REVIEW 2 major objections 3 minor 152 references
Reviewed by Pith at T0; open to challenge.
T0 means a machine referee read the full paper against a public rubric. The mark states how deep the mechanical check went, never who wrote it. the ladder, T0–T4 →
T0 review · grok-4.3
GaN provides efficiency advantages only in specific stages of AI data center power conversion.
2026-06-25 19:49 UTC pith:E4GQCD4Y
load-bearing objection This is a review that maps GaN to data center power stages without adding new results. the 2 major comments →
GaN Power Devices and Converter Architectures for AI Data Centers: Efficiency, Reliability, and Deployment Pathways
The pith
A machine-rendered reading of the paper's core claim, the machinery that carries it, and where it could break.
Core claim
The analysis shows that GaN provides a stage-dependent rather than universal advantage. Commercial lateral GaN HEMTs are particularly effective in high-frequency, low-to-mid-voltage stages, while specialized and hybrid devices support bidirectional operation, normally-off control, extreme conversion ratios, and integration. Vertical GaN remains an emerging option for higher-voltage and higher-power conversion. A quantitative framework links cascaded converter efficiency to electrical-loss reduction, cooling demand, annual facility energy use, and operational carbon emissions. Broad deployment further requires low-parasitic packaging, disciplined gate-drive and EMI co-design, mission-profile
What carries the argument
The quantitative framework that links cascaded converter efficiency to reductions in electrical losses, cooling demand, annual facility energy use, and operational carbon emissions.
Load-bearing premise
Converter-relevant metrics such as voltage scalability and switching behavior are sufficient to determine stage suitability and the quantitative framework accurately connects efficiency gains to facility-level energy and carbon reductions without additional mission-profile data.
What would settle it
Direct measurements in an AI data center that show no corresponding reduction in annual energy consumption or carbon emissions from the use of GaN converters in the stages where advantages are claimed.
If this is right
- Lateral GaN HEMTs are effective in high-frequency, low-to-mid-voltage stages.
- Specialized and hybrid GaN devices enable bidirectional operation and extreme conversion ratios.
- Vertical GaN is suited for higher-voltage and higher-power conversion.
- Efficiency gains reduce facility energy use and carbon emissions.
- Deployment requires low-parasitic packaging, gate-drive and EMI co-design, and reliability qualification.
Where Pith is reading between the lines
- The stage-matching logic may apply to power systems in other large-scale computing installations.
- Incorporating real-time workload data could improve the accuracy of the energy and carbon projections.
- Validation through operational data from deployed systems would test the framework's predictions.
- Hybrid approaches combining GaN with other technologies could ease the transition to new architectures.
Editorial analysis
A structured set of objections, weighed in public.
Referee Report
Summary. The manuscript is a review of gallium-nitride (GaN) power devices and converter architectures for AI data centers. It compares Si, SiC, and GaN (lateral HEMTs, vertical, specialized/hybrid) across grid-to-load stages (PFC, isolated DC/DC, 48 V bus, point-of-load) using metrics of voltage scalability, switching behavior, reverse conduction, thermal pathways, gate control, and maturity. The central claim is that GaN advantages are stage-dependent rather than universal, with commercial lateral devices suited to high-frequency low-to-mid voltage stages and other variants enabling bidirectional or extreme-ratio operation. A quantitative framework maps cascaded efficiency gains to facility-level electrical losses, cooling, annual energy use, and carbon emissions. Deployment requirements (packaging, gate-drive/EMI co-design, reliability qualification, manufacturing, supply-chain) are also discussed.
Significance. If the stage-dependent mapping is accepted, the review offers a structured synthesis that could guide device-topology selection in power-hungry AI data centers. The attempt to link converter-level metrics to facility energy and carbon outcomes via a quantitative framework is a constructive element, even at high level. As a literature-based review without new derivations or datasets, its contribution lies in organization and system-level perspective rather than primary data.
major comments (2)
- [Quantitative framework (described in abstract and main text)] The quantitative framework is invoked to connect cascaded converter efficiency to facility energy and carbon reductions, yet the manuscript supplies no equations, parameter definitions, example calculations, or sensitivity analysis. This absence makes the facility-level claims difficult to evaluate and is load-bearing for the broader-impact argument.
- [Device evaluation and architecture sections] Device and architecture comparisons rely on qualitative metric descriptions without data tables, numerical benchmarks drawn from specific converter implementations, or error ranges. This limits the concreteness of the stage-dependent suitability conclusions.
minor comments (3)
- [Abstract] The abstract states comparative conclusions but does not preview any concrete efficiency deltas or example numbers that appear later in the text.
