REVIEW 3 major objections 7 minor 71 references
Event Vision Sensor: A Review
T0 review · 3 major / 7 minor · reviewed 2026-08-08 · deepseek-v4-flash
Pith's one-line read This review traces how event-based vision sensors matured into practical industrial devices and argues, on the basis of a blackbody photocurrent model, that an infrared detector centered near 8 µm is the best choice for ground-scene event…
desk verdict The survey half of this paper is a useful map of event-vision sensors, but the only original quantitative claim—an 8 µm recommendation for infrared EVS—is based on absolute photocurrent rather than temporal contrast, and is wrong as stated. read the letter →
The pith
A machine-rendered reading of the paper's core claim, the machinery that carries it, and where it could break.
The reading
What carries the argument
Two mechanisms carry the argument. The first is the logarithmic temporal-contrast pixel core—photodiode, log trans-impedance amplifier, self-timed differential encoder, and threshold comparators—which converts relative intensity change into asynchronous on/off events. The second is the blackbody radiation model of Eqs. (9)–(10), which turns scene temperature into equivalent detector photocurrent $I_{\mathrm{equ}} = B_L A_d \eta_{\mathrm{optics}}\eta_{\mathrm{det}}/(4(f/\#)^2)$; because the photocurrent at 8 µm changes fastest with temperature, the model singles out that wavelength for ground-scene event imaging.
What would settle it
Measure, for a set of real or simulated infrared detectors with different cutoff wavelengths, the equivalent photocurrent as a function of blackbody temperature across -40°C to 500°C, and find the wavelength where the photocurrent derivative with temperature is largest; if that wavelength is not near 8 µm, the paper's central infrared recommendation fails.
Extended reading notes
Core claim
The paper's central claim is that event-based vision has reached industrial viability through three technology shifts: backside illumination raising fill factor and quantum efficiency, wafer stacking enabling on-chip processing and high-resolution hybrid sensors, and industrial interfaces such as MIPI removing readout bottlenecks. Extending the same logic to the thermal infrared, it claims that for ground scenes an infrared detector with a central wavelength around 8 µm is the ideal choice for an event sensor, because that is where the equivalent photocurrent changes fastest with scene temperature. Supporting this, it reports that the field now uses metrics like nominal contrast threshold, dynamic energy, and static power, and that infrared event imaging faces a dynamic range of about 70 dB and needs roughly 3% contrast sensitivity to detect a 1 K change at 5 µm against a 300 K background.
Load-bearing premise
The 8 µm recommendation rests on an illustrative photocurrent model that assumes a 30 µm pixel, f/2 optics, unity optical transmission and detection efficiency, and a narrow spectral band at 5 µm; real infrared detectors with different parameters could shift the preferred wavelength.
Editorial extensions
If this is right
- Designers building infrared event cameras for terrestrial scenes would target detectors near 8 µm rather than mid-wave infrared wavelengths, and would use the model to budget pixel size, f-number, and efficiency.
- The demonstrated gains from backside illumination and wafer stacking imply that future event sensors can push resolution and readout rates beyond current figures without sacrificing sensitivity.
- The compiled evaluation metrics give the field a common language, so new sensors can be compared on nominal contrast threshold, power at defined event rates, and latency rather than on ad hoc specifications.
- On-chip processing and hybrid frame-plus-event outputs make event sensors a practical component for edge vision, robotics, and automotive systems rather than a research curiosity.
- Infrared event cameras will need front-end designs that cope with large dark currents, since the achievable dynamic range is near 70 dB and detecting a 1 K temperature change at 5 µm against a 300 K background requires roughly 3% contrast sensitivity.
Reading between the lines
- The 8 µm recommendation is an output of an idealized model; a natural next step is to repeat the calculation for realistic detector parameters (e.g., non-unity quantum efficiency, f/1.2 optics, larger or smaller pixels) and check whether the optimal wavelength moves.
- The same temperature-derivative logic could be turned into a general design rule: choose the wavelength where the Planckian derivative peaks for the scene temperature of interest, which for hot industrial or space scenes would shift the optimum away from 8 µm.
- The absence of a standardized EVS evaluation protocol suggests an opportunity to convert the paper's metric collection into a common test procedure, which would make future sensor comparisons meaningful.
Editorial analysis
A structured set of objections, weighed in public.
Referee Report
Summary. The paper is a review of event-based vision sensors (EVS), tracing the field from neuromorphic engineering to current devices that combine backside illumination, wafer stacking, and industrial interfaces. It surveys the working principle of the EVS pixel, defines performance metrics (contrast sensitivity, dynamic range, power, latency, readout rate), and discusses the potential of infrared event vision. The authors add an original quantitative estimate: using blackbody radiance and a simple photocurrent model, they recommend an infrared detector with a central wavelength around 8 um for ground-scene EVS because the photocurrent at 8 um is said to vary fastest with temperature.
