A joint optimization framework for multi-die floorplanning and technology assignment that uses ML-based PPA estimation to optimize area, wirelength, performance, power, and cost, outperforming greedy baselines in 2.5D and 3D ICs.
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Simultaneous Multi-die Floorplanning and Technology Assignment
A joint optimization framework for multi-die floorplanning and technology assignment that uses ML-based PPA estimation to optimize area, wirelength, performance, power, and cost, outperforming greedy baselines in 2.5D and 3D ICs.