pith. machine review for the scientific record. sign in

arxiv: 2603.25556 · v2 · submitted 2026-03-26 · ❄️ cond-mat.mtrl-sci

Recognition: no theorem link

Revealing the Atomic-Scale Structure of the Copper Sulfuric Acid Interface

Authors on Pith no claims yet

Pith reviewed 2026-05-15 00:13 UTC · model grok-4.3

classification ❄️ cond-mat.mtrl-sci
keywords copper corrosionsulfuric acidcryo atom probe tomographymicrocorrosion cellnanoscale clusteringion pairinginterface chemistrytransient complexes
0
0 comments X

The pith

A microcorrosion cell with localized electrodeposition and cryoAPT maps 3D atomic-scale chemistry at the copper-sulfuric acid interface.

A machine-rendered reading of the paper's core claim, the machinery that carries it, and where it could break.

The paper introduces a microcorrosion cell made by localized electrodeposition in liquid that seals picoliter volumes of electrolyte around a copper surface inside a metallic vessel. The sealed cell is frozen and examined by cryogenic atom probe tomography, which preserves the dynamic solid-liquid boundary long enough for analysis. Applied to copper in aerated dilute sulfuric acid, the method tracks how the interface changes with temperature and exposure time. A sympathetic reader cares because corrosion begins with these fleeting atomic reactions, and direct nanoscale chemical maps can replace indirect models that have limited predictive power.

Core claim

The microcorrosion cell fabricated using localized electrodeposition in liquid enables atomic scale capture of liquid metal reactions by integrating picoliter-scale electrolytes encapsulated within sealed metallic microvessels, subsequently analyzed using cryoAPT. This approach enables 3D, nanoscale mapping of corrosion reactions with simultaneous spatial, chemical, and temporal resolution. As a model system, copper exposed to aerated dilute sulphuric acid reveals temperature and time dependent interfacial evolution, including nanoscale clustering of copper sulphate species, enhanced ion pairing at elevated temperature, and the emergence of transient carbon based interfacial complexes.

What carries the argument

The microcorrosion cell fabricated using localized electrodeposition in liquid (LEL), which encapsulates electrolytes within sealed microvessels to preserve native interfacial states for cryogenic atom probe tomography.

If this is right

  • Enables simultaneous spatial, chemical, and temporal resolution in 3D mapping of corrosion reactions.
  • Shows nanoscale clustering of copper sulphate species that grows with temperature and time.
  • Demonstrates stronger ion pairing at the interface under elevated temperature conditions.
  • Detects transient carbon-based complexes that conventional methods miss.
  • Provides a general fabrication route for studying confined electrochemical processes in other material-liquid pairs.

Where Pith is reading between the lines

These are editorial extensions of the paper, not claims the author makes directly.

  • The same cell design could be adapted to map interfaces in other common corroding systems such as steel or aluminum alloys.
  • Coupling the sealed cell with non-destructive probes before freezing might allow tracking of the same interface through multiple time points.
  • The unexpected carbon complexes suggest that trace organics from the environment or electrolyte can participate in inorganic corrosion layers.
  • Widespread use of this mapping could supply atomic-scale data to improve molecular-dynamics simulations of corrosion kinetics.

Load-bearing premise

The microcorrosion cell fabrication, encapsulation, and cryogenic freezing steps preserve the original liquid-solid chemistry without adding artifacts or altering transient interfacial species.

What would settle it

A side-by-side comparison showing large differences in detected copper-sulfate clustering or carbon-complex signals between the frozen encapsulated samples and non-frozen in-situ spectroscopy would falsify the preservation claim.

Figures

Figures reproduced from arXiv: 2603.25556 by Ayman A. El-Zoka, Baptiste Gault, Finn Giuliani, Gerhard Dehm, Lalith Kumar Bhaskar, Mary P. Ryan, Oliver R. Waszkiewicz, Rajaprakash Ramachandramoorthy, Roger C. Newman, Sung-Gyu Kang.

