Design, performance and future prospects of vertex detectors at the FCC-ee

(1) University of Zurich; (2) INFN Pisa); Armin Ilg (1); Fabrizio Palla (2) (on behalf of FCC

REVIEW 3 major objections 5 minor 16 references

Design, performance and future prospects of vertex detectors at the FCC-ee

T0 review · 3 major / 5 minor · reviewed 2026-08-07 · deepseek-v4-flash

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Pith's one-line read The paper shows that replacing the inner layers of the FCC-ee vertex detector with curved, full-wafer silicon pixel sensors would cut the material budget by nearly a factor of three, improving vertex resolution for rare heavy-flavour…

desk verdict Solid proceedings paper with a genuinely new ultra-light VXD geometry in DD4hep, but the abstract's physics claim outruns what the paper's own simulation actually demonstrates. read the letter →

arxiv 2506.02675 v1 pith:VUAC7OWJ submitted 2025-06-03 hep-ex physics.ins-det

Armin Ilg (1) , Fabrizio Palla (2) (on behalf of FCC , (1) University of Zurich , (2) INFN Pisa) This is my paper

classification hep-exphysics.ins-det PACS 29.40.Gx29.40.Wk

keywords vertexdetectorFCC-eemonolithicactivepixelsensorscurvedwafer-scalematerialbudgetimpactparameterresolutionheavyflavourdecaysfullsimulation

verification ladder T0 review T1 audit T2 compute T3 formal

The pith

A machine-rendered reading of the paper's core claim, the machinery that carries it, and where it could break.

The reading

This paper argues that precise vertex reconstruction is a decisive capability for the FCC-ee programme and that the engineered IDEA vertex detector already meets the collider's requirements in full simulation. Its sharper claim is that a more aggressive design, with curved, full-wafer monolithic active pixel sensors wrapped around the beam pipe, would reduce the material budget of the inner layers by almost a factor of three: from about 0.25% of a radiation length per layer to about 0.075%, with the complete four-layer inner vertex detector summing to 0.35%. Such a reduction improves the transverse impact-parameter resolution, especially for low-momentum particles, and could open measurements of extremely rare heavy-flavour decays such as $B^0 \to K^{*0}\tau^+\tau^-$, whose branching ratio is only bounded above at $3.1 \times 10^{-3}$ while the Standard Model expectation is around $10^{-7}$. The study is a design and simulation exercise, not a prototype demonstration; the authors state that no single sensor prototype yet satisfies every FCC-ee vertex-detector requirement.

What carries the argument

The load-bearing object is the curved, wafer-scale MAPS layer made by stitching repeated sensor units, which lets a single thin sensor wrap around the beam pipe. The argument runs through the material budget measured in radiation lengths $X_0$ and the impact-parameter parametrisation $\sigma_{d_0} = a \oplus b/(p\sin^{3/2}\theta)$, where $a$ is the sensor spatial resolution and $b$ encodes multiple-scattering blur from the material before the vertex. Reducing $X_0$ directly lowers $b$, which dominates for low-momentum tracks and for heavy-flavour decay products. The design uses four layers with roughly 10% $\phi$ acceptance gaps per layer, covered by rotating the layers relative to one another, and an asymmetric distribution of sensor units in $z$ on the outer layers to improve forward coverage. A full-simulation geometry implementation supplies the material-budget maps and the track-resolution numbers.

What would settle it

Bend a stitched 50 $\mu$m-thick wafer-scale sensor to a 13.7 mm radius, mount it with only the proposed carbon-foam longerons and external 200 $\mu$m carbon-fibre tube, and measure its hit efficiency, spatial resolution, and total mass. If the sensor cannot hold the curvature, or the assembled four-layer detector exceeds 0.35% $X_0$, the factor-three material-budget claim is falsified.

