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A Deep Learning Approach for Pixel-level Material Classification via Hyperspectral Imaging

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arxiv 2409.13498 v2 pith:AFF3KETL submitted 2024-09-20 eess.IV cs.AIcs.CV

classification eess.IVcs.AIcs.CV
keywords classificationimagingmaterialdeeplearninglimitationsadvancementsapplications
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Recent advancements in computer vision, particularly in detection, segmentation, and classification, have significantly impacted various domains. However, these advancements are tied to RGB-based systems, which are insufficient for applications in industries like waste sorting, pharmaceuticals, and defense, where advanced object characterization beyond shape or color is necessary. Hyperspectral (HS) imaging, capturing both spectral and spatial information, addresses these limitations and offers advantages over conventional technologies such as X-ray fluorescence and Raman spectroscopy, particularly in terms of speed, cost, and safety. This study evaluates the potential of combining HS imaging with deep learning for material characterization. The research involves: i) designing an experimental setup with HS camera, conveyor, and controlled lighting; ii) generating a multi-object dataset of various plastics (HDPE, PET, PP, PS) with semi-automated mask generation and Raman spectroscopy-based labeling; and iii) developing a deep learning model trained on HS images for pixel-level material classification. The model achieved 99.94\% classification accuracy, demonstrating robustness in color, size, and shape invariance, and effectively handling material overlap. Limitations, such as challenges with black objects, are also discussed. Extending computer vision beyond RGB to HS imaging proves feasible, overcoming major limitations of traditional methods and showing strong potential for future applications.

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  1. NeISF++: Neural Incident Stokes Field for Polarized Inverse Rendering of Conductors and Dielectrics

    cs.CV 2024-11 conditional novelty 6.0 of 10

    NeISF++ generalizes the dielectric-only NeISF polarized inverse renderer to conductors by adding a complex-refractive-index Fresnel term and a DoLP-based geometry initialization, improving metal and dielectric reconstruction.

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