A 3D flip-chip assembly with indium bump interconnects achieves spin-photon coupling of 75 MHz and charge readout SNR of 100 in 300 ns for a hole-spin double quantum dot in silicon.
Title resolution pending
1 Pith paper cite this work. Polarity classification is still indexing.
1
Pith paper citing it
fields
cond-mat.mes-hall 1years
2026 1verdicts
CONDITIONAL 1representative citing papers
citing papers explorer
-
3D integration of a hybrid quantum dot circuit-QED device for fast gate dispersive charge readout and coherent spin-photon coupling
A 3D flip-chip assembly with indium bump interconnects achieves spin-photon coupling of 75 MHz and charge readout SNR of 100 in 300 ns for a hole-spin double quantum dot in silicon.