Figure 1
Figure 1. Figure 1: a) Schematic of the microfabrication method for printing microcorrosion [PITH_FULL_IMAGE:figures/full_fig_p006_1.png] view at source ↗
Figure 2
Figure 2. Figure 2: a) Shows the three different conditions in which the [PITH_FULL_IMAGE:figures/full_fig_p007_2.png] view at source ↗
Figure 3
Figure 3. Figure 3: (a) shows the region of the MCC from which the APT needle was [PITH_FULL_IMAGE:figures/full_fig_p009_3.png] view at source ↗
Figure 4
Figure 4. Figure 4: (a) shows the region of the MCC (after two days) from which the APT [PITH_FULL_IMAGE:figures/full_fig_p011_4.png] view at source ↗
Figure 5
Figure 5. Figure 5: a) Atomic map extracted within the frozen liquid (0.1 M H [PITH_FULL_IMAGE:figures/full_fig_p013_5.png] view at source ↗
Figure 6
Figure 6. Figure 6: a) Atomic map extracted within the frozen liquid (0.1 M H [PITH_FULL_IMAGE:figures/full_fig_p016_6.png] view at source ↗
read the original abstract

Corrosion originates from atomistic reactions occurring at dynamic solid liquid interfaces however, direct experimental observation of these reactions has remained elusive due to the inability to preserve transient interfacial states during characterization. To refine corrosion models, advanced techniques capable of analyzing corrosion interfaces at the atomic scale are essential. Recent advancements in cryogenic atom probe tomography (cryoAPT) enabled 3D nanoscale analysis of frozen liquid metal interfaces. However, challenges remain in sample preparation for cryoAPT on metals undergoing corrosion. This study introduces a microcorrosion cell fabricated using localized electrodeposition in liquid (LEL), enabling atomic scale capture of liquid metal reactions by integrating picoliterscale electrolytes encapsulated within sealed metallic microvessels, subsequently analyzed using cryoAPT.This approach enables 3D, nanoscale mapping of corrosion reactions with simultaneous spatial, chemical, and temporal resolution. As a model system, copper exposed to aerated dilute sulphuric acid reveals temperature and time dependent interfacial evolution, including nanoscale clustering of copper sulphate species, enhanced ion pairing at elevated temperature, and the emergence of transient carbon based interfacial complexes inaccessible to conventional characterization methods.Beyond copper corrosion, the presented microcorrosion cell architecture establishes a strategy for interrogating confined electrochemical and degradation processes across a wide range of material liquid systems, using a combination of microfabrication and cryoAPT.

Editorial analysis

A structured set of objections, weighed in public.

Desk editor's note, referee report, simulated authors' rebuttal, and a circularity audit. Tearing a paper down is the easy half of reading it; the pith above is the substance, this is the friction.

Referee Report

2 major / 2 minor

Summary. The manuscript introduces a microcorrosion cell fabricated via localized electrodeposition in liquid (LEL) to encapsulate picoliter-scale sulfuric acid electrolytes with copper, enabling cryogenic atom probe tomography (cryoAPT) for 3D nanoscale mapping of the Cu/H2SO4 interface. It reports temperature- and time-dependent evolution including nanoscale copper sulphate clustering, enhanced ion pairing at elevated temperature, and transient carbon-based interfacial complexes inaccessible to conventional methods, positioning the approach as a general strategy for confined electrochemical processes.

Significance. If the preparation fidelity is validated, the work would represent a meaningful advance in corrosion and interface science by providing simultaneous spatial, chemical, and temporal resolution at the atomic scale for dynamic solid-liquid reactions. The microfabrication-plus-cryoAPT architecture could extend to other material-liquid systems, addressing a long-standing gap in direct observation of transient states.

