Fengwen Mu

Identifiers

• name variant Fengwen Mu 0.50 · backfill

Papers (2)

1. High Thermal Boundary Conductance across Bonded Heterogeneous GaN-SiC Interfaces physics.app-ph · 2019 · author #1
2. Strain effect in highly-doped n-type 3C-SiC-on-glass substrate for mechanical sensors and mobility enhancement physics.app-ph · 2018 · author #5

Mentions

No mention provenance yet.

Frequent Coauthors

• Tadatomo Suga 2 shared papers
• Alan Iacopi 1 shared papers
• Bin Xu 1 shared papers
• Debbie G. Senesky 1 shared papers
• Dzung Viet Dao 1 shared papers
• Han-Hao Cheng 1 shared papers
• Hoan-Phuong Phan 1 shared papers
• Jingjing Shi 1 shared papers
• Junichiro Shiomi 1 shared papers
• Leonie Hold 1 shared papers
• Nam-Trung Nguyen 1 shared papers
• Samuel Graham 1 shared papers
• Seongbin Shin 1 shared papers
• Toan Dinh 1 shared papers
• Tuan-Khoa Nguyen 1 shared papers
• Zhe Cheng 1 shared papers