Watch

Extended reading notes

Core claim

The central claim is that the vertexing performance needed for FCC-ee physics can be delivered by monolithic active pixel sensors (MAPS), and that a curved wafer-scale version would materially outperform the conventional layered design. The conventional IDEA vertex detector, built from thin ladders of MAPS on a carbon-fibre support with gas cooling, reaches about 0.25% $X_0$ on its first layer and about 2% $X_0$ overall, and its simulated transverse impact-parameter resolution is in line with the FCC-ee target $a \approx 3$ $\mu$m and $b \approx 15$ $\mu$m GeV. The ultra-light concept replaces the ladders with stitched full-wafer sensors curved to a radius of 13.7 mm, with 50 $\mu$m of silicon plus 16 $\mu$m silicon-equivalent metal, held by two carbon-foam longerons and rings inside an external 200 $\mu$m carbon-fibre tube; this brings the full inner vertex detector to 0.35% $X_0$ and a single layer to about 0.075% $X_0$ at $\cos\theta = 0$. The performance consequence, verified in full simulation with the IDEA detector inserted into a baseline tracker, is better low-momentum $d_0$ resolution than the comparison design (less multiple scattering) at the price of worse high-momentum resolution (one hit per layer rather than two). The authors argue that this improved resolution could enable rare decays like $B^0 \to K^{*0}\tau^+\tau^-$.

Load-bearing premise

A full-wafer silicon pixel sensor can be curved down to a 13.7 mm radius and held by almost no support structure, without cracking, losing efficiency, or requiring more material than the simulation assumes.

Editorial extensions

If this is right

A working curved wafer-scale vertex detector would drop the inner-layer material budget from about 0.25% to about 0.075% of a radiation length, and the entire four-layer inner detector to 0.35% $X_0$.
The gain appears mainly at low momentum, where multiple scattering is largest; the simulated IDEA vertex detector beats the comparison design at 1 GeV and trails it at high momentum because the comparison records two hits per layer.
The reduced material could bring rare decays such as $B^0 \to K^{*0}\tau^+\tau^-$ within reach, moving from the present upper bound of $3.1 \times 10^{-3}$ toward the Standard Model expectation near $10^{-7}$.
The four-layer layout with relative rotations in $\phi$ preserves acceptance despite each layer's roughly 10% gap from sensor peripheries and half-layer seams.

Reading between the lines

Editorial extensions of the paper, not claims the author makes directly.

If the curved-sensor geometry is realised, the same technique could be transferred to other future lepton colliders or to the innermost layers of hadron-collider detectors, where the first few hundred microns of material dominate vertex resolution.
Because the benefit is concentrated at low momentum, the largest physics gains should appear in tau, charm, and low-momentum b-jet identification; this is a quantitative prediction the present paper does not work out.
A natural next step, left implicit by the paper, is to repeat the full simulation with the IDEA drift chamber in place instead of inserting the vertex detector into the CLD tracker, which would give the final detector performance rather than a cross-detector estimate.

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Editorial analysis

A structured set of objections, weighed in public.

Desk editor's note, referee report, and a circularity audit.

Desk Editor's Note

read the letter

Quick read on arXiv:2506.02675: this is a competent, useful proceedings contribution from the FCC detector effort. The genuinely new piece is in Sec. 5: the first DD4hep full-simulation geometry of a curved wafer-scale MAPS vertex detector adapted from ITS3 to FCC-ee, with a material budget of ~0.35% X0 total and ~0.075% X0 per layer, about a factor of three below the classic IDEA design. That geometry is a real artifact and will be useful for anyone doing FCC-ee tracking studies.

The paper also does a careful job on the IDEA VXD implementation: the DD4hep model follows the CAD, the material budget breakdown is clear, and they disclose the proxy trick of inserting the IDEA VXD into CLD because the drift-chamber reconstruction isn't ready. That is honest. The result that IDEA gives better d0 at low p and worse at high p compared to CLD is plausible, and the explanation (single vs double hits) is sound.

