Pith. sign in

REVIEW

Not yet reviewed by Pith; the record is open.

This paper has not been read by Pith yet. Machine review is queued; the pith claim, tier, and objections will appear here once it completes.

SPECIMEN: schema-true, not a live event

T0 review · schema-true

One-sentence machine reading of the paper's core claim.

pith:XXXXXXXX · record.json · timestamp

arxiv 2104.12084 v1 pith:J4J7LYDP submitted 2021-04-25 physics.optics physics.app-ph

Transverse Ultrafast Laser Inscription in Bulk Silicon

classification physics.optics physics.app-ph
keywords siliconinscriptioninsidemodificationstransversedemonstrateirradiationlaser
verification ladder T0 review T1 audit T2 compute T3 formal T4 reserved
0 comments
read the original abstract

In-volume ultrafast laser direct writing of silicon is generally limited by strong nonlinear propagation effects preventing the initiation of modifications. By employing a triple-optimization procedure in the spectral, temporal and spatial domains, we demonstrate that modifications can be repeatably produced inside silicon. Our approach relies on irradiation at $\approx 2$-$\mu$m wavelength with temporally-distorted femtosecond pulses. These pulses are focused in a way that spherical aberrations of different origins counterbalance, as predicted by point spread function analyses and in good agreement with nonlinear propagation simulations. We also establish the laws governing modification growth on a pulse-to-pulse basis, which allows us to demonstrate transverse inscription inside silicon with various line morphologies depending on the irradiation conditions. We finally show that the production of single-pulse repeatable modifications is a necessary condition for reliable transverse inscription inside silicon.

discussion (0)

Sign in with ORCID, Apple, or X to comment. Anyone can read and Pith papers without signing in.