PEO smooths zinc electrodeposition by binding to the copper substrate and biasing nucleation toward flat-lying Zn(002) platelets, rather than by interacting with the growing zinc.
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Achieving electrode smoothing by controlling the nucleation phase of metal deposition through polymer-substrate binding
PEO smooths zinc electrodeposition by binding to the copper substrate and biasing nucleation toward flat-lying Zn(002) platelets, rather than by interacting with the growing zinc.