Where it gets soft is the advertised physics payoff. The abstract says the ultra-light concept 'improves the vertexing capabilities, especially for heavy flavour decays, such as B0 -> K*0 tau+ tau-.' But Sec. 5 shows only material budget, no sigma_d0, no tracking efficiency, no vertex reconstruction for the curved geometry. That claim is carried by Refs [14] and [15], a bachelor's thesis and a fast simulation, neither reproduced here. There's also the ~10% phi acceptance gaps from RSU peripheries and half-layer gaps, covered by rotations of other layers; whether that preserves vertexing performance is untested in full simulation. So the paper's most eye-catching sentence is exactly the part its own evidence doesn't support.

The mechanical feasibility of bending stitched sensors to 13.7 mm radius and holding them with two carbon-foam longerons and an external CF tube is assumed, but that's declared as future R&D--reasonable for a proceedings.

This isn't fatal. The paper is transparent about what is simulated and what isn't. But it oversells in the abstract. If this goes to peer review, the fix is straightforward: either add full-simulation vertexing performance for the ultra-light geometry, or temper the abstract to say the reduced material budget is expected to improve vertexing, with the physics case to be demonstrated.

Who's this for? People working on FCC detector concepts and on bent MAPS. It deserves peer review: proceedings or not, it's a concrete new geometry with a clear simulation setup, and the gap between the abstract and the analysis is exactly what referees should catch.

Recommendation: send to peer review with a request for revision, and ask the authors to either quantify the vertexing improvement or soften the claim.

Referee Report

3 major / 5 minor

Summary. This proceedings contribution reports on the FCC-ee vertex detector design effort. It describes the engineered IDEA vertex detector and its machine-detector interface, its implementation in DD4hep, and the material budget and muon impact-parameter resolution obtained by inserting the IDEA VXD into the CLD detector in full simulation. It then presents a first DD4hep implementation of an ultra-light vertex detector based on curved wafer-scale MAPS, reporting a per-layer material budget of about 0.075% X0 and a total of about 0.35% X0, and claims the corresponding physics improvement, e.g., for B0→K*0 tau+tau-, based on earlier fast-simulation studies.

Significance. If the presented material budget and geometry are realized, the ultra-light concept could extend FCC-ee's flavour-physics reach. The paper's strengths are its explicit disclosure of the proxy geometry used for the full-simulation performance (Section 4), the first DD4hep material-budget estimate for a curved wafer-scale MAPS vertex detector adapted to FCC-ee (Section 5), and its candid admission that no existing prototype satisfies all requirements (Section 6). The main limitation is that the advertised physics improvement is not demonstrated in the paper's own simulation; the d0 curves shown are for the IDEA VXD, not for the ultra-light geometry.

major comments (3)

[Section 5 (and Abstract/Conclusions)] The abstract states that the ultra-light concept "improves the vertexing capabilities, especially for heavy flavour decays, such as B0→K*0 tau+tau-", but Section 5 presents no vertexing performance for this geometry. Only the material-budget reduction is shown (Figure 7). The claimed physics benefit rests on Refs. [14,15], an earlier Delphes fast simulation and a bachelor's thesis, which are neither reproduced nor quantified in this paper. The ~10% phi acceptance gaps arising from RSU peripheries and half-layer gaps (Section 5) are said to be covered by layer rotations, but this is not tested with tracking or vertex reconstruction. Reframe the claim as a projection derived from earlier fast simulation, or add the missing performance studies.
[Section 5] The mechanical feasibility of bending wafer-scale stitched MAPS to a radius of 13.7 mm—smaller than the 18 mm radius of ALICE ITS3—and supporting them with only two carbon-foam longerons and rings plus an external 200 μm carbon-fibre tube is assumed, not demonstrated. The paper's own concluding statement (Section 6) says that no single prototype fulfils all requirements. Since the material-budget numbers and hence the physics benefit depend on this structural premise, the manuscript should explicitly identify this as an open R&D item and, if possible, provide quantitative mechanical or cooling estimates similar to those given for the IDEA VXD in Section 3.
[Section 4] The conclusion that IDEA VXD performance is "in line with the requirements of FCC-ee" is not quantified against the stated targets a≈3 μm and b≈15 μm GeV. Figure 5 only shows raw d0 curves for three momenta; no fit to the parametrization σd0 = a ⊕ b/(p sin^(3/2)θ) is shown, and the target b value is never compared. Provide the extracted a and b parameters, or an equivalent quantitative comparison, to support this conclusion.