- [Deployment pathways discussion] Terminology such as 'mission-profile reliability qualification' and 'low-parasitic packaging' would benefit from a short parenthetical definition or literature pointer on first use.
- [Conclusion or results synthesis] A summary table listing stage, preferred GaN variant, and key metric advantages would improve readability and reinforce the stage-dependent claim.
Simulated Author's Rebuttal
We thank the referee for the constructive review and recommendation for minor revision. The comments identify opportunities to strengthen the presentation of the quantitative framework and the concreteness of the comparisons. We respond to each major comment below and will revise the manuscript accordingly.
read point-by-point responses
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Referee: [Quantitative framework (described in abstract and main text)] The quantitative framework is invoked to connect cascaded converter efficiency to facility energy and carbon reductions, yet the manuscript supplies no equations, parameter definitions, example calculations, or sensitivity analysis. This absence makes the facility-level claims difficult to evaluate and is load-bearing for the broader-impact argument.
Authors: We agree that the absence of explicit equations and worked examples limits evaluability. Although the manuscript is a review that synthesizes existing literature on cascaded efficiencies rather than deriving new models, we will add a dedicated subsection in the revision. This will include the core mapping equations, parameter definitions (e.g., stage efficiencies, load profiles, utilization factors), a numerical example for a representative AI data-center power chain, and a brief sensitivity discussion on key variables. These additions will be drawn from referenced prior work and will make the facility-level claims transparent. revision: yes
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Referee: [Device evaluation and architecture sections] Device and architecture comparisons rely on qualitative metric descriptions without data tables, numerical benchmarks drawn from specific converter implementations, or error ranges. This limits the concreteness of the stage-dependent suitability conclusions.
Authors: The comparisons synthesize metrics from published datasheets, prototype reports, and reliability studies. To increase concreteness, we will insert summary tables in the revised manuscript that tabulate numerical benchmarks (efficiency, switching loss, voltage rating, power density) from representative converter implementations cited in the text, along with notes on test conditions. Where the source literature reports ranges or uncertainties, these will be indicated. This addition preserves the review character while directly addressing the request for quantitative support. revision: yes
Circularity Check
Review paper with no internal derivations or predictions
full rationale
This document is a review article that surveys existing GaN device literature and converter architectures, comparing standard metrics (voltage scalability, switching behavior, etc.) drawn from prior publications. It contains no equations, no fitted parameters, no new predictions, and no derivation chain that could reduce to its own inputs. The high-level quantitative framework linking cascaded efficiency to facility energy use is presented as a conceptual mapping rather than a self-contained model or fit. All claims rest on external references without self-citation load-bearing or self-definitional steps, rendering the analysis self-contained against external benchmarks.
Axiom & Free-Parameter Ledger
read the original abstract
The growth of artificial-intelligence workloads is increasing the electrical and thermal demands on data-center power-delivery systems, making conversion efficiency, power density, and reliability critical design priorities. This review examines how gallium-nitride (GaN) power devices can be matched to specific stages of the grid-to-load conversion chain, including power-factor correction, isolated DC/DC conversion, 48-V intermediate-bus conversion, and point-of-load regulation. Si, SiC, and GaN are compared using converter-relevant metrics, and lateral, vertical, and specialized GaN architectures are evaluated in terms of voltage scalability, switching behavior, reverse conduction, thermal pathways, gate control, and technology maturity. The analysis shows that GaN provides a stage-dependent rather than universal advantage. Commercial lateral GaN HEMTs are particularly effective in high-frequency, low-to-mid-voltage stages, while specialized and hybrid devices support bidirectional operation, normally-off control, extreme conversion ratios, and integration. Vertical GaN remains an emerging option for higher-voltage and higher-power conversion. A quantitative framework links cascaded converter efficiency to electrical-loss reduction, cooling demand, annual facility energy use, and operational carbon emissions. Broad deployment further requires low-parasitic packaging, disciplined gate-drive and EMI co-design, mission-profile reliability qualification, scalable manufacturing, and supply-chain resilience. GaN is therefore best treated as a stage-specific system lever whose value depends on coordinated device, topology, package, and thermal co-design.
