Airtight metallic sealing at room temperature under small mechanical pressure

Hanchen Huang; Stephen P. Stagon

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Airtight metallic sealing at room temperature under small mechanical pressure

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arxiv 1308.0359 v1 pith:CVVZPLVG submitted 2013-08-01 cond-mat.mes-hall

Stephen P. Stagon , Hanchen Huang This is my paper

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keywords mechanicalmetallicsmallleakorganicpressureprocessrate

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Here, we report a process of metallic sealing using small well-separated Ag nanorods; the process is at room temperature under a small mechanical pressure of 9.0 MPa, and also in ambient. The metallic seals have an air leak rate of 1.1 x 10-3 cm3atm/m2/day, and mechanical shear strength higher than 8.9 MPa. This leak rate meets the requirement of organic solar cells and organic light emitting diodes [1].

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