Significance. If the review's factual content is reliable, the paper provides a useful, up-to-date map of the EVS field, particularly the recent progress in BSI processing, wafer stacking, and readout interfaces, and it serves as a compact entry point for researchers interested in infrared event-based imaging. The manuscript cites recent commercial sensors and research prototypes, includes explicit performance metrics, and gives a clear account of the pixel operation. The sole original quantitative contribution, the 8 um wavelength recommendation, is not supported by the argument as written, because the paper applies an absolute photocurrent derivative where the sensor's own operating principle calls for a fractional (logarithmic) derivative; this may be fixable with an SNR-aware analysis, so the issue is significant but not beyond revision.
major comments (3)
- [V, Eqs. (9)-(10), Fig. 3(b)] The recommendation of an 8 um central wavelength rests on the claim that 'the photocurrent at 8 µm varying the fastest with temperature.' An event-based pixel, however, does not respond to the absolute photocurrent or its absolute derivative; it responds to temporal contrast, i.e., the fractional change |ΔI_ph/I_ph|, as defined in Section IV-A and Eqs. (1)-(2). For blackbody radiation, d ln I_ph/dT = (hc/λkT) * e^x/(e^x-1) / T with x = hc/(λkT), which decreases monotonically with λ. At T = 300 K, this is about 3.2%/K at 5 µm versus 2.0%/K at 8 µm. The paper itself uses this fractional metric when stating that 1 K against 300 K at 5 µm requires 3% contrast sensitivity. Therefore, within the paper's own model, the 5 µm detector would trigger an event for a smaller temperature step than the 8 µm detector, opposite to the stated basis for the recommendation. A noise-aware analysis that accounts for the larger absolute photocurrent (and hence better shot-noise-limited SNR) at longer wavelengths could potentially restore the 8 µm conclusion, but no such analysis is presented.
- [V, Eqs. (9)-(10)] The photocurrent estimate is an illustrative calculation based on several idealized assumptions (30 µm pixel pitch, f/2 optics, unity optical transmission and detection efficiency, and a 5±0.01 µm spectral band). The resulting 1-862 pA range has no uncertainty bounds and is not validated against measured infrared detector photocurrents. Since this calculation is the quantitative basis for the central infrared recommendation, please add a sensitivity analysis with respect to pixel pitch, f-number, efficiency, and spectral bandwidth, and state whether the conclusion is robust to realistic parameters.
- [IV-A and V] There is an internal inconsistency in the treatment of contrast. Section IV-A correctly defines temporal contrast as a fractional change, and Section V uses this metric to compute the 3% and 30% contrast sensitivities for 1 K and 10 K changes at 5 µm. However, the wavelength recommendation is based on the absolute rate of change of photocurrent with temperature. These two criteria lead to different preferred wavelengths, and the manuscript does not reconcile them. Please clarify whether the recommendation is based on contrast sensitivity, SNR, or another figure of merit, and revise the argument accordingly.
minor comments (7)
- [General] The conclusion section is numbered VII, but no section VI appears; please renumber the sections sequentially.
- [Equations (1)-(10)] Several equations are garbled in the submitted text, with missing operators, limits, and subscripts, making them difficult to verify; please ensure the final manuscript has properly typeset equations.
- [Section IV] The text refers to 'Table 1' for benchmarks, but no table appears in the supplied manuscript; verify that Table 1 is present with all columns and values.
- [Figures] Figures 1-3 are cited but not visible in the extracted text; confirm that all figures and captions are included.
- [Section V] The phrase 'may be the identical choice' should likely read 'may be the ideal choice' or 'may be an optimal choice.'
- [Section II] The phrase 'serval contributions' is a typo for 'several contributions.'
- [Section V] The sentence fragment 'Compared to visible light.' should be joined with the adjacent sentence.
Circularity Check
No significant circularity: the survey claims trace to external sources, and the Sec. V infrared estimate is a parameterized physics model rather than a fitted prediction.
full rationale
I find no instance of self-definition, fitted input called prediction, load-bearing self-citation, uniqueness imported from the authors, ansatz smuggled in via citation, or renaming of a known result. The abstract and body review external devices and results (DVS128, ATIS, DAVIS, Samsung, Sony, Prophesee, SciDVS, etc.) with citations to primary literature, and the feature tables compile benchmarks without fitting a parameter and then presenting a closely related quantity as a prediction. Section V's infrared recommendation is computed from Planck's law (Eq. 9) and a photocurrent expression (Eq. 10) using explicitly stated assumptions: a 30 um pixel, f/2 optics, unity optical transmission and detection efficiency, and a 5 +/- 0.01 um spectral band. The resulting 1-862 pA estimate and the comparison showing that the 8 um photocurrent varies fastest with temperature are direct evaluations of those formulas, not outputs of the paper's own fitted values, so the conclusion is not equivalent to its inputs by construction. The skeptical concern that an event sensor responds to fractional temporal contrast (d ln I/dT) rather than absolute photocurrent slope is a substantive correctness critique of the 8 um recommendation, and it may well undermine the recommendation, but it is not a circularity: the paper's derivation does not assume the metric it claims to derive. Institutional overlap with reference [75] (SITP work on HgCdTe e-APDs) does not make that citation load-bearing, and no unique theorem from the authors is invoked to forbid alternatives. Accordingly, the honest finding is no significant circularity, score 0.
