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Wiring surface loss of a superconducting transmon qubit

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arxiv 2311.16794 v1 pith:YCZLVEMJ submitted 2023-11-28 quant-ph cond-mat.supr-con

classification quant-phcond-mat.supr-con
keywords wiringlossqubitsqubitsuperconductingsurfacetransmoncapacitor
verification ladder T0 review T1 audit T2 compute T3 formal
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Quantum processors using superconducting qubits suffer from dielectric loss leading to noise and dissipation. Qubits are usually designed as large capacitor pads connected to a non-linear Josephson junction (or SQUID) by a superconducting thin metal wiring. Here, we report on finite-element simulation and experimental results confirming that more than 50% of surface loss in transmon qubits can originated from Josephson junctions wiring and can limit qubit relaxation time. Extracting dielectric loss tangents capacitor pads and wiring based on their participation ratios, we show dominant surface loss of wiring can occur for real qubits designs. Then, we simulate a qubit coupled to a bath of individual TLS defects and show that only a small fraction (~18%) of coupled defects is located within the wiring interfaces, however, their coupling strength is much higher due to stronger electromagnetic field. Finally, we fabricate six tunable floating transmon qubits and experimentally demonstrate up to 20% improvement in qubit quality factor by wiring design optimization.

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Cited by 1 Pith paper

Reviewed papers in the Pith corpus that reference this work. Sorted by Pith novelty score. Full citation record

  1. Improving Transmon Qubit Performance with Fluorine-based Surface Treatments

    quant-ph 2025-07 conditional novelty 7.0 of 10

    A pad-etch surface treatment removes germanium residue under Josephson junctions and improves median transmon T1 from 157 to 334 microseconds.

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