A. N. Danilewsky

Identifiers

• name variant A. N. Danilewsky 0.60 · backfill

Papers (1)

1. Three Dimensionial Surface Modelling: A Novel Analysis Technique for Non-Destructive X-Ray Diffraction Imaging of Semiconductor Die Warpage & Strain in Fully Encapsulated Integrated Circuits cond-mat.mtrl-sci · 2012 · author #8

Mentions

• 1204.1466 #8 · backfill · confidence 0.70 A. N. Danilewsky

Frequent Coauthors

• A. Henry 1 shared papers
• D. Allen 1 shared papers
• D. Manessis 1 shared papers
• J. Stopford 1 shared papers
• J. Wittge 1 shared papers
• L. Boettcher 1 shared papers
• N. Bennett 1 shared papers
• P. J. McNally 1 shared papers