minor comments (5)

[Section 4, Figure 5] State explicitly that the comparison is for muons only, and clarify whether the same qualitative ordering is expected for pions or electrons given their different energy-loss and bremsstrahlung behavior.
[Section 5] Clarify the sentence "The first layer uses only two RSUs in φ to reach a radius of 13.7 mm as in Section 3" — Section 3 does not describe curved sensors; the meaning appears to be that the radius matches the IDEA inner-layer radius.
[Section 5] Clarify whether the quoted total material budget of 0.35% X0 includes the external 200 μm CF tube; the sentence "Excluding the external 200 μm thick CF tube ... a single layer is ≈0.075% X0" is ambiguous.
[Section 5] The asymmetric RSU layout of the third and fourth layers (8 and 10 RSUs on opposite z sides) is described but not motivated; a sentence explaining the forward-coverage rationale would improve readability.
[Section 2] Provide a reference for the FCC-ee vertexing requirements a≈3 μm and b≈15 μm GeV, or explicitly attribute them to the FCC CDR.

Circularity Check

0 steps flagged · score 0.0 of 10

No significant circularity: material-budget numbers are independently computed, and the cited prior simulations are external support rather than fitted inputs.

full rationale

The paper's derivation chain is not circular. Sections 3–4 construct an engineered IDEA VXD in DD4hep, compute material budgets from CAD-derived geometry, and benchmark transverse impact parameter resolution against CLD using standard iLCSoft reconstruction; these are independent computations with no parameter fitted to the claimed outcome. Section 5 implements a first DD4hep geometry for curved wafer-scale MAPS and reports a material budget of 0.35% X0 (0.075% X0 per layer), which is an independent geometric sum of the chosen materials; the stated factor-of-three reduction is arithmetic from the plotted budgets. The abstract's physics claim about B0 -> K*0 tau+tau- is supported by citation to Refs. [14,15], a Delphes fast simulation and a preceding simulation study by one of the authors. Although this involves self-citation, the cited result is a prior simulation external to this manuscript and is not used to tune or fit the present geometry. No equation in the paper is defined in terms of its own output, and no fitted parameter is renamed as a prediction. The absence of a full-simulation vertexing result for the ultra-light geometry is an evidential gap, not circularity.

Assumptions & free parameters 3 free parameters · 4 assumptions · 0 invented entities

The central results are simulated performance numbers, so the ledger is dominated by design assumptions rather than fitted constants. The three free parameters are fixed by choice or copied from ALICE ITS3 and ARCADIA, not fitted. The four domain assumptions carry the main risk: the simulation-to-design transfer, the CLD proxy, the material-to-physics extrapolation, and the structural feasibility of curved wafer-scale sensors.

free parameters (3)

single-hit spatial resolution = approximately 3 um
Assumed MAPS resolution used as the a-term target and as a simulation input (Sec. 2); not measured here.
multiple-scattering target b = approximately 15 um GeV
FCC-ee target for the b-term in the sigma_d0 parametrization (Sec. 2); used as a benchmark for comparison, not derived in this paper.
ultra-light sensor thickness = 50 um silicon + 16 um Si-equivalent metal
Assumed sensor and metal-layer thickness for the curved MAPS concept (Sec. 5); adopted from the ALICE ITS3 approach and used to compute material budget.

