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A. N. Danilewsky

Identifiers

  • name variant A. N. Danilewsky 0.60 · backfill

Papers (1)

  1. Three Dimensionial Surface Modelling: A Novel Analysis Technique for Non-Destructive X-Ray Diffraction Imaging of Semiconductor Die Warpage & Strain in Fully Encapsulated Integrated Circuits cond-mat.mtrl-sci · 2012 · author #8

Mentions

  • 1204.1466 #8 · backfill · confidence 0.70 A. N. Danilewsky

Frequent Coauthors