Figures
Reference graph
Works this paper leans on
-
[1]
Power consumption and heat dissipation in ai data centers: A comparative analysis,
K. N. K. C. Sunkara, “Power consumption and heat dissipation in ai data centers: A comparative analysis,” 2025
2025
-
[2]
AI Load Dynamics--A Power Electronics Perspective
Y . Li and Y . Li, “Ai load dynamics–a power electronics perspective,”arXiv preprint arXiv:2502.01647, 2025
work page Pith review arXiv 2025
-
[3]
Prediction of overall energy consumption of data centers in different locations,
Y . Zhang and J. Liu, “Prediction of overall energy consumption of data centers in different locations,” Sensors, vol. 22, no. 10, p. 3704, 2022
2022
-
[4]
Technology and applications of wide bandgap semiconductor materials: current state and future trends,
O. S. Chaudhary, M. Denaï, S. S. Refaat, and G. Pis- sanidis, “Technology and applications of wide bandgap semiconductor materials: current state and future trends,” Energies, vol. 16, no. 18, p. 6689, 2023
2023
-
[5]
Gallium nitride power devices in power electronics applications: State of art and perspectives,
S. Musumeci and V . Barba, “Gallium nitride power devices in power electronics applications: State of art and perspectives,”Energies, vol. 16, no. 9, p. 3894, 2023
2023
-
[6]
Gan-based power devices: Physics, reliability, and perspectives,
M. Meneghini, C. De Santi, I. Abid, M. Buffolo, M. Cioni, R. A. Khadar, L. Nela, N. Zagni, A. Chini, F. Medjdoubet al., “Gan-based power devices: Physics, reliability, and perspectives,”Journal of Applied Physics, vol. 130, no. 18, 2021
2021
-
[7]
Advancements in energy efficient gan power devices and power modules for electric vehicle applications: A review,
R. T. Yadlapalli, A. Kotapati, R. Kandipati, S. R. Balusu, and C. S. Koritala, “Advancements in energy efficient gan power devices and power modules for electric vehicle applications: A review,”International Journal of Energy Research, vol. 45, no. 9, pp. 12 638–12 664, 2021
2021
-
[8]
Technology and reliability of normally-off gan hemts with p-type gate,
M. Meneghini, O. Hilt, J. Wuerfl, and G. Meneghesso, “Technology and reliability of normally-off gan hemts with p-type gate,”Energies, vol. 10, no. 2, p. 153, 2017
2017
-
[9]
Vertical gan mosfet power devices,
C. Langpoklakpam, A.-C. Liu, Y .-K. Hsiao, C.-H. Lin, and H.-C. Kuo, “Vertical gan mosfet power devices,” Micromachines, vol. 14, no. 10, p. 1937, 2023
1937
-
[10]
Vertical gan and vertical ga2o3 power transistors: status and challenges,
C. Gupta and S. S. Pasayat, “Vertical gan and vertical ga2o3 power transistors: status and challenges,”physica status solidi (a), vol. 219, no. 7, p. 2100659, 2022
2022
-
[11]
An optimized vertical gan parallel split gate trench mosfet device structure for improved switching performance,
N. K. Jaiswal and V . Ramakrishnan, “An optimized vertical gan parallel split gate trench mosfet device structure for improved switching performance,”IEEE access, vol. 11, pp. 46 998–47 006, 2023
2023
-
[12]
Experimental evaluation of medium-voltage cascode gallium nitride (gan) devices for bidirectional dc-dc converters,
S. S. Alharbi and M. Matin, “Experimental evaluation of medium-voltage cascode gallium nitride (gan) devices for bidirectional dc-dc converters,”CES Transactions on Electrical Machines and Systems, vol. 5, no. 3, pp. 232–248, 2021
2021
-
[13]
Gan power transistors in converter design techniques,
P. J. Chrzan and P. B. Derkacz, “Gan power transistors in converter design techniques,”Energies, vol. 18, no. 11, p. 2890, 2025
2025
-
[14]
Fundamental research on semiconductor sic and its applications to power electronics,
H. Matsunami, “Fundamental research on semiconductor sic and its applications to power electronics,”Proceed- ings of the Japan Academy, Series B, vol. 96, no. 7, pp. 235–254, 2020
2020
-
[15]
Sic semiconductor devices technology, modeling and simulation,
T. Ayalew, “Sic semiconductor devices technology, modeling and simulation,” Ph.D. dissertation, Technische Universität Wien, 2004
2004
-
[16]
Challenges in sic power mosfet design,
K. Matocha, “Challenges in sic power mosfet design,” Solid-State Electronics, vol. 52, no. 10, pp. 1631–1635, 2008
2008
-
[17]
Applicability analysis of high-voltage transmission and substation equipment based on silicon carbide devices,
