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Lattice-mismatched semiconductor heterostructures

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arxiv 1812.10225 v1 pith:JMV4DIEN submitted 2018-12-26 physics.app-ph

Lattice-mismatched semiconductor heterostructures

classification physics.app-ph
keywords heterostructuressemiconductorforminglattice-mismatchedapplicationsapproachdemonstrationsdiodes
verification ladder T0 review T1 audit T2 compute T3 formal T4 reserved
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Semiconductor heterostructure is a critical building block for modern semiconductor devices. However, forming semiconductor heterostructures of lattice-mismatch has been a great challenge for several decades. Epitaxial growth is infeasible to form abrupt heterostructures with large lattice-mismatch while mechanical-thermal bonding results in a high density of interface defects and therefore severely limits device applications. Here we show an ultra-thin oxide-interfaced approach for the successful formation of lattice-mismatched semiconductor heterostructures. Following the depiction of a theory on the role of interface oxide in forming the heterostructures, we describe experimental demonstrations of Ge/Si (diamond lattices), Si/GaAs (zinc blende lattice), GaAs/GaN (hexagon lattice), and Si/GaN heterostructures. Extraordinary electrical performances in terms of ideality factor, current on/off ratio, and reverse breakdown voltage are measured from p-n diodes fabricated from the four types of heterostructures, significantly outperforming diodes derived from other methods. Our demonstrations indicate the versatility of the ultra-thin-oxide-interface approach in forming lattice-mismatched heterostructures, open up a much larger possibility for material combinations for heterostructures, and pave the way toward broader applications in electronic and optoelectronic realms.

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  1. Band alignment of grafted diamond/GaN p-n heterojunctions interfaced with ALD Al2O3 and SiNx/Al2O3

    cond-mat.mtrl-sci 2026-05 unverdicted novelty 6.0

    Inserting a SiNx layer between Al2O3 and diamond in grafted diamond/GaN heterostructures increases band offsets by 0.42 eV compared to Al2O3-only interfaces while preserving type-II band alignment.