Assumptions & free parameters
free parameters (4)
- Detector pixel pitch =
30 um
- Optical system f-number =
f/2
- Optical transmission and detection efficiency =
1 (ideal)
- Spectral integration range =
5 +/- 0.01 um
assumptions (3)
- standard math MOSFET weak-inversion exponential I-V relation (Vittoz-Fellrath model)
- domain assumption Ground scenes radiate as blackbodies with unit emissivity
- domain assumption Vendor-reported EVS metrics are mutually comparable
Cite this review
Pith. "Pith review of Event Vision Sensor: A Review." pith.science (2026). https://pith.science/paper/AFS4UU6O
@misc{pith2026250206116,
author = {Pith},
title = {Pith review of: Event Vision Sensor: A Review},
year = {2026},
howpublished = {\url{https://pith.science/paper/AFS4UU6O}},
note = {Machine review of arXiv:2502.06116}
}
read the original abstract
By monitoring temporal contrast, event-based vision sensors can provide high temporal resolution and low latency while maintaining low power consumption and simplicity in circuit structure. These characteristics have garnered significant attention in both academia and industry. In recent years, the application of back-illuminated (BSI) technology, wafer stacking techniques, and industrial interfaces has brought new opportunities for enhancing the performance of event-based vision sensors. This is evident in the substantial advancements made in reducing noise, improving resolution, and increasing readout rates. Additionally, the integration of these technologies has enhanced the compatibility of event-based vision sensors with current and edge vision systems, providing greater possibilities for their practical applications. This paper will review the progression from neuromorphic engineering to state-of-the-art event-based vision sensor technologies, including their development trends, operating principles, and key features. Moreover, we will delve into the sensitivity of event-based vision sensors and the opportunities and challenges they face in the realm of infrared imaging, providing references for future research and applications.
Reference graph
Works this paper leans on
-
[1]
T. Delbruck, ‘Neuromorophic vision sensing and processing’, in2016 46thEuropeanSolid-StateDeviceResearchConference(ESSDERC), Lausanne, Switzerland: IEEE, Sep. 2016, pp. 7–14. doi: 10.1109/ESSDERC.2016.7599576
-
[2]
Lichtsteiner, ‘An AER temporal contrast vision sensor’, Doctoral Thesis, ETH Zurich, 2006
P. Lichtsteiner, ‘An AER temporal contrast vision sensor’, Doctoral Thesis, ETH Zurich, 2006. doi: 10.3929/ethz-a-005279479
-
[3]
S. Amos, ‘Learn from events: On the future of machine learning for event-based canera’, in Second International Workshop on Event-based Vision and Smart Cameras, Long Beach, CA, USA, Jun. 2019. [Online]. Available: https://rpg.ifi.uzh.ch/docs/CVPR19workshop/CVPRW19_Prophesee.pdf
work page 2019
-
[6]
M. Nazhamaitietal., ‘NS-MD: Near-Sensor Motion Detection With Energy Harvesting Image Sensor for Always-On Visual Perception’, IEEETrans.CircuitsSyst.IIExpressBriefs, vol. 68, no. 9, pp. 3078– 3082, Sep. 2021, doi: 10.1109/TCSII.2021.3087840
-
[7]
K. I. Schultzetal., ‘Digital-Pixel Focal Plane Array Technology’,Linc. Lab.J., [Online]. Available: https://www.ll.mit.edu/sites/default/files/page/doc/2018- 05/20_2_2_Schultz.pdf
work page 2018
-
[8]
P. Lichtsteiner, C. Posch, and T. Delbruck, ‘A 128 X 128 120db 30mw asynchronous vision sensor that responds to relative intensity change’, in 2006IEEEInternationalSolidStateCircuitsConference-Digestof TechnicalPapers, San Francisco, CA, USA: IEEE, 2006, pp. 2060–2069. doi: 10.1109/ISSCC.2006.1696265
arXiv 2006
-
[9]
M. Yang, S.-C. Liu, and T. Delbruck, ‘A Dynamic Vision Sensor With 1% Temporal Contrast Sensitivity and In-Pixel Asynchronous Delta Modulator for Event Encoding’,IEEEJ.Solid-StateCircuits, vol. 50, no. 9, pp. 2149–2160, Sep. 2015, doi: 10.1109/JSSC.2015.2425886
- [10]
Show all 71 references
-
[11]
B. Sonetal., ‘4.1 A 640×480 dynamic vision sensor with a 9µm pixel and 300Meps address-event representation’, in2017IEEEInternational 9 > REPLACE THIS LINE WITH YOUR MANUSCRIPT ID NUMBER (DOUBLE-CLICK HERE TO EDIT) < Solid-StateCircuitsConference(ISSCC), San Francisco, CA, USA...