H. Zhang, M. Nie, Q. Dong, H. Liu, P. Jia, Z. Li, and Y . Fang, “Applicability analysis of high-voltage transmission and substation equipment based on silicon carbide devices,”Micromachines, vol. 16, no. 11, p. 1192, 2025
2025
-
[18]
New fom- based performance evaluation of 600/650 v sic and gan semiconductors for next-generation ev drives,
D. Cittanti, E. Vico, and I. R. Bojoi, “New fom- based performance evaluation of 600/650 v sic and gan semiconductors for next-generation ev drives,”IEEE Access, vol. 10, pp. 51 693–51 707, 2022
2022
-
[19]
Study on the grinding mechanism of single-crystal gan based on atomic scale and stress field modeling,
H. Dai, T. Song, and H. Du, “Study on the grinding mechanism of single-crystal gan based on atomic scale and stress field modeling,”Materials Science in Semi- conductor Processing, vol. 204, p. 110313, 2026
2026
-
[20]
Power electronics revolutionized: A comprehensive analysis of emerging wide and ultrawide bandgap devices,
S. S. H. Rafin, R. Ahmed, M. A. Haque, M. K. Hossain, M. A. Haque, and O. A. Mohammed, “Power electronics revolutionized: A comprehensive analysis of emerging wide and ultrawide bandgap devices,”Micromachines, vol. 14, no. 11, p. 2045, 2023
2045
-
[21]
Status and prospects of wide bandgap semiconductor devices,
M. Zhang and Y . Zhang, “Status and prospects of wide bandgap semiconductor devices,”Applied and Computational Engineering, vol. 23, pp. 252–262, 2023
2023
-
[22]
Reliability, applications and challenges of gan hemt technology for modern power devices: A review,
N. Islam, M. F. P. Mohamed, M. F. A. J. Khan, S. Falina, H. Kawarada, and M. Syamsul, “Reliability, applications and challenges of gan hemt technology for modern power devices: A review,”Crystals, vol. 12, no. 11, p. 1581, 2022
2022
-
[23]
Review of gan hemt appli- cations in power converters over 500 w,
C.-T. Ma and Z.-H. Gu, “Review of gan hemt appli- cations in power converters over 500 w,”Electronics, vol. 8, no. 12, p. 1401, 2019
2019
-
[24]
A deep dive into sic and gan power devices: Advances and prospects,
J. Shi, “A deep dive into sic and gan power devices: Advances and prospects,”Appl. Comput. Eng, vol. 23, no. 1, pp. 230–237, 2023
2023
-
[25]
Advancing gan power ics: Efficiency, relia- bility & autonomy,
D. Kinzer, “Advancing gan power ics: Efficiency, relia- bility & autonomy,” in2022 24th European Conference on Power Electronics and Applications (EPE’22 ECCE Europe). IEEE, 2022, pp. 1–2
2022
-
[26]
Gallium nitride power devices: a state of the art review,
A. Udabe, I. Baraia-Etxaburu, and D. G. Diez, “Gallium nitride power devices: a state of the art review,”IEEE Access, vol. 11, pp. 48 628–48 650, 2023
2023
-
[27]
Comments: Grabbing the brass ring to power the demand for data centers and generative ai,
P. Boschee, “Comments: Grabbing the brass ring to power the demand for data centers and generative ai,” Journal of Petroleum Technology, vol. 76, no. 05, pp. 8–9, 2024
2024
-
[28]
Enhancing energy efficiency in ai-powered data centers: Challenges and solutions,
S. Shankar, “Enhancing energy efficiency in ai-powered data centers: Challenges and solutions,”Marine Biology Research at Bahamas, p. 93, 2024
2024
-
[29]
Piezotronic effect in a normally off p-gan/algan/gan hemt toward highly sensitive pressure sensor,
H.-Q. Nguyen, T. Nguyen, P. Tanner, T.-K. Nguyen, A. R. M. Foisal, J. Fastier-Wooller, T.-H. Nguyen, H.-P. Phan, N.-T. Nguyen, and D. V . Dao, “Piezotronic effect in a normally off p-gan/algan/gan hemt toward highly sensitive pressure sensor,”Applied Physics Letters, vol. 118, no. 24, 2021
2021
-
[30]
Ridge-channel algan/gan normally- off high-electron mobility transistor based on epitaxial lateral overgrowth,
X. Ji, A. Fariza, J. Zhao, M. Wang, J. Wang, F. Yang, J. Li, and T. Wei, “Ridge-channel algan/gan normally- off high-electron mobility transistor based on epitaxial lateral overgrowth,”Semiconductor Science and Tech- nology, vol. 36, no. 7, p. 075003, 2021
2021
-
[31]
Research on a high-threshold-voltage algan/gan hemt with p-gan cap and recessed gate in combination with graded algan barrier layer: Z. chen et al
