CLIPGen is a framework for automated generation of chiplet interconnect IP with PPA estimates to support 2.5D SiP architecture exploration.
Thermal Modeling of a Chiplet - Based Packaging with a 2.5-D Through-Silicon Via Interposer
2 Pith papers cite this work. Polarity classification is still indexing.
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Pith papers citing it
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cs.AR 2years
2026 2verdicts
UNVERDICTED 2representative citing papers
The paper reviews multiscale thermal modeling techniques for 3D ICs, unifying scales from device to system while stressing thermal boundary resistance and validation needs.
citing papers explorer
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CLIPGen: A Chiplet Link IP Modeling and Generation Framework for 2.5D Architecture Exploration
CLIPGen is a framework for automated generation of chiplet interconnect IP with PPA estimates to support 2.5D SiP architecture exploration.
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A Review of Multiscale Thermal Modeling in Heterogeneous 3D ICs
The paper reviews multiscale thermal modeling techniques for 3D ICs, unifying scales from device to system while stressing thermal boundary resistance and validation needs.