2017
-
[13]
Lietal., ‘Design of an RGBW color VGA rolling and global shutter dynamic and active-pixel vision sensor’, in2015IEEEInternational SymposiumonCircuitsandSystems(ISCAS), May 2015, pp
C. Lietal., ‘Design of an RGBW color VGA rolling and global shutter dynamic and active-pixel vision sensor’, in2015IEEEInternational SymposiumonCircuitsandSystems(ISCAS), May 2015, pp. 718–721. doi: 10.1109/ISCAS.2015.7168734
2015
-
[14]
Guoetal., ‘A Three-Wafer-Stacked Hybrid 15-MPixel CIS + 1- MPixel EVS With 4.6-GEvent/s Readout, In-Pixel TDC, and On-Chip ISP and ESP Function’,IEEEJ.Solid-StateCircuits, vol
M. Guoetal., ‘A Three-Wafer-Stacked Hybrid 15-MPixel CIS + 1- MPixel EVS With 4.6-GEvent/s Readout, In-Pixel TDC, and On-Chip ISP and ESP Function’,IEEEJ.Solid-StateCircuits, vol. 58, no. 11, pp. 2955–2964, Nov. 2023, doi: 10.1109/JSSC.2023.3303154
2023
-
[15]
M. Guo, J. Huang, and S. Chen, ‘Live demonstration: A 768 × 640 pixels 200Meps dynamic vision sensor’, in2017IEEEInternational SymposiumonCircuitsandSystems(ISCAS), Baltimore, MD, USA: IEEE, May 2017, pp. 1–1. doi: 10.1109/ISCAS.2017.8050397
2017
-
[16]
Graca, S
R. Graca, S. Zhou, B. McReynolds, and T. Delbruck, ‘SciDVS: A Scientific Event Camera with 1.7% Temporal Contrast Sensitivity at 0.7 lux’, Sep. 15, 2024,arXiv: arXiv:2409.09648. Accessed: Nov. 21, 2024. [Online]. Available: http://arxiv.org/abs/2409.09648
2024 arXiv
-
[17]
Haessig, D
G. Haessig, D. Joubert, J. Haque, M. B. Milde, T. Delbruck, and V. Gruev, ‘PDAVIS: Bio-inspired Polarization Event Camera’, in2023 IEEE/CVFConferenceonComputerVisionandPatternRecognition Workshops(CVPRW), Vancouver, BC, Canada: IEEE, Jun. 2023, pp. 3963–3972. doi: 10.1109/CVPR...
2023
-
[18]
O. Kumagaietal., ‘A 1/4-inch 3.9Mpixel low-power event-driven back- illuminated stacked CMOS image sensor’, in2018IEEEInternational Solid-StateCircuitsConference-(ISSCC), San Francisco, CA: IEEE, Feb. 2018, pp. 86–88. doi: 10.1109/ISSCC.2018.8310196
2018
-
[19]
Shoushun, ‘Introduction of Celex Family Sensor and Event/Frame/Optical-flow Hybrid Processing’
C. Shoushun, ‘Introduction of Celex Family Sensor and Event/Frame/Optical-flow Hybrid Processing’. [Online]. Available: https://rpg.ifi.uzh.ch/docs/CVPR19workshop/CVPRW19_CelePixel.pdf
-
[20]
K. Kodamaetal., ‘1.22μm 35.6Mpixel RGB Hybrid Event-Based Vision Sensor with 4.88μm-Pitch Event Pixels and up to 10K Event Frame Rate by Adaptive Control on Event Sparsity’, in2023IEEE InternationalSolid-StateCircuitsConference(ISSCC), San Francisco, CA, USA: IEEE, Feb. 2023, ...