Z. Chen, L. Cai, K. Niu, C. Xu, H. Lin, P. Ren, D. Sun, and H. Lin, “Research on a high-threshold-voltage algan/gan hemt with p-gan cap and recessed gate in combination with graded algan barrier layer: Z. chen et al.”Journal of Electronic Materials, vol. 53, no. 5, pp. 2533–2543, 2024
2024
-
[32]
Charging effect by fluorine-treatment and recess gate for enhancement-mode on algan/gan high electron mobility transistors,
S. C. Kang, H.-W. Jung, S.-J. Chang, S. M. Kim, S. K. Lee, B. H. Lee, H. Kim, Y .-S. Noh, S.-H. Lee, S.-I. Kim et al., “Charging effect by fluorine-treatment and recess gate for enhancement-mode on algan/gan high electron mobility transistors,”Nanomaterials, vol. 10, no. 11, p. 2116, 2020
2020
-
[33]
1.3 kv vertical gan-based trench mosfets on 4-inch free standing gan wafer,
W. He, J. Li, Z. Liao, F. Lin, J. Wu, B. Wang, M. Wang, N. Liu, H.-C. Chiu, H.-C. Kuoet al., “1.3 kv vertical gan-based trench mosfets on 4-inch free standing gan wafer,”Nanoscale Research Letters, vol. 17, no. 1, p. 14, 2022
2022
-
[34]
1.7-kv vertical gan pn diode with triple-zone graded junction termination extension formed by ion-implantation,
Y . Duan, J. Wang, A. Xie, Z. Zhu, and P. Fay, “1.7-kv vertical gan pn diode with triple-zone graded junction termination extension formed by ion-implantation,”e- Prime-Advances in Electrical Engineering, Electronics and Energy, vol. 6, p. 100330, 2023
2023
-
[35]
Vertical gan trench-mosfets fabricated on ammonothermally grown bulk gan substrates,
M. Kami ´nski, A. Taube, J. Tarenko, O. Sadowski, E. Brzozowski, J. Wierzbicka, M. Zadura, M. Ekielski, K. Kosiel, J. Jankowska- ´Sliwi´nskaet al., “Vertical gan trench-mosfets fabricated on ammonothermally grown bulk gan substrates,”physica status solidi (a), vol. 221, no. 21, p. 2400077, 2024
2024
-
[36]
Low leakage fully-vertical gan-on-si power mosfets,
Y . Ma, H. Chen, S. Zhang, H. Duan, B. Hu, H. Ma, J. Rao, and C. Liu, “Low leakage fully-vertical gan-on-si power mosfets,”Applied Physics Letters, vol. 127, no. 5, 2025
2025
-
[37]
Review on main gate characteristics of p-type gan gate high-electron-mobility transistors,
Z. Wang, J. Nan, Z. Tian, P. Liu, Y . Wu, and J. Zhang, “Review on main gate characteristics of p-type gan gate high-electron-mobility transistors,”Micromachines, vol. 15, no. 1, p. 80, 2023
2023
-
[38]
Stability, reliability, and robustness of gan power devices: A re- view,
J. P. Kozak, R. Zhang, M. Porter, Q. Song, J. Liu, B. Wang, R. Wang, W. Saito, and Y . Zhang, “Stability, reliability, and robustness of gan power devices: A re- view,”IEEE Transactions on Power Electronics, vol. 38, no. 7, pp. 8442–8471, 2023
2023
-
[39]
Review of isolated dc-dc converters for applications in data center power delivery,
S. Rahman, H. Shehada, and I. A. Khan, “Review of isolated dc-dc converters for applications in data center power delivery,” in2023 IEEE Texas Power and Energy Conference (TPEC). IEEE, 2023, pp. 1–6
2023
-
[40]
Open rack v3 it gear 48v input connector, rev. 1.6,
Open Compute Project, “Open rack v3 it gear 48v input connector, rev. 1.6,” Open Compute Project, Technical Specification Rev. 1.6, Sep. 2022, published 29 September 2022. [Online]. Available: https://bit.ly/40N0xKk
2022
-
[41]
Ocp orv3 power solutions guide,
TE Connectivity, “Ocp orv3 power solutions guide,” TE Connectivity, Technical Guide, May 2023, guide for Open Compute Project Open Rack V3 power solutions (10 pages). [Online]. Available: https://bit.ly/3MWUakE
2023
-
[42]
A novel digital control strategy for gan-based interleaving crm totem- pole pfc,
W. Yu, X. Fan, T. Wei, and Y . Xu, “A novel digital control strategy for gan-based interleaving crm totem- pole pfc,” in2024 IEEE Energy Conversion Congress and Exposition (ECCE). IEEE, 2024, pp. 2831–2836
2024
-
[43]
Gs-evb-btp-3kw-gs evaluation board technical documentation,
Infineon Technologies AG, “Gs-evb-btp-3kw-gs evaluation board technical documentation,” Infineon Technologies AG, Evaluation Board / Technical Manual, 2024, 3 kW High-Efficiency Bridgeless Totem Pole PFC evaluation board (CoolGaN family) and supporting technical manual. [Online]. Available: https://www.infineon.com/evaluation-board/ GS-EVB-BTP-3KW-GS
2024
-
[44]
Wide bandgap power conversion – part 3: Isop llc converter,
