored sources.
Source: scholarly_work_events, retraction_status_cache, observed 2026-08-08T06:32:00.761636+00:00
Pith citing papers itemized under the disclosed page cap.
Source: paper_references, paper_reference_links, observed 2026-08-03T15:11:03.061937Z
A source-named dated measurement, never combined with another source.
Source: arxiv_reference, observed 2026-08-05T02:28:24.338817Z
Reference resolution
0 of 0 outbound references displayed
- verified exact0
- verified fuzzy0
- unresolved0
- parse uncertain0
- malformed identifier0
- metadata mismatch0
External citation measurements
0
arxiv_reference, observed 2026-08-05T02:28:24.338817Z
Outbound references
No outbound reference observations are available for this paper version.
Pith citing papers
Observation 70a106c9-e3a1-4347-9097-9f112910b28c · inbound
Stability studies on subtractively-fabricated CMOS-compatible superconducting transmon qubits cites this paper.
Stability studies on subtractively-fabricated CMOS-compatible superconducting transmon qubits 3D-Integrated Superconducting qubits: CMOS-Compatible, Wafer-Scale Processing for Flip-Chip Architectures
Reference 3
- Resolution
- unresolved
- no resolver link, observed 2026-08-03T15:11:03.061937Z
Source-reported events for the cited work
Unavailable: canonical work link unavailable.
Observation 3bef209e-2897-48f7-bf28-0afc0d8bc83b · inbound
Ultra-high Q-factor superconducting tantalum resonators on 300 mm Si wafers cites this paper.
Ultra-high Q-factor superconducting tantalum resonators on 300 mm Si wafers 3D-Integrated Superconducting qubits: CMOS-Compatible, Wafer-Scale Processing for Flip-Chip Architectures
Reference 12
- Resolution
- verified exact
- arxiv_id, observed 2026-06-27T13:10:56.114358Z
Source-reported events for the cited work
No event found in the named queried sources as of 2026-08-08T06:32:00.761636+00:00.