2023
-
[21]
Schonetal., ‘A 320 x 320 1/5” BSI-CMOS stacked event sensor for low-power vision applications’, in2023IEEESymposiumonVLSI TechnologyandCircuits(VLSITechnologyandCircuits), Jun
G. Schonetal., ‘A 320 x 320 1/5” BSI-CMOS stacked event sensor for low-power vision applications’, in2023IEEESymposiumonVLSI TechnologyandCircuits(VLSITechnologyandCircuits), Jun. 2023, pp. 1–2. doi: 10.23919/VLSITechnologyandCir57934.2023.10185354
2023
-
[22]
Serrano-Gotarredona, F
T. Serrano-Gotarredona, F. Faramarzi, and B. Linares-Barranco, ‘Electronically Foveated Dynamic Vision Sensor’, in2022IEEE InternationalConferenceonOmni-layerIntelligentSystems(COINS), Barcelona, Spain: IEEE, Aug. 2022, pp. 1–5. doi: 10.1109/COINS54846.2022.9855009
2022
-
[23]
Delbruck, C
T. Delbruck, C. Li, R. Graca, and B. Mcreynolds, ‘Utility and Feasibility of a Center Surround Event Camera’, Feb. 26, 2022,arXiv: arXiv:2202.13076. Accessed: Nov. 21, 2024. [Online]. Available: http://arxiv.org/abs/2202.13076
2022 arXiv
-
[24]
Iturbeetal., ‘NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integrated Chips’, in2023Design,Automation&TestinEurope Conference&Exhibition(DATE), Apr
X. Iturbeetal., ‘NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integrated Chips’, in2023Design,Automation&TestinEurope Conference&Exhibition(DATE), Apr. 2023, pp. 1–6. doi: 10.23919/DATE56975.2023.10136952
2023
-
[25]
Accessed: Nov
‘DARPA Announces Research Teams to Develop Intelligent Event- Based Imagers’. Accessed: Nov. 24, 2024. [Online]. Available: https://www.darpa.mil/news-events/2021-07-02
2024
-
[26]
Lakshmi, A
A. Lakshmi, A. Chakraborty, and C. S. Thakur, ‘Neuromorphic vision: From sensors to event‐based algorithms’,WIREsDataMin.Knowl. Discov., vol. 9, no. 4, p. e1310, Jul. 2019, doi: 10.1002/widm.1310
2019 doi
-
[27]
Tayarani-Najaran and M
M.-H. Tayarani-Najaran and M. Schmuker, ‘Event-Based Sensing and Signal Processing in the Visual, Auditory, and Olfactory Domain: A Review’,Front.NeuralCircuits, vol. 15, p. 610446, May 2021, doi: 10.3389/fncir.2021.610446
2021
-
[28]
Sandamirskaya, M
Y. Sandamirskaya, M. Kaboli, J. Conradt, and T. Celikel, ‘Neuromorphic computing hardware and neural architectures for robotics’,Sci.Robot., vol. 7, no. 67, p. eabl8419, Jun. 2022, doi: 10.1126/scirobotics.abl8419
2022 doi
-
[29]
Gallegoetal., ‘Event-Based Vision: A Survey’,IEEETrans.Pattern Anal.Mach.Intell., vol
G. Gallegoetal., ‘Event-Based Vision: A Survey’,IEEETrans.Pattern Anal.Mach.Intell., vol. 44, no. 1, pp. 154–180, Jan. 2022, doi: 10.1109/TPAMI.2020.3008413
2022
-
[30]
Posch, T
C. Posch, T. Serrano-Gotarredona, B. Linares-Barranco, and T. Delbruck, ‘Retinomorphic Event-Based Vision Sensors: Bioinspired Cameras With Spiking Output’,Proc.IEEE, vol. 102, no. 10, pp. 1470– 1484, Oct. 2014, doi: 10.1109/JPROC.2014.2346153
2014
-
[31]
C. Choi, G. J. Lee, S. Chang, Y. M. Song, and D. Kim, ‘Inspiration from Visual Ecology for Advancing Multifunctional Robotic Vision Systems: Bio‐inspired Electronic Eyes and Neuromorphic Image Sensors’,Adv. Mater., p. 2412252, Oct. 2024, doi: 10.1002/adma.202412252
2024 doi
-
[32]
Gonzalez and R
R. Gonzalez and R. Woods, ‘Digital Image Processing 3rd ed’, May 2020, Accessed: Nov. 26, 2024. [Online]. Available: http://196.189.149.23/handle/123456789/192.168.6.56/handle/12345678 9/87731
2020
-
[33]
Mead, ‘How we created neuromorphic engineering’,Nat.Electron., vol
C. Mead, ‘How we created neuromorphic engineering’,Nat.Electron., vol. 3, no. 7, pp. 434–435, Jul. 2020, doi: 10.1038/s41928-020-0448-2
2020 doi
-
[34]
Mead, ‘Neuromorphic Engineering: In Memory of Misha Mahowald’, NeuralComput., pp