major comments (2)
  1. [Methods / Sample Preparation] The central claim that LEL encapsulation, sealing, and plunge-freezing preserve native transient states (e.g., CuSO4 clusters and C complexes) without artifacts is load-bearing but unsupported. No quantitative pre- vs. post-encapsulation comparisons, oxidation-state checks, or contaminant markers are shown to rule out preparation-induced changes, leaving the observed features ambiguously attributable to corrosion rather than the sample-preparation sequence.
  2. [Results / Abstract] The abstract and results description list interfacial observations but provide no quantitative data, error bars, statistical analysis, or direct validation against known stable Cu/H2SO4 reference interfaces. This absence prevents assessment of whether the reported clustering and ion-pairing trends exceed noise or preparation effects.
minor comments (2)
  1. [Title / Abstract] Inconsistent spelling of 'sulphuric' (abstract) versus 'Sulfuric' (title).
  2. [Abstract] Typographical error: 'picoliterscale' should read 'picoliter-scale'.

Simulated Author's Rebuttal

2 responses · 0 unresolved

We thank the referee for the constructive feedback and positive assessment of the work's potential significance. We address each major comment below and have revised the manuscript accordingly to strengthen the validation and quantification of our claims.

read point-by-point responses
  1. Referee: [Methods / Sample Preparation] The central claim that LEL encapsulation, sealing, and plunge-freezing preserve native transient states (e.g., CuSO4 clusters and C complexes) without artifacts is load-bearing but unsupported. No quantitative pre- vs. post-encapsulation comparisons, oxidation-state checks, or contaminant markers are shown to rule out preparation-induced changes, leaving the observed features ambiguously attributable to corrosion rather than the sample-preparation sequence.

    Authors: We agree that explicit validation of preparation fidelity is essential to support the central claims. In the revised manuscript, we have added a dedicated subsection in Methods describing control experiments: quantitative pre- and post-encapsulation optical microscopy and Raman spectroscopy comparisons on reference Cu samples showing no detectable interface alteration or oxidation; XPS oxidation-state checks confirming consistent Cu(0)/Cu(II) ratios; and APT-derived contaminant marker analysis (e.g., absence of extraneous elements beyond expected Cu, S, O, C). These data indicate the observed CuSO4 clusters and transient C complexes arise from the corrosion process rather than preparation artifacts. We have also clarified the plunge-freezing protocol details. revision: yes

  2. Referee: [Results / Abstract] The abstract and results description list interfacial observations but provide no quantitative data, error bars, statistical analysis, or direct validation against known stable Cu/H2SO4 reference interfaces. This absence prevents assessment of whether the reported clustering and ion-pairing trends exceed noise or preparation effects.

    Authors: We concur that quantitative metrics are needed for rigorous assessment. The revised Results section now incorporates error bars and statistical analysis (standard deviations and t-tests from n=5 independent APT datasets) for cluster size distributions and ion-pairing fractions as a function of temperature and time. The abstract has been updated to reference these quantitative trends. We added a comparison to literature values for stable Cu/H2SO4 interfaces from electrochemical and spectroscopic studies, showing our temperature-dependent clustering exceeds equilibrium expectations and noise levels validated by time-zero control samples. A new supplementary figure presents the quantitative distributions. revision: yes

Circularity Check

0 steps flagged

No circularity: experimental method paper with no derivations or self-referential fits

full rationale

The manuscript is a methods demonstration of LEL microcell fabrication followed by cryoAPT imaging. It contains no equations, no fitted parameters, no predictions derived from inputs, and no load-bearing self-citations that reduce claims to prior author work. All reported features (CuSO4 clusters, ion pairing, transient C complexes) are presented as direct observational outcomes of the new sample-preparation protocol rather than quantities obtained by algebraic rearrangement or parameter renaming. The central assumption that encapsulation preserves native states is an empirical claim open to external validation, not a self-definitional or fitted-input step.

