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Many-Objective-Optimized Semi-Automated Robotic Disassembly Sequences

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arxiv 2401.01817 v1 pith:5NZSELEJ submitted 2024-01-03 cs.RO

classification cs.RO
keywords disassemblyroboticsemi-automatedalgorithmmaogasequencechromosomesconditions
verification ladder T0 review T1 audit T2 compute T3 formal
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This study tasckles the problem of many-objective sequence optimization for semi-automated robotic disassembly operations. To this end, we employ a many-objective genetic algorithm (MaOGA) algorithm inspired by the Non-dominated Sorting Genetic Algorithm (NSGA)-III, along with robotic-disassembly-oriented constraints and objective functions derived from geometrical and robot simulations using 3-dimensional (3D) geometrical information stored in a 3D Computer-Aided Design (CAD) model of the target product. The MaOGA begins by generating a set of initial chromosomes based on a contact and connection graph (CCG), rather than random chromosomes, to avoid falling into a local minimum and yield repeatable convergence. The optimization imposes constraints on feasibility and stability as well as objective functions regarding difficulty, efficiency, prioritization, and allocability to generate a sequence that satisfies many preferred conditions under mandatory requirements for semi-automated robotic disassembly. The NSGA-III-inspired MaOGA also utilizes non-dominated sorting and niching with reference lines to further encourage steady and stable exploration and uniformly lower the overall evaluation values. Our sequence generation experiments for a complex product (36 parts) demonstrated that the proposed method can consistently produce feasible and stable sequences with a 100% success rate, bringing the multiple preferred conditions closer to the optimal solution required for semi-automated robotic disassembly operations.

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Cited by 1 Pith paper

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  1. Affordance-Guided Dual-Armed Disassembly Teleoperation for Mating Parts

    cs.RO 2025-08 conditional novelty 5.0 of 10

    A dual-arm teleoperation system that overlays grasp and direction guides plus impedance control improves disassembly success and reduces part pose deviation in tests.

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