C. Mead, ‘Neuromorphic Engineering: In Memory of Misha Mahowald’, NeuralComput., pp. 1–41, Nov. 2022, doi: 10.1162/neco_a_01553
2022 doi
-
[35]
Lazzaro, J
J. Lazzaro, J. Wawrzynek, M. Mahowald, M. Sivilotti, and D. Gillespie, ‘Silicon auditory processors as computer peripherals’,IEEETrans. NeuralNetw., vol. 4, no. 3, pp. 523–528, May 1993, doi: 10.1109/72.217193
1993 doi
-
[37]
K. A. Zaghloul and K. Boahen, ‘Optic Nerve Signals in a Neuromorphic Chip II: Testing and Results’,IEEETrans.Biomed.Eng., vol. 51, no. 4, pp. 667–675, Apr. 2004, doi: 10.1109/TBME.2003.821040
2004
-
[38]
Mahowald,AnAnalogVLSISystemforStereoscopicVision
M. Mahowald,AnAnalogVLSISystemforStereoscopicVision. Boston, MA: Springer US, 1994. doi: 10.1007/978-1-4615-2724-4
1994 doi
-
[39]
Jiangetal., ‘Tempo-CIM: A RRAM Compute-in-Memory Neuromorphic Accelerator With Area-Efficient LIF Neuron and Split- Train-Merged-Inference Algorithm for Edge AI Applications’,IEEEJ
J. Jiangetal., ‘Tempo-CIM: A RRAM Compute-in-Memory Neuromorphic Accelerator With Area-Efficient LIF Neuron and Split- Train-Merged-Inference Algorithm for Edge AI Applications’,IEEEJ. Emerg.Sel.Top.CircuitsSyst., vol. 13, no. 4, pp. 986–999, Dec. 2023, doi: 10.1109/JETCAS.202...
2023
-
[41]
J. K. Eshraghianetal., ‘Training Spiking Neural Networks Using Lessons From Deep Learning’,Proc.IEEE, vol. 111, no. 9, pp. 1016– 1054, Sep. 2023, doi: 10.1109/JPROC.2023.3308088
2023
-
[42]
Lichtsteiner, C
P. Lichtsteiner, C. Posch, and T. Delbruck, ‘A 128$\times$128 120 dB 15 $\mu$s Latency Asynchronous Temporal Contrast Vision Sensor’, IEEEJ.Solid-StateCircuits, vol. 43, no. 2, pp. 566–576, 2008, doi: 10.1109/JSSC.2007.914337
2008
-
[43]
Delbrück and A
T. Delbrück and A. V. Schaik, ‘Bias Current Generators with Wide Dynamic Range’,AnalogIntegr.CircuitsSignalProcess., vol. 43, no. 3, pp. 247–268, Jun. 2005, doi: 10.1007/s10470-005-1606-1
2005 doi
-
[44]
Berner, T
R. Berner, T. Delbrück, A. Civit, and A. Linares-Barranco, ‘A 5 Meps $100 USB2.0 Address-Event Monitor-Sequencer Interface’, in2007 IEEEInternationalSymposiumonCircuitsandSystems, IEEE, 2007, pp. 2451–2454. doi: 10.1109/ISCAS.2007.378616
2007
-
[45]
Li, ‘Two-stream vision sensors’, Doctoral Thesis, ETH Zurich, 2017
C. Li, ‘Two-stream vision sensors’, Doctoral Thesis, ETH Zurich, 2017. doi: 10.3929/ethz-b-000164862
2017 doi
-
[46]
D. P. Moeysetal., ‘A Sensitive Dynamic and Active Pixel Vision Sensor for Color or Neural Imaging Applications’,IEEETrans.Biomed. CircuitsSyst., vol. 12, no. 1, pp. 123–136, Feb. 2018, doi: 10.1109/TBCAS.2017.2759783
2018
-
[47]
Culurciello, R
E. Culurciello, R. Etienne-Cummings, and K. A. Boahen, ‘A biomorphic digital image sensor’,IEEEJ.Solid-StateCircuits, vol. 38, no. 2, pp. 281–294, Feb. 2003, doi: 10.1109/JSSC.2002.807412
2003
-
[48]
Matolin, C
D. Matolin, C. Posch, R. Wohlgenannt, and T. Maier, ‘A 64×64 pixel temporal contrast microbolometer infrared sensor’, in2008IEEE InternationalSymposiumonCircuitsandSystems(ISCAS), Seattle, WA, USA: IEEE, May 2008, pp. 1644–1647. doi: 10.1109/ISCAS.2008.4541750
2008
-
[49]
J. A. Lenero-Bardallo, T. Serrano-Gotarredona, and B. Linares-Barranco, ‘A 3.6 $\mu$s Latency Asynchronous Frame-Free Event-Driven Dynamic-Vision-Sensor’,IEEEJ.Solid-StateCircuits, vol. 46, no. 6, pp. 1443–1455, Jun. 2011, doi: 10.1109/JSSC.2011.2118490
2011
-
[50]
Serrano-Gotarredona and B
T. Serrano-Gotarredona and B. Linares-Barranco, ‘A 128$\,\times$128 1.5% Contrast Sensitivity 0.9% FPN 3 µs Latency 4 mW Asynchronous Frame-Free Dynamic Vision Sensor Using Transimpedance 10 > REPLACE THIS LINE WITH YOUR MANUSCRIPT ID NUMBER (DOUBLE-CLICK HERE TO EDIT) < Pream...