A. Pozo, M. de Rooij, and M. Palma, “Wide bandgap power conversion – part 3: Isop llc converter,” Efficient Power Conversion (EPC), Technical Article, Sep. 2025, published 28 September 2025 as part of Bodo’s Power Systems series. [Online]. Available: https://epc-co.com/ epc/portals/0/epc/documents/articles/bp_092025.pdf
2025
-
[45]
Gan based high-density unregulated 48 v to x v llc converters with??? 98% efficiency for future data centers,
M. H. Ahmed, F. C. Lee, Q. Li, M. de Rooij, and D. Reusch, “Gan based high-density unregulated 48 v to x v llc converters with??? 98% efficiency for future data centers,” inPCIM Europe 2019; International Exhi- bition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. VDE, 2019, pp. 1–8
2019
-
[46]
Lego-pol: A 48v-1.5 v 300a merged-two-stage hybrid converter for ultra-high-current microprocessors,
J. Baek, P. Wang, Y . Elasser, Y . Chen, S. Jiang, and M. Chen, “Lego-pol: A 48v-1.5 v 300a merged-two-stage hybrid converter for ultra-high-current microprocessors,” in2020 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE, 2020, pp. 490–497
2020
-
[47]
2024 united states data center energy usage report,
A. Shehabi, A. Newkirk, S. J. Smith, A. Hubbard, N. Lei, M. A. B. Siddik, B. Holecek, J. Koomey, E. Masanet, and D. Sartor, “2024 united states data center energy usage report,” 2024
2024
-
[48]
Uptime institute global data center survey 2024,
Uptime Institute, “Uptime institute global data center survey 2024,” Uptime Institute, Technical Report UII Keynote Report 146M, Jul. 2024, findings highlight resiliency, sustainability, efficiency, staffing, cloud, and AI trends among data center owners and operators. [Online]. Available: https://datacenter.uptimeinstitute.com/rs/711-RIA-145/ images/2024...
2024
-
[49]
Data Center Power Equipment Thermal Guidelines and Best Practices,
ASHRAE Technical Committee 9.9, “Data Center Power Equipment Thermal Guidelines and Best Practices,” ASHRAE, White Paper, Jun. 2016, revised 22 June 2016; thermal guidelines for data center power equipment. [Online]. Available: https://www.ashrae.org/file%20library/technical% 20resources/bookstore/ashrae_tc0909_power_white_ paper_22_june_2016_revised.pdf
2016
-
[50]
Design of a gan totem-pole pfc converter using dc-link voltage control strategy for data center applications,
J.-Y . Lee, J.-H. Chen, and K.-Y . Lo, “Design of a gan totem-pole pfc converter using dc-link voltage control strategy for data center applications,”IEEE Access, vol. 10, pp. 50 278–50 287, 2022
2022
-
[51]
Current status and future trends of gan hemts in electrified transportation,
N. Keshmiri, D. Wang, B. Agrawal, R. Hou, and A. Emadi, “Current status and future trends of gan hemts in electrified transportation,”IEEE access, vol. 8, pp. 70 553–70 571, 2020
2020
-
[52]
Evaluation of gan power transistor switching performance on charac- teristics of bidirectional dc-dc converter,
M. Frivaldsky, J. Morgos, and R. Zelnik, “Evaluation of gan power transistor switching performance on charac- teristics of bidirectional dc-dc converter,”Elektronika ir elektrotechnika, vol. 26, no. 4, pp. 18–24, 2020
2020
-
[53]
Design and comparative analysis of an ultra-highly efficient, compact half-bridge llc resonant gan converter for low-power applications,
M. Faizan, X. Wang, and M. Z. Yousaf, “Design and comparative analysis of an ultra-highly efficient, compact half-bridge llc resonant gan converter for low-power applications,”Electronics, vol. 12, no. 13, p. 2850, 2023
2023
-
[54]
Review and outlook on gan and sic power devices: Industrial state-of-the-art, applications, and perspectives,
M. Buffolo, D. Favero, A. Marcuzzi, C. De Santi, G. Meneghesso, E. Zanoni, and M. Meneghini, “Review and outlook on gan and sic power devices: Industrial state-of-the-art, applications, and perspectives,”IEEE Transactions on Electron Devices, vol. 71, no. 3, pp. 1344–1355, 2024
2024
-
[55]
Wide-bandgap semiconductors: a critical analysis of gan, sic, algan, diamond, and ga2o3 synthesis methods, challenges, and prospective technological innovations,
L. A. Yeboah, A. Abdul Malik, P. A. Oppong, P. S. Acheampong, J. A. Morgan, R. A. A. Addo, B. Williams Henyo, S. T. Taylor, W. M. Zudor, and S. Osei-Amponsah, “Wide-bandgap semiconductors: a critical analysis of gan, sic, algan, diamond, and ga2o3 synthesis methods, challenges, and prospective technological innovations,”Intelligent and Sustainable Manufac...
