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A comparative study on power delivery aspects of compute-in/near-memory approaches using DRAM

3 Pith papers cite this work. Polarity classification is still indexing.

3 Pith papers citing it
abstract

Compute-in-memory (PIM) mitigates the memory wall by performing computation within memory, reducing data movement and improving energy efficiency. DRAM-based PIM is particularly attractive due to its high density, mature manufacturing ecosystem, and compatibility with existing systems. Recent works exploit multiple levels of the DRAM hierarchy - including subarrays, banks, and 3D-stacked organizations - to enable in-memory computation using mechanisms such as multi-row activation, row-buffer operations, and near-bank compute units. However, these approaches introduce non-traditional current demand patterns that challenge the power delivery network (PDN). This paper surveys PDN challenges in DRAM-based PIM systems and proposes a unified taxonomy that characterizes PIM-induced current behavior along temporal (burst vs. sustained) and spatial (localized vs. distributed) dimensions. Using this framework, we analyze how representative PIM techniques stress the PDN through bursty activations, multi-row concurrency, and large-scale parallel execution, leading to voltage droop, IR drop, and thermal hotspots. We further discuss DRAM-specific mitigation strategies leveraging existing architectural and circuit-level mechanisms, including timing constraints, memory controller scheduling, data placement, and bank- and vault-level power management. This survey highlights the importance of PDN-aware design for scalable and reliable DRAM-based PIM systems and outlines key future research directions.

fields

cs.AR 3

years

2026 3

representative citing papers

Emerging memory technologies at room/cryogenic temperature

cs.AR · 2026-05-21 · unverdicted · novelty 1.0

Overview chapter surveying volatile and non-volatile memories including SRAM, DRAM, RRAM, MRAM, FeFET and cryogenic JJFET devices, with focus on principles, tradeoffs, and challenges.

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