Open3DBench is an open-source 3D-IC benchmark with Open3D-Tiling and Open3D-DMP placement methods that report 51% area, 24% wirelength, 31% timing, and 6% power gains versus 2D flows.
Compact-2D: A physical design methodology to build commercial-quality face-to-face-bonded 3D ICs
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Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation
Open3DBench is an open-source 3D-IC benchmark with Open3D-Tiling and Open3D-DMP placement methods that report 51% area, 24% wirelength, 31% timing, and 6% power gains versus 2D flows.