2013
-
[51]
Yang, S.-C
M. Yang, S.-C. Liu, and T. Delbruck, ‘Comparison of spike encoding schemes in asynchronous vision sensors: Modeling and design’, in2014 IEEEInternationalSymposiumonCircuitsandSystems(ISCAS), Jun. 2014, pp. 2632–2635. doi: 10.1109/ISCAS.2014.6865713
2014
-
[52]
Hyunsurk Eric, ‘Industrial DVS Design: Key Features and Applications’
R. Hyunsurk Eric, ‘Industrial DVS Design: Key Features and Applications’. [Online]. Available: https://rpg.ifi.uzh.ch/docs/CVPR19workshop/CVPRW19_Eric_Ryu_Sa msung.pdf
-
[53]
Culurciello and R
E. Culurciello and R. Etienne-Cummings, ‘Second generation of high dynamic range, arbitrated digital imager’, in2004IEEEInternational SymposiumonCircuitsandSystems(IEEECat.No.04CH37512), Vancouver, BC, Canada: IEEE, 2004, p. IV-828–31. doi: 10.1109/ISCAS.2004.1329132
2004 arXiv
-
[54]
25, 2024
‘Event-based Vision Sensor and On-chip Processing Development.pptx’, presented at the CVPRW2023, Accessed: Nov. 25, 2024. [Online]. Available: https://docs.google.com/presentation/d/1XrubklM7Z7Rl1zpOWnNUKO FuSFVi9QJO
2024
-
[55]
G. Tavernietal., ‘Live Demonstration: Front and Back Illuminated Dynamic and Active Pixel Vision Sensors Comparison’, in2018IEEE InternationalSymposiumonCircuitsandSystems(ISCAS), Florence: IEEE, May 2018, pp. 1–1. doi: 10.1109/ISCAS.2018.8351314
2018
-
[56]
Tavernietal., ‘Front and Back Illuminated Dynamic and Active Pixel Vision Sensors Comparison’,IEEETrans.CircuitsSyst.IIExpress Briefs, vol
G. Tavernietal., ‘Front and Back Illuminated Dynamic and Active Pixel Vision Sensors Comparison’,IEEETrans.CircuitsSyst.IIExpress Briefs, vol. 65, no. 5, pp. 677–681, May 2018, doi: 10.1109/TCSII.2018.2824899
2018
-
[57]
Yaoetal., ‘Spike-based dynamic computing with asynchronous sensing-computing neuromorphic chip’,Nat.Commun., vol
M. Yaoetal., ‘Spike-based dynamic computing with asynchronous sensing-computing neuromorphic chip’,Nat.Commun., vol. 15, no. 1, p. 4464, May 2024, doi: 10.1038/s41467-024-47811-6
2024 doi
-
[58]
McReynolds, R
B. McReynolds, R. Graca, R. Oliver, M. Nishiguchi, and T. Delbruck, ‘Demystifying Event-based Sensor Biasing to Optimize Signal to Noise for Space Domain Awareness’, Sep. 2023, doi: 10.5167/UZH-254194
2023 doi
-
[59]
C. Li, L. Longinotti, F. Corradi, and T. Delbruck, ‘A 132 by 104 10μm- Pixel 250μW 1kefps Dynamic Vision Sensor with Pixel-Parallel Noise and Spatial Redundancy Suppression’, in2019SymposiumonVLSI Circuits, Jun. 2019, pp. C216–C217. doi: 10.23919/VLSIC.2019.8778050
2019
-
[60]
Brändli and S
C. Brändli and S. Avs, ‘Event-Based Computer Vision at Sony AVS’, [Online]. Available: https://tub- rip.github.io/eventvision2021/slides/CVPRW21_Sony_AVS.pdf
-
[61]
K. A. Boahen, ‘Point-to-point connectivity between neuromorphic chips using address events’,IEEETrans.CircuitsSyst.IIAnalogDigit.Signal Process., vol. 47, no. 5, pp. 416–434, May 2000, doi: 10.1109/82.842110
-
[62]
K. A. Boahen, ‘A Burst-Mode Word-Serial Address-Event Link—I: Transmitter Design’,IEEETrans.CircuitsSyst.Regul.Pap., vol. 51, no. 7, pp. 1269–1280, Jul. 2004, doi: 10.1109/TCSI.2004.830703
2004
-
[63]
Kimetal., ‘Development of DVS evaluation methods from user perspective’,Electron.Imaging, vol
