Seongbin Shin

Identifiers

• name variant Seongbin Shin 0.50 · backfill

Papers (1)

1. High Thermal Boundary Conductance across Bonded Heterogeneous GaN-SiC Interfaces physics.app-ph · 2019 · author #4

Mentions

No mention provenance yet.

Frequent Coauthors

• Bin Xu 1 shared papers
• Fengwen Mu 1 shared papers
• Jingjing Shi 1 shared papers
• Junichiro Shiomi 1 shared papers
• Samuel Graham 1 shared papers
• Tadatomo Suga 1 shared papers
• Zhe Cheng 1 shared papers