pith. sign in

arxiv: 1802.05654 · v1 · pith:YVGUVF6Znew · submitted 2018-02-15 · ❄️ cond-mat.mes-hall

Thermal transport in 2D and 3D nanowire networks

classification ❄️ cond-mat.mes-hall
keywords thermalnetworksnodesnanowireconductivitytransportagreementanalytic
0
0 comments X p. Extension
pith:YVGUVF6Z Add to your LaTeX paper What is a Pith Number?
\usepackage{pith}
\pithnumber{YVGUVF6Z}

Prints a linked pith:YVGUVF6Z badge after your title and writes the identifier into PDF metadata. Compiles on arXiv with no extra files. Learn more

read the original abstract

We report on thermal transport properties in 2 and 3 dimensions interconnected nanowire networks (strings and nodes). The thermal conductivity of these nanostructures decreases in increasing the distance of the nodes, reaching ultra-low values. This effect is much more pronounced in 3D networks due to increased porosity, surface to volume ratio and the enhanced backscattering at 3D nodes compared to 2D nodes. We propose a model to estimate the thermal resistance related to the 2D and 3D interconnections in order to provide an analytic description of thermal conductivity of such nanowire networks; the latter is in good agreement with Molecular Dynamic results.

This paper has not been read by Pith yet.

discussion (0)

Sign in with ORCID, Apple, or X to comment. Anyone can read and Pith papers without signing in.