R. Kimetal., ‘Development of DVS evaluation methods from user perspective’,Electron.Imaging, vol. 35, no. 6, pp. 346--1-346–4, Jan. 2023, doi: 10.2352/EI.2023.35.6.ISS-346
2023 doi
-
[64]
Suessetal., ‘Physical Modeling and Parameter Extraction for Event- based Vision Sensors’, [Online]
A. Suessetal., ‘Physical Modeling and Parameter Extraction for Event- based Vision Sensors’, [Online]. Available: https://imagesensors.org/Past%20Workshops/2023%20Workshop/2023 %20Papers/R55.pdf
2023
-
[65]
Hu, S.-C
Y. Hu, S.-C. Liu, and T. Delbruck, ‘v2e: From Video Frames to Realistic DVS Events’, in2021IEEE/CVFConferenceonComputer VisionandPatternRecognitionWorkshops(CVPRW), Nashville, TN, USA: IEEE, Jun. 2021, pp. 1312–1321. doi: 10.1109/CVPRW53098.2021.00144
2021
-
[66]
Yang, ‘Silicon Retina and Cochlea with Asynchronous Delta Modulator for Spike Encoding’, Doctoral Thesis, ETH Zurich, 2015
M. Yang, ‘Silicon Retina and Cochlea with Asynchronous Delta Modulator for Spike Encoding’, Doctoral Thesis, ETH Zurich, 2015. doi: 10.3929/ethz-a-010636883
2015 doi
-
[67]
Vittoz and J
E. Vittoz and J. Fellrath, ‘CMOS analog integrated circuits based on weak inversion operations’,IEEEJ.Solid-StateCircuits, vol. 12, no. 3, pp. 224–231, Jun. 1977, doi: 10.1109/JSSC.1977.1050882
1977
-
[69]
P. N. McMahon-Crabtreeetal., ‘Progress on event-based camera characterization techniques including pre-launch measurements of the Falcon ODIN Space Experiment’, inUnconventionalImaging,Sensing, andAdaptiveOptics2024, S. R. Bose-Pillai, J. J. Dolne, and M. Kalensky, Eds., San D...
2024 doi
- [70]
-
[71]
Posch, D
C. Posch, D. Matolin, R. Wohlgenannt, T. Maier, and M. Litzenberger, ‘A Microbolometer Asynchronous Dynamic Vision Sensor for LWIR’, IEEESens.J., vol. 9, no. 6, pp. 654–664, Jun. 2009, doi: 10.1109/JSEN.2009.2020658
2009
-
[72]
Posch, D
C. Posch, D. Matolin, and R. Wohlgenannt, ‘A two-stage capacitive- feedback differencing amplifier for temporal contrast IR sensors’, AnalogIntegr.CircuitsSignalProcess., vol. 64, no. 1, pp. 45–54, Jul. 2010, doi: 10.1007/s10470-009-9354-2
2010 doi
-
[73]
Z. M. Alsaadetal., ‘DC characteristics of a dynamic vision sensor’s photoreceptor circuit evaluated for event-based sensing in the mid-wave infrared’,J.Appl.Phys., vol. 136, no. 18, p. 184503, Nov. 2024, doi: 10.1063/5.0234266
2024 doi
-
[74]
[Online]
‘Understanding the Performance of Neuromorphic Event-based Vision Sensors’. [Online]. Available: https://inivation.com/wp- content/uploads/2020/05/White-Paper-May-2020.pdf
2020
-
[75]
Guoetal., ‘Developments and characterization of HgCdTe e-APDs at SITP’, inEarthandSpace:FromInfraredtoTerahertz(ESIT2022), SPIE, Jan
H. Guoetal., ‘Developments and characterization of HgCdTe e-APDs at SITP’, inEarthandSpace:FromInfraredtoTerahertz(ESIT2022), SPIE, Jan. 2023, pp. 82–93. doi: 10.1117/12.2665280
2023 doi
-
[76]
Wu Jianshou-Yuan Jialiu
J. Wangetal., ‘A 32×32 Flash LiDAR SPAD Sensor with Up-to-1kfps Motional Target Detection by Threshold-adaptive 2D Dynamic Vision’, in2024IEEECustomIntegratedCircuitsConference(CICC), Apr. 2024, pp. 1–2. doi: 10.1109/CICC60959.2024.10529051. Xinyue Qin received the bachelor’s ...
2017
-
[2133]
doi: 10.1109/ISCAS.2008.4541871
2008
Reviewed August 8, 2026 · model on record in the stance chip above.
Discussion (0). Continue with ORCID to comment.