Axiom & Free-Parameter Ledger

0 free parameters · 2 axioms · 1 invented entities

The central claim rests on two domain assumptions about sample integrity and one newly introduced fabrication method; no free parameters or invented physical entities are introduced.

axioms (2)
  • domain assumption Cryogenic freezing and atom probe tomography preserve the original liquid-solid interfacial chemistry and structure without significant artifacts.
    Invoked when claiming that transient states are captured for analysis.
  • domain assumption Localized electrodeposition in liquid can fabricate sealed metallic microvessels that encapsulate electrolytes without contamination or alteration of the interface.
    Central premise of the sample preparation step described in the abstract.
invented entities (1)
  • Microcorrosion cell no independent evidence
    purpose: To encapsulate picoliter-scale electrolytes within sealed metallic microvessels for cryoAPT analysis of corrosion interfaces.
    Newly described architecture presented as the enabling technology; no independent evidence of its performance outside this work is provided in the abstract.

pith-pipeline@v0.9.0 · 5581 in / 1499 out tokens · 55258 ms · 2026-05-15T00:13:52.278332+00:00 · methodology

discussion (0)

Sign in with ORCID, Apple, or X to comment. Anyone can read and Pith papers without signing in.

Reference graph

Works this paper leans on

60 extracted references · 60 canonical work pages

  1. [1]

    Introduction Materials degradation and, more specifically, corrosion of metals have proven to continuously impact our economy. The monetary impact of corrosion has been estimated by reports to amount to 2.5 trillion USD per year as of 2013, which is almost 3.4% percent of the world’s annual gross domestic product 1. Corrosion has an impact on the lifetime...

  2. [2]

    Results & Discussion 2.1. Microcorrosion Cell Design To encapsulate dilute sulfuric acid (0.1 M H2SO4, pH ~0.95) within copper metal, we employed a 3D microfabrication approach based on localized electrodeposition in liquid (LEL)38,39, 5 | P a g e which enables the precise printing of micron -scale structures. A schematic of the fabrication process for th...

  3. [3]

    This approach achieves precise control over liquid volume and interface positioning, reducing preparation time while delivering greater than 90% success rates

    Conclusions In this work, a novel 3D -printed microcorrosion cell design that enables efficient, high -yield cryo-APT analysis of solid –liquid interfaces is demonstrated here for the analysis of copper corrosion in aerated, dilute sulfuric acid (0.1M H2SO4). This approach achieves precise control over liquid volume and interface positioning, reducing pre...

  4. [4]

    Methods 4.1. Printing of microcorrosion cells In this work, a localised electrodeposition in liquid (LEL) technique was employed to fabricate microcorrosion cells using a force-controlled electrodeposition system (CERES, Exaddon AG, Switzerland). The electrolyte for printing the structure consisted of 0.5 M CuSO 4 in 51 mM H2SO4 and 0.48 mM HCl with brigh...

  5. [5]

    Acknowledgements L.K.B. and R.R. would like to acknowledge funding from the European Research Council (ERC) (Starting grant agreement No. 101078619; AMMicro). L.K.B. acknowledges partial funding from the SFB 1394 (project ID 409476157). G.D. and L.K.B. are grateful for sup port by KSB Stiftung (project no 3.2025.14). A.A.Z acknowledges support from the De...

  6. [6]

    Conflict of Interest No conflicts of interest to be declared

  7. [7]

    Cost of corrosion

    Koch, G. Cost of corrosion. Trends Oil Gas Corros. Res. Technol. Prod. Transm. 3–30 (2017) doi:10.1016/B978-0-08-101105-8.00001-2

  8. [8]

    & Lavanya, M

    Kumari, P. & Lavanya, M. Optimization Strategies for Corrosion Management in Industries with Artificial Neural Network and Response Surface Technology: A Comprehensive Review. J. Bio- Tribo-Corrosion 10, 1–19 (2024)

  9. [9]

    & Frankel, G

    Iannuzzi, M. & Frankel, G. S. The carbon footprint of steel corrosion. npj Mater. Degrad. 6, 1–4 (2022)

  10. [10]

    & Zhao, Y

    Mao, Q., Liu, Y. & Zhao, Y. A review on copper alloys with high strength and high electrical conductivity. J. Alloys Compd. 990, 174456 (2024)

  11. [11]

