Surface conduction and reduced electrical resistivity in ultrathin noncrystalline NbP semimetal

The electrical resistivity of conventional metals, such as copper, is known to increase in thin films due to electron-surface scattering, limiting the performance of metals in nanoscale electronics. Here, we find an unusual reduction of resistivity with decreasing film thickness in niobium phosphide (NbP) semimetal deposited at relatively low temperatures of 400 \deg C. In films thinner than 5 nm, the room temperature resistivity (~34 microohm*cm for 1.5-nm-thick NbP) was up to six times lower than the bulk NbP resistivity, and lower than conventional metals at similar thickness (typically ~100 microohm*cm). Remarkably, the NbP films are not crystalline, but display local nanocrystalline, short-range order within an amorphous matrix. Our analysis suggests that the lower effective resistivity is due to conduction via surface channels, together with high surface carrier density and sufficiently good mobility as the film thickness is reduced. These results and the fundamental insights obtained here could enable ultrathin, low-resistivity wires for nanoelectronics, beyond the limitations of conventional metals.