Presents coupled inductor arrays and inductance-island partitioning for vertical power delivery, reporting 250 nH/mm² inductance density, 10 A/mm² current density, and simulated efficiency gains of 5.65% average (up to 11.04%) versus uncoupled designs.
Efficient scalable thermoelec- tric modeling of high-frequency cylindrical interconnects for het- erogeneous package arrays,
2 Pith papers cite this work. Polarity classification is still indexing.
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Physics-informed active learning optimizes tri-gate FinFETs, identifying designs with 2x better switching efficiency and 3.3 A drive current in multi-fin setups.
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Package-Embedded Coupled Inductor Arrays for High-Performance Computing Power Delivery
Presents coupled inductor arrays and inductance-island partitioning for vertical power delivery, reporting 250 nH/mm² inductance density, 10 A/mm² current density, and simulated efficiency gains of 5.65% average (up to 11.04%) versus uncoupled designs.
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PALTO: Physics-Informed Active Learning for Tri-Gate FinFET Design Optimization for Vertical Power Delivery
Physics-informed active learning optimizes tri-gate FinFETs, identifying designs with 2x better switching efficiency and 3.3 A drive current in multi-fin setups.