assumptions (4)

domain assumption The DD4hep model faithfully reproduces the CAD design, including material stacks and insensitive sensor peripheries.
Sec. 4 states proxy volumes use reduced density to match total mass; all material budget plots depend on this fidelity.
domain assumption The IDEA VXD inserted into the CLD detector is a valid proxy for final IDEA performance, since the drift-chamber reconstruction is unavailable.
Explicit in Sec. 4; d0 results in Fig. 5 rely on this cross-detector approximation.
domain assumption Lower material budget translates directly into the claimed B0 to K*0 tau+ tau- sensitivity improvement, as indicated by the earlier Delphes fast simulation.
The new full simulation shows only material, not physics; the physics gain is inherited from refs 14 and 15.
domain assumption Curved wafer-scale MAPS can be bent to 13.7 mm radius and mechanically supported by two carbon-foam longerons and rings plus an external 200 um CF tube without exceeding the assumed material.
No structural analysis or prototype is presented for the curved geometry; feasibility is assumed (Sec. 5).

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Cite this review

Pith. "Pith review of Design, performance and future prospects of vertex detectors at the FCC-ee." pith.science (2026). https://pith.science/paper/VUAC7OWJ

@misc{pith2026250602675,
  author       = {Pith},
  title        = {Pith review of: Design, performance and future prospects of vertex detectors at the FCC-ee},
  year         = {2026},
  howpublished = {\url{https://pith.science/paper/VUAC7OWJ}},
  note         = {Machine review of arXiv:2506.02675}
}

abstract

The CERN proposed $e^+e^-$ Future Circular Collider (FCC-ee) is an electroweak, flavour, Higgs and top factory with unprecedented luminosities. Many measurements at the FCC-ee will rely on precisely determining the particle production vertices using dedicated vertex detectors. All vertex detector designs use Monolithic Active Pixel Sensors (MAPS) with a single-hit resolution of $\approx$ 3 $\mu$m and a material budget as low as 0.3% of a radiation length per detection layer, which is within specifications for most of the physics analyses. This contribution presents the status of the fully engineered vertex detectors and their integration with the collider beam pipe and discusses their predicted performance using the DD4hep full simulation. A concept for an ultra-light vertex detector using curved wafer-scale MAPS is also presented, which allows reducing the material budget by almost a factor of three. This improves the vertexing capabilities, especially for heavy flavour decays, such as $B^0 \rightarrow K^{*0} \tau^+ \tau^-$.

Figures

Figures reproduced from arXiv: 2506.02675 by the authors.

**Figure 1.** a shows the inner vertex barrel CAD design. ARCADIA MAPS [9] with dimensions of 8.4 (𝑟-𝜙) × 32 (𝑧) mm2 are placed along 𝑧 on top of a lightweight support structure with readout flexes for powering and readout, forming ladders. By overlapping these ladders, the insensitive periphery of 2 mm in 𝑟-𝜙 can be covered to ensure full hermiticity. The ladders are mounted on a conical support made of carbon fibre (CF) that si… view at source ↗

**Figure 2.** CAD model of the complete IDEA VXD, beam pipe (grey) and the lumical (blue). The cooling performance is assessed by computational fluid dynamics (CFD) simulations, resulting in the largest temperature difference between sensor modules of the third layer of less than 15 ◦C. All other layers dissipate less power. Mechanical vibration analysis has been performed using a finite element analysis (FEA) in ANSYS, resul… view at source ↗

**Figure 3.** IDEA VXD in DD4hep. The description of the IDEA VXD in DD4hep (see [PITH_FULL_IMAGE:figures/full_fig_p004_3.png] view at source ↗

Figures from the paper (4 more)

**Figure 4.** Figure 4: Material budget of the IDEA VXD DD4hep implementation. Since the IDEA drift chamber reconstruction was not available yet with the DD4hep model, the vertexing performance is assessed by inserting the IDEA VXD into CLD and removing one inner tracker barrel and two disks …