    & Warlimont, H

    Freudenberger, J. & Warlimont, H. Springer Handbook of Materials Data. (Springer Nature Switzerland AG, 2018)

  12. [12]

    https://internationalcopper.org/trends-and-data/resource- 20 | P a g e library/.Accessed on 18th December 2025

    Copper recycling. https://internationalcopper.org/trends-and-data/resource- 20 | P a g e library/.Accessed on 18th December 2025

  13. [13]

    Nutor, R. K. et al. Enabling circularity of copper through nanoscale impurity control. Acta Mater. 297, 121373 (2025)

  14. [14]

    T., Eggert, R

    Nguyen, R. T., Eggert, R. G., Severson, M. H. & Anderson, C. G. Global Electrification of Vehicles and Intertwined Material Supply Chains of Cobalt, Copper and Nickel. Resour. Conserv. Recycl. 167, 105198 (2021)

  15. [15]

    Harmsen, J. H. M., Roes, A. L. & Patel, M. K. The impact of copper scarcity on the efficiency of 2050 global renewable energy scenarios. Energy 50, 62–73 (2013)

  16. [16]

    P., Wheeler, D., Huber, W

    Moffat, T. P., Wheeler, D., Huber, W. H. & Josell, D. Erratum: Superconformal electrodeposition of copper (Electrochemical and Solid-State Letters (2001) 4 (C26)). Electrochem. Solid-State Lett. 4, 4–5 (2001)

  17. [17]

    P., Wheeler, D

    Moffat, T. P., Wheeler, D. & Josell, D. Electrodeposition of Copper in the SPS-PEG- Cl Additive System. J. Electrochem. Soc. 151, C262 (2004)

  18. [18]

    & Bockris, J

    Matisson, E. & Bockris, J. O. M. Galvanostatic studies of the kinetics of deposition and dissolution in the copper + copper sulphate system. Trans. Faraday Soc. 55, 1586– 1601 (1959)

  19. [19]

    Bockers, J. O. & Enyo, M. Mechanism of Electrodeposition and Dissolution. Trans. Faraday Soc. 58, 1187–1202 (1962)

  20. [20]

    Sun, G. et al. Enhancement of copper metal dissolution in sulfuric acid solution with oxygen and ultrasound. J. Mater. Res. Technol. 26, 5016–5027 (2023)

  21. [21]

    Bockris, J. O. M. & Conway, B. E. Determination of the faradaic impedance at solid electrodes and the electrodeposition of copper. J. Chem. Phys. 28, 707–716 (1958)

  22. [22]

    & Pehkonen, S

    Palit, A. & Pehkonen, S. O. Copper corrosion in distribution systems: Evaluation of a homogeneous Cu2O film and a natural corrosion scale as corrosion inhibitors. Corros. Sci. 42, 1801–1822 (2000)

  23. [23]

    & Cougnon, C

    Touzé, E. & Cougnon, C. Study of the air-formed oxide layer at the copper surface and its impact on the copper corrosion in an aggressive chloride medium. Electrochim. Acta 262, 206–213 (2018)

  24. [24]

    & Khan, A

    Naseer, A. & Khan, A. Y. A study of growth and breakdown of passive film on copper 21 | P a g e surface by electrochemical impedance spectroscopy. Turkish J. Chem. 33, 739–750 (2009)

  25. [25]

    & Scully, J

    Ha, H., Taxen, C., Williams, K. & Scully, J. Effects of selected water chemistry variables on copper pitting propagation in potable water. Electrochim. Acta 56, 6165– 6183 (2011)

  26. [26]

    P., Mankowski, G

    Duthil, J. P., Mankowski, G. & Giusti, A. The synergetic effect of chloride and sulphate on pitting corrosion of copper. Corros. Sci. 38, 1839–1849 (1996)

  27. [27]

    & Jiang, J

    Ma, Y., Tian, X., Yin, J., Chen, J. & Jiang, J. The pitting corrosion behavior of copper with different grain size. Int. J. Electrochem. Sci. 14, 4047–4056 (2019)

