Stabilization of lead-free bulk CsSnI$_3$ perovskite thermoelectrics via incorporating of TiS$_3$ nanoribbon clusters

The intense research for efficient low-temperature thermoelectric materials motivates the exploration of innovative compounds and composite systems. This study examines the effects of integrating low-dimensional titanium trisulfide (TiS$_3$) into bulk tin-based halide perovskites (CsSnI$_3$) for use in thermoelectric applications. The addition of small amounts of two-dimensional titanium trisulfide (TiS$_3$) to bulk tin-based halide perovskites (CsSnI$_3$) significantly enhanced the structural stability of the composite material and suppressed oxidation processes. The CsSnI$_3$-TiS$_3$ composites demonstrated stabilization of temperature-dependent electrical properties (conductivity and Seebeck coefficient). This study provides valuable insights into the promising approach of using low-dimensional TiS3 as an additive to stabilize the thermoelectric performance of CsSnI$_3$.