2025
-
[56]
Optimal design of gan hemt based high efficiency llc converter,
B. Zhang, M. Zhao, P. Huang, and Q. Wang, “Optimal design of gan hemt based high efficiency llc converter,” Energy Reports, vol. 8, pp. 1181–1190, 2022
2022
-
[57]
Thermal management of wide-bandgap power semiconductors: Strategies and challenges in sic and gan power devices,
G. Han, J. Kim, S. Park, and W. Bae, “Thermal management of wide-bandgap power semiconductors: Strategies and challenges in sic and gan power devices,” Electronics, vol. 14, no. 21, p. 4193, 2025
2025
-
[58]
Cascode gan hemt gate driving analysis,
V . Heumesser, J.-S. Lai, H.-C. Hsieh, J. Hsu, C.-Y . Yang, E. Y . Chang, C.-Y . Liu, W.-H. Chieng, and Y .-T. Hsieh, “Cascode gan hemt gate driving analysis,” in 2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia). IEEE, 2023, pp. 1–6
2023
-
[59]
Cmos active gate driver for closed-loop dv/dt control of gan transistors,
P. Bau, M. Cousineau, B. Cougo, F. Richardeau, and N. Rouger, “Cmos active gate driver for closed-loop dv/dt control of gan transistors,”IEEE Transactions on Power Electronics, vol. 35, no. 12, pp. 13 322–13 332, 2020
2020
-
[60]
Gan-based matrix converter design with output filters for motor friendly drive system,
H. Bu and Y . Cho, “Gan-based matrix converter design with output filters for motor friendly drive system,” Energies, vol. 13, no. 4, p. 971, 2020
2020
-
[61]
Design and application of high-efficiency gallium nitride (gan)-based power electronic devices,
C. Lu, “Design and application of high-efficiency gallium nitride (gan)-based power electronic devices,”Applied and Computational Engineering, vol. 153, no. 1, pp. 90–95, 2025
2025
-
[62]
(n.d.) Silicon wafers
UniversityWafer, Inc. (n.d.) Silicon wafers. Accessed: 2026-03-03. [Online]. Available: https: //www.universitywafer.com/silicon_wafers.html
2026
-
[63]
(n.d.) Gallium nitride on silicon epitaxial wafers
——. (n.d.) Gallium nitride on silicon epitaxial wafers. Accessed: 2026-03-03. [On- line]. Available: https://www.universitywafer.com/ gallium-nitride-on-silicon-epitaxy-wafer.html
2026
-
[64]
(n.d.) Rf gan substrate wafers for gan-on-si applications
Okmetic. (n.d.) Rf gan substrate wafers for gan-on-si applications. Accessed: 2026-03-03. [Online]. Available: https://www.okmetic.com/ silicon-wafers/rfsi-wafers-high-resistivity-line-for-rf/ rf-gan-substrate-wafers/
2026
-
[65]
(2025, Jul.) Navitas announces plans for 200mm gan production with psmc
Navitas Semiconductor. (2025, Jul.) Navitas announces plans for 200mm gan production with psmc. Accessed: 2026-03-03. [Online]. Available: https://bit.ly/4bmGOHy
2025
-
[66]
(2025, Sep.) X-fab now offers gan-on-si foundry services
X-FAB Silicon Foundries SE. (2025, Sep.) X-fab now offers gan-on-si foundry services. Accessed: 2026-03-03. [Online]. Available: https://www.xfab.com/news/details/ article/x-fab-now-offers-gan-on-si-foundry-services
2025
-
[67]
(n.d.) Gallium nitride (gan) technology
Infineon Technologies AG. (n.d.) Gallium nitride (gan) technology. Accessed: 2026-03-03. [On- line]. Available: https://www.infineon.com/technology/ gallium-nitride-gan
2026
-
[68]
(2024, Sep.) Infineon pioneers world’s first 300 mm power gallium nitride (gan) technology
——. (2024, Sep.) Infineon pioneers world’s first 300 mm power gallium nitride (gan) technology. Accessed: 2026-03-03. [Online]. Available: https://www.infineon. com/press-release/2024/infxx202409-142