  28. [28]

    & Verbeken, K

    Lapeire, L., Martinez Lombardia, E., De Graeve, I., Terryn, H. & Verbeken, K. Influence of grain size on the electrochemical behavior of pure copper. J. Mater. Sci. 52, 1501–1510 (2017)

  29. [29]

    Benzarti, Z. et al. Copper corrosion mechanisms, influencing factors, and mitigation strategies for water circuits of heat exchangers: critical review and current advances. Corros. Rev. 43, 429–455 (2024)

  30. [30]

    Bockris, J. O. & Kita, H. The Dependence of Charge Transfer and Surface Diffusion Rates on the Structure and Stability of an Electrode Surface: Copper. J. Electrochem. Soc. 109, 928 (1962)

  31. [31]

    P., Muto, I

    Nishimoto, M., Kollender, J. P., Muto, I. & Hassel, A. W. In situ ICP-MS analysis of passivation process and selective dissolution of Fe-15Cr alloy in sulfuric acid. Corros. Sci. 249, 2–7 (2025)

  32. [32]

    Wilde, C. P. & Pisharodi, D. An EQCM study of corrosion and complexation at electrode surfaces. Oxidation of silver in the presence of 4,4′-bipyridyl. J. Electroanal. Chem. 398, 143–150 (1995)

  33. [33]

    P., Cairney, J

    Gault, B., Moody, M. P., Cairney, J. M. & Ringer, S. P. Experimental Protocols in Atom Probe Tomography. Springer Series in Materials Science vol. 160 (2012)

  34. [34]

    Miller, M. K. Atom probe tomography: analysis at the atomic level. (2000)

  35. [35]

    A., Stintz, A

    Stintz, A., Panitz, J. A., Stintz, A. & Panitz, J. A. Imaging atomprobe analysis of an aqueous interface Imaging atom-probe analysis of an aqueous interface. 1365, 21–24 22 | P a g e (2014)

  36. [36]

    & Panitz, J

    Stintz, A. & Panitz, J. A. Cluster ion formation in isothermal ramped field-desorption of amorphous water ice from metal surfaces. 296, 75–86 (1993)

  37. [37]

    Panitz, J. A. Point-Projection imaging of unstained Ferritin clusters. Ultramicroscopy 7, 241–248 (1982)

  38. [38]

    Rusitzka, K. A. K. et al. OPEN A near atomic-scale view at the composition of amyloid-beta fibrils by atom probe tomography. Sci. Rep. 1–10 (2018) doi:10.1038/s41598-018-36110-y

  39. [39]

    K., Perea, D

    Schreiber, D. K., Perea, D. E., Ryan, J. V., Evans, J. E. & Vienna, J. D. A method for site-specific and cryogenic specimen fabrication of liquid/solid interfaces for atom probe tomography. Ultramicroscopy 194, 89–99 (2018)

  40. [40]

    Stender, P. et al. Status and Direction of Atom Probe Analysis of Frozen Liquids. Microsc. Microanal. 28, 1150–1167 (2022)

  41. [41]

    Schwarz, T. M. et al. Field evaporation and atom probe tomography of pure water tips. Sci. Rep. 10, 1–14 (2020)

  42. [42]

    M., Ott, J., Solodenko, H., Schmitz, G

    Schwarz, T. M., Ott, J., Solodenko, H., Schmitz, G. & Stender, P. Nanoscale analysis of frozen honey by atom probe tomography. Sci. Rep. 12, 1–14 (2022)

  43. [43]

    El-Zoka, A. A. et al. Enabling near-atomic–scale analysis of frozen water. Sci. Adv. 6, 1–11 (2020)

  44. [44]

    Ramachandramoorthy, R. et al. Anomalous high strain rate compressive behavior of additively manufactured copper micropillars. Appl. Mater. Today 27, 101415 (2022)

  45. [45]

    Kang, S.-G. et al. 3D Printed Liquid-Filled Metal Microarchitectures. Available SSRN 5006898 (2024)

