Spiral crack widths in acid-etched amorphous silicon films, combined with Raman stress measurements and FEM simulations, give a fracture toughness of 4.7 ± 0.3 MPa√m, about 5.7 times that of crystalline silicon.
This brings new stress into the material, and the crack can grow further
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Determination of fracture toughness of thin-film amorphous silicon using spiral crack structures
Spiral crack widths in acid-etched amorphous silicon films, combined with Raman stress measurements and FEM simulations, give a fracture toughness of 4.7 ± 0.3 MPa√m, about 5.7 times that of crystalline silicon.