D. Manessis

Identifiers

• name variant D. Manessis 0.60 · backfill

Papers (2)

1. Three Dimensionial Surface Modelling: A Novel Analysis Technique for Non-Destructive X-Ray Diffraction Imaging of Semiconductor Die Warpage & Strain in Fully Encapsulated Integrated Circuits cond-mat.mtrl-sci · 2012 · author #5
2. Lamination And Microstructuring Technology for a Bio-Cell Multiwell array cs.OH · 2008 · author #2

Mentions

• 1204.1466 #5 · backfill · confidence 0.70 D. Manessis
• 0802.3082 #2 · backfill · confidence 0.70 D. Manessis

Frequent Coauthors

• A. Henry 1 shared papers
• A. N. Danilewsky 1 shared papers
• A. Neumann 1 shared papers
• B. Iafelice 1 shared papers
• D. Allen 1 shared papers
• E. Jung 1 shared papers
• F. Destro 1 shared papers
• H. Reichl 1 shared papers
• J. Bauer 1 shared papers
• J. Stopford 1 shared papers
• J. Wittge 1 shared papers
• L. Boettcher 1 shared papers
• L. Bottcher 1 shared papers
• N. Bennett 1 shared papers
• P. J. McNally 1 shared papers
• R. Gambari 1 shared papers
• T. Braun 1 shared papers