  46. [46]

    Ercolano, G. et al. Additive manufacturing of sub-micron to sub-mm Metal structures with hollow AFM cantilevers. Micromachines 11, 1–14 (2020)

  47. [47]

    Schwarz,* Jing Yang, Leonardo S

    Tim M. Schwarz,* Jing Yang, Leonardo S. Aota, Eric Woods, Xuyang Zhou, Jörg Neugebauer, Mira Todorova, Ingrid McCarroll, and B. G. Advanced Materials - 2024 - Schwarz - Quasi‐ In Situ Analysis of the Reactive Liquid‐Solid Interface during Magnesium.pdf. Adv. Mater. vol. 36 2401735 at (2024). 23 | P a g e

  48. [48]

    & Arav, A

    Yavin, S. & Arav, A. Measurement of essential physical properties of vitrification solutions. 67, 81–89 (2007)

  49. [49]

    Y., Binns, W

    Persaud, S. Y., Binns, W. J., Guo, M. & Keech, P. G. Materials Corrosion - 2023 - Persaud - Applying state‐of‐the‐art microscopy techniques to understand the degradation of copper for nuclear waste canisters. Mater. Corros. 74, 1619–1631 (2023)

  50. [50]

    P., Bianchi, H

    Méndez De Leo, L. P., Bianchi, H. L. & Fernández-Prini, R. Ion pair formation in copper sulfate aqueous solutions at high temperatures. J. Chem. Thermodyn. 37, 499– 511 (2005)

  51. [51]

    & Jokilaakso, A

    Aromaa, J., Kekkonen, M., Mousapour, M. & Jokilaakso, A. The Oxidation of Copper in Air at Temperatures up to 100 ◦ C. 625–640 (2021)

  52. [52]

    Wang, X. et al. Interpreting nanovoids in atom probe tomography data for accurate local compositional measurements. Nat. Commun. 11, 1–11 (2020)

  53. [53]

    Dubosq, R. et al. Analysis of nanoscale fluid inclusions in geomaterials by atom probe tomography: Experiments and numerical simulations. Ultramicroscopy 218, 113092 (2020)

  54. [54]

    Kim, K. T. Y. S. Effects of Sulfuric Acid Concentration and Alloying Elements on the Corrosion Resistance of Cu-bearing low Alloy Steels. Corros. Sci. Technol. 17, 154– 165 (2018)

  55. [55]

    R., Kothleitner, G., Shibata, N

    Lugg, N. R., Kothleitner, G., Shibata, N. & Ikuhara, Y. On the quantitativeness of EDS STEM. Ultramicroscopy 151, 150–159 (2015)

  56. [56]

    N., Ghandehari, M

    Andersen, T. N., Ghandehari, M. H. & Eyring, H. A Limitation to the Mixed Potential Concept of Metal Corrosion: Copper in Oxygenated Sulfuric Acid Solutions. J. Electrochem. Soc. 122, 1580–1585 (1975)

  57. [57]

    Lide, D. R. & Baysinger, G. CRC Handbook of Chemistry and Physics

  58. [58]

    Critical Evaluation of the Second Dissociation Constants for Aqueous Sulfuric Acid over a Wide Temperature Range

    Sippola, H. Critical Evaluation of the Second Dissociation Constants for Aqueous Sulfuric Acid over a Wide Temperature Range. (2013)

  59. [59]

    Gault, Moody, M

    B. Gault, Moody, M. P., Cairney, J. M. & Simon P. Ringer. Atom Probe Microscopy. (Springer Science, New York, 2012). 24 | P a g e

  60. [60]

    L.Stephenson. et al. The Laplace Project : An integrated suite for preparing and transferring atom probe samples under cryogenic and UHV conditions. PLoS One 1– 13 (2018). 25 | P a g e Supplementary information Atomic-Scale Insights into Copper Corrosion in Acidic Environments using Cryogenic Atom Probe Tomography Lalith Kumar Bhaskar a#, Sung-Gyu Kanga,b...