2024
-
[69]
Gs66508t: 650 v enhancement mode gan transistor datasheet, rev. 200402,
GaN Systems Inc., “Gs66508t: 650 v enhancement mode gan transistor datasheet, rev. 200402,” 2020, accessed: 2026-03-03. [Online]. Available: https://www.mouser. com/datasheet/3/70/1/GS66508T-DS-Rev-200402.pdf
2020
-
[70]
Silicon carbide (sic) materials,
Coherent Corp., “Silicon carbide (sic) materials,” Coherent Corp., Datasheet, n.d., accessed: 2026-03-
2026
-
[71]
Available: https://www.coherent.com/ resources/datasheet/materials/sic-materials-ds.pdf
[Online]. Available: https://www.coherent.com/ resources/datasheet/materials/sic-materials-ds.pdf
-
[72]
(2025) Sic raw materials see a price increase while 6-inch substrate kicks off a price war
TrendForce. (2025) Sic raw materials see a price increase while 6-inch substrate kicks off a price war. TrendForce. Accessed: 2026-03-03. [Online]. Available: https://bit.ly/4aNZCzj
2025
-
[73]
(n.d.) Silicon carbide: The facts
Navitas Semiconductor. (n.d.) Silicon carbide: The facts. Navitas Semiconductor. Accessed: 2026- 03-03. [Online]. Available: https://navitassemi.com/ silicon-carbide-the-facts/
2026
-
[74]
(2025) Silicon carbide (sic) wafer market size, share and trend analysis, forecast 2025–2032
Navistrat Analytics. (2025) Silicon carbide (sic) wafer market size, share and trend analysis, forecast 2025–2032. Navistrat Analytics. Report code: NA_01409. Accessed: 2026-03-03. [Online]. Available: https://navistratanalytics.com/report_store/ silicon-carbide-sic-wafer-market/
2025
-
[75]
Development of non-core 4-inch gan substrate,
H. Osada, Y . Yoshizumi, K. Uematsu, S. Minobe, F. Sato, F. Nakanisihi, Y . Yamamoto, Y . Hagi, and Y . Yabuhara, “Development of non-core 4-inch gan substrate,” inProc. Int. Conf. Compound Semiconductor Manufacturing Technology, 2017, pp. 16–4
2017
-
[76]
Bulk gallium nitride (gan) wafers for research and production,
UniversityWafer, Inc., “Bulk gallium nitride (gan) wafers for research and production,” n.d., accessed: 2026-03-03. [Online]. Available: https://www.universitywafer.com/ bulk-gan.html
2026
-
[77]
4 inch research grade 0.4 mm free standing gan wafer for semiconductors,
Sapphire-Substrate.com, “4 inch research grade 0.4 mm free standing gan wafer for semiconductors,” n.d., accessed: 2026-03-03. [Online]. Available: https: //bit.ly/4aQ1MOU
2026
-
[78]
Bulk gan substrate market growing at 10% cagr to $100m in 2022, from 60,000 wafers in 2016,
“Bulk gan substrate market growing at 10% cagr to $100m in 2022, from 60,000 wafers in 2016,”semiconductorTODAY Compounds & Advanced Silicon, vol. 12, no. 2, March/April 2017, market focus: GaN materials. [Online]. Avail- able: https://www.semiconductor-today.com/features/ PDF/semiconductor-today-mar-apr-2017-bulk-gan.pdf
2022
-
[79]
Gallium nitride substrate costs to plummet by 60 percent,
“Gallium nitride substrate costs to plummet by 60 percent,”Compound Semiconductor, Nov. 2012, accessed: 2026-03-03. [Online]. Available: https: //compoundsemiconductor.net/article/90117/Gallium_ nitride_substrate_costs_to_plummet_by_60_percent
2012
-
[80]
Gallium,
U.S. Geological Survey, “Gallium,” U.S. Geological Survey, Tech. Rep., Jan. 2025, in: Mineral Commodity Summaries 2025. [Online]. Available: https://pubs.usgs. gov/periodicals/mcs2025/mcs2025-gallium.pdf
2025
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