Electroplated indium bump bonds can form superconducting interconnects with qubit quality factors around 10^6, and the dominant loss is traced to the gold metal-air interface.
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Flip-chip integrated superconducting qubits using electroplated bump bonds
Electroplated indium bump bonds can form superconducting interconnects with qubit quality factors around 10^6, and the dominant loss is traced to the gold metal-air interface.