**Figure 5.** Figure 5: Transverse impact parameter resolution of the IDEA VXD inserted into CLD compared to standard CLD. CLD, however, is superior at higher momenta due to providing two hits per layer. The expected vertexing performance of IDEA is in line with the requirements of FCC-ee,…

**Figure 6.** Figure 6: Curved wafer-scale sensors (yellow), carbon foam supports (black) and flex circuits (green) forming the ultra-light VXD concept implementation in DD4hep. The ITS3 concept must be adapted to serve as an inner vertex detector for FCC-ee. The first layer, shown in Figure …

**Figure 7.** Figure 7: Material budget of the ultra-light inner VXD concept DD4hep implementation. The concept features four layers to compensate for the fact that not every layer detects every track due to gaps in 𝜙 acceptance of ≈ 10 % from the RSU peripheries and gaps between the half-la…

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Reference graph

Works this paper leans on

16 extracted references · 15 canonical work pages

[14]

Freitag,Benefits of Minimizing the Vertex Detector Material Budget at the FCC-ee, https://cds.cern.ch/record/2851362, bachelor’s thesis, University of Zürich, 2023

L. Freitag,Benefits of Minimizing the Vertex Detector Material Budget at the FCC-ee, https://cds.cern.ch/record/2851362, bachelor’s thesis, University of Zürich, 2023

work page arXiv 2023
[15]

Ilg,Design and performance of the IDEA vertex detector at FCC-ee in full simulation,PoS(EPS-HEP2023) (2023) 600

A. Ilg,Design and performance of the IDEA vertex detector at FCC-ee in full simulation,PoS(EPS-HEP2023) (2023) 600

work page 2023
[1]

Abada, M

A. Abada, M. Abbrescia, S.S. AbdusSalam, I. Abdyukhanov, J. Abelleira Fernandez, A. Abramov et al.,FCC-ee: The lepton collider: Future circular collider conceptual design report volume 2,EPJ ST228(2019) 261–623

work page 2019
[2]

Abada, M

A. Abada, M. Abbrescia, S.S. AbdusSalam, I. Abdyukhanov, J. Abelleira Fernandez, A. Abramov et al.,FCC-hh: the hadron collider: Future circular collider conceptual design report volume 3,EPJ ST228(2019) 755–1107

work page 2019
[3]

Tassielli,A proposal of a drift chamber for the IDEA experiment for a future𝑒+𝑒− collider, PoS(ICHEP2020)(2021) 877

G.F. Tassielli,A proposal of a drift chamber for the IDEA experiment for a future𝑒+𝑒− collider, PoS(ICHEP2020)(2021) 877

work page 2021
[4]

Bacchetta, J.J

N. Bacchetta, J.J. Blaising, E. Brondolin, M. Dam, D. Dannheim, K. Elsener et al.,CLD – a detector concept for the FCC-ee, 1911.12230

arXiv 1911
[5]

Aleksa, F

M. Aleksa, F. Bedeschi, R. Ferrari, F. Sefkow and C.G. Tully,Calorimetry at FCC-ee,EPJ Plus136(2021) 1066

work page 2021
[6]

Boscolo, F

M. Boscolo, F. Palla, F. Bosi, F. Fransesini and S. Lauciani,Mechanical model for the FCC-ee interaction region, EPJ Techniques and Instrumentation10(2023)

work page 2023

Show all 16 references

[7]

Boscolo, Manuela, Frasca, Alessandro, Novokhatski, Alexander, Ciarma, Andrea, Lechner, Anton, Ilg, Armin et al.,Progress in the design of the future circular collider FCC-ee interaction region, JACoW(2024)

2024
[8]

Boscolo, H

M. Boscolo, H. Burkhardt, K. Oide and M.K. Sullivan,IR challenges and the machine detector interface at FCC-ee,EPJ Plus136(2021)

2021
[9]

Pancheri, R.A

L. Pancheri, R.A. Giampaolo, A.D. Salvo, S. Mattiazzo, T. Corradino, P. Giubilato et al.,Fully depleted MAPS in 110-nm CMOS process with 100–300-𝜇m active substrate,IEEE Trans. on Electron Devices67 (2020) 2393

2020
[10]

Peric, A

I. Peric, A. Andreazza, H. Augustin, M. Barbero, M. Benoit, R. Casanova et al.,High-voltage cmos active pixel sensor,IEEE Journal of Solid-State Circuits56 (2021) 2488–2502

2021
[11]

Gaede, M

F. Gaede, M. Frank, M. Petric and A. Sailer,DD4hep a community driven detector description for HEP,EPJ Web Conf. 245 (2020) 02004

2020
[12]

Brondolin, E

E. Brondolin, E. Leogrande, D. Hynds, F. Gaede, M. Petrič, A. Sailer et al.,Conformal tracking for all-silicon trackers at future electron–positron colliders,NIMA 956(2020) 163304

2020
[13]

Belle collaboration,Search for the decay𝐵0→𝐾∗0𝜏+𝜏− at the Belle experiment,Phys. Rev. D108(2023) L011102

2023
[16]

ALICEcollaboration, Technical Design report for the ALICE Inner Tracking System 3 - ITS3 ; A bent wafer-scale monolithic pixel detector, Tech. Rep. CERN-LHCC-2024-003, ALICE-TDR-021, CERN (2024). 6

2024

Pith tools

Reviewed August 7, 2026 · model on record in the stance chip above.

[1] [14]

Freitag,Benefits of Minimizing the Vertex Detector Material Budget at the FCC-ee, https://cds.cern.ch/record/2851362, bachelor’s thesis, University of Zürich, 2023

L. Freitag,Benefits of Minimizing the Vertex Detector Material Budget at the FCC-ee, https://cds.cern.ch/record/2851362, bachelor’s thesis, University of Zürich, 2023

work page arXiv 2023

[2] [15]

Ilg,Design and performance of the IDEA vertex detector at FCC-ee in full simulation,PoS(EPS-HEP2023) (2023) 600

A. Ilg,Design and performance of the IDEA vertex detector at FCC-ee in full simulation,PoS(EPS-HEP2023) (2023) 600

work page 2023

[3] [1]

Abada, M

A. Abada, M. Abbrescia, S.S. AbdusSalam, I. Abdyukhanov, J. Abelleira Fernandez, A. Abramov et al.,FCC-ee: The lepton collider: Future circular collider conceptual design report volume 2,EPJ ST228(2019) 261–623

work page 2019

[4] [2]

Abada, M

A. Abada, M. Abbrescia, S.S. AbdusSalam, I. Abdyukhanov, J. Abelleira Fernandez, A. Abramov et al.,FCC-hh: the hadron collider: Future circular collider conceptual design report volume 3,EPJ ST228(2019) 755–1107

work page 2019

[5] [3]

Tassielli,A proposal of a drift chamber for the IDEA experiment for a future𝑒+𝑒− collider, PoS(ICHEP2020)(2021) 877

G.F. Tassielli,A proposal of a drift chamber for the IDEA experiment for a future𝑒+𝑒− collider, PoS(ICHEP2020)(2021) 877

work page 2021

[6] [4]

Bacchetta, J.J

N. Bacchetta, J.J. Blaising, E. Brondolin, M. Dam, D. Dannheim, K. Elsener et al.,CLD – a detector concept for the FCC-ee, 1911.12230

arXiv 1911

[7] [5]

Aleksa, F

M. Aleksa, F. Bedeschi, R. Ferrari, F. Sefkow and C.G. Tully,Calorimetry at FCC-ee,EPJ Plus136(2021) 1066

work page 2021

[8] [6]

Boscolo, F

M. Boscolo, F. Palla, F. Bosi, F. Fransesini and S. Lauciani,Mechanical model for the FCC-ee interaction region, EPJ Techniques